Abstract: A computer system displays a first object that includes at least a first portion of the first object and a second portion of the first object and detects a first gaze input that meets first criteria, wherein the first criteria require that the first gaze input is directed to the first portion of the first object in order for the first criteria to be met. In response, the computer system displays a first control element that corresponds to a first operation associated with the first object, wherein the first control element was not displayed prior to detecting that the first gaze input met the first criteria, and detects a first user input directed to the first control element. In response to detecting the first user input directed to the first control element, the computer system performs the first operation with respect to the first object.

Abstract: A structural bolt security apparatus includes a security nut forming a threaded central hole for a bolt; the security nut has a groove in an upper surface and/or a side surface. At least one groove is at least partially separated from the threaded central hole by the upper surface. In one embodiment, a security nut has a plurality of electrical contacts, logic electronics configured for monitoring electrical resistance across the electrical contacts, and a transmitter for broadcasting security data generated by the logic electronics. In one embodiment, a structural bolt security apparatus includes a security nut and an outer sleeve. Structural bolt security systems described herein include a security nut, a security socket, and a security wrench. The systems may be equipped with RFID chips for recognition of matched security nuts and security sockets, and/or with GPS transceivers for broadcasting security wrench position information.

Abstract: The invention is directed thermal interfaced die assemblies and 1-component, 96-100% solids, thermosetting, silver-filled thermal interface based on epoxy resins useful for integrated circuit packages enabling conducting heat generated by the die. The adhesive is placed between the die and lid, lid and heat sink and/or die and the heat sink. The interface adhesive composition comprises an inorganic component and an organic component. The inorganic component comprising thermally conductive filler is present at from 70% 85% by weight, and organic component comprises from 60 to 70 wt. % of a diglycidal ether of a bis-phenol compound, 4 to 30 wt. % of an acyclic aliphatic or cycloaliphatic or mononuclear aromatic diglycidal ether, 3 to 30% of a monofunctional epoxy compound, and 20-30% of a polyamine anhydride adduct.

Abstract: The invention is directed thermal interfaced die assemblies and 1-component, 96-100% solids, thermosetting, silver-filled thermal interface based on epoxy resins useful for integrated circuit packages enabling conducting heat generated by the die. The adhesive is placed between the die and lid, lid and heat sink and/or die and the heat sink. The interface adhesive composition comprises an inorganic component and an organic component. The inorganic component comprising thermally conductive filler is present at from 70% 85% by weight, and organic component comprises from 60 to 70 wt. % of a diglycidal ether of a bis-phenol compound, 4 to 30 wt. % of an acyclic aliphatic or cycloaliphatic or mononuclear aromatic diglycidal ether, 3 to 30% of a monofunctional epoxy compound, and 20-30% of a polyamine anhydride adduct.