Abstract: Apparatuses, systems, and techniques to cool computing devices. In at least one embodiment, a system includes a heatsink including one or more connector pins to laterally couple the heatsink to one or more computing devices.

Abstract: Apparatuses, systems, and techniques to cool computer processors. In at least one embodiment, a system comprises one or more processors and a heatsink connected by a flexible heat conduit to the one or more processors, and a position of the heatsink is adjustable.

Abstract: Apparatuses, systems, and techniques to cool computer processors. In at least one embodiment, a system comprises one or more processors and a heatsink connected by a flexible heat conduit to the one or more processors, and a position of the heatsink is adjustable.

Abstract: The present disclosure discloses an expansion bus device that is communicatively coupled to a plurality of input-output devices. The expansion bus device includes a plurality of input-output slots, via which the plurality of input-output devices are coupled to the expansion bus device. The expansion bus device also includes a retimer switch communicatively connected to each of the plurality of input-output slots. The retimer switch supports switching between the plurality of input-output slots.

Abstract: An assembly for liquid cooling is provided herein. The assembly 8 includes a thermal member, a support member, and a gasket. The thermal member includes an array of cooling pins formed of a thermally conductive material to extend from the thermal member. The support member includes an inlet channel and an outlet channel. The inlet channel to provide a fluid to the array of cooling pins. The outlet channel to receive the fluid from the array of cooling pins. The gasket between the thermal member and the support member to form a cooling channel with a fluid tight seal therebetween.

Abstract: An assembly for liquid cooling is provided herein. The assembly 8 includes a thermal member, a support member, and a gasket. The thermal member includes an array of cooling pins formed of a thermally conductive material to extend from the thermal member. The support member includes an inlet channel and an outlet channel. The inlet channel to provide a fluid to the array of cooling pins. The outlet channel to receive the fluid from the array of cooling pins. The gasket between the thermal member and the support member to form a cooling channel with a fluid tight seal therebetween.

Abstract: The present disclosure discloses an expansion bus device that is communicatively coupled to a plurality of input-output devices. The expansion bus device includes a plurality of input-output slots, via which the plurality of input-output devices are coupled to the expansion bus device. The expansion bus device also includes a retimer switch communicatively connected to each of the plurality of input-output slots. The retimer switch supports switching between the plurality of input-output slots.

Abstract: Heat dissipating system and method are disclosed. An example method includes removing heat from a rack component via a thermal transport. The method also includes applying a pressure at a fluid cooled thermal bus bar on a rack system to form a thermally conductive dry disconnect interface and form a heat path between the thermal transport and the fluid cooled thermal bus bar.

Abstract: An assembly for liquid cooling is provided herein. The assembly 8includes a thermal member, a support member, and a gasket. The thermal member includes an array of cooling pins formed of a thermally conductive material to extend from the thermal member. The support member includes an inlet channel and an outlet channel. The inlet channel to provide a fluid to the array of cooling pins. The outlet channel to receive the fluid from the array of cooling pins. The gasket between the thermal member and the support member to form a cooling channel with a fluid tight seal therebetween.

Abstract: An assembly for liquid cooling is provided herein. The assembly includes a thermal member, a support member, and a gasket. The thermal member includes an array of cooling pins formed of a thermally conductive material to extend from the thermal member. The support member includes an inlet channel and an outlet channel. The inlet channel to provide a fluid to the array of cooling pins. The outlet channel to receive the fluid from the array of cooling pins. The gasket between the thermal member and the support member to form a cooling channel with a fluid tight seal therebetween.

Abstract: In one implementation of a modular rack system, a rack module (22, 24, 222, 522, 722, 724) comprises a bay (30, 730) comprising a first side wall (32, 732), a second side wall (32, 732) and floor (36, 736) and an intermediate wall positioning mechanism (280, 380, 390, 392, 790, 792) to support a wall (282, 782) at different spacings with respect to the first side wall (32, 732). In another implementation of the modular rack system, a utility bay (148) extends across rack modules (22, 24, 222, 522, 722, 724).

Abstract: An assembly to connect two electronic components is provided herein. The assembly includes a lever unit with a lever and a base. The lever includes a primary cam member and a secondary cam member connected thereto. The lever also includes a hook member extending therefrom. The base includes a guide structure to engage with a drive pin. Rotation of the lever to move a first electronic component along a y-axis towards, a backplane. The secondary cam member to move the drive pin along the guide structure, and the hook member to engage with a second electronic component and mate the first electronic component and the second electronic component along the second axis.

Abstract: An example of a server rack lifting apparatus can include a first side portion, a second side portion opposing the first side portion, a back portion connecting the first side portion to the second side portion, a first lifting surface associated with the first side portion to engage a portion of a server rack, a second lifting surface associated with the second side portion to engage an opposing portion of the server rack, and a motive component to adjust a height of the first and second lifting surfaces.

Abstract: Examples of the present disclosure may include methods and systems for liquid temperature control cooling.

Abstract: Techniques for routing signals through an optical cable are disclosed herein. The system includes a first electrical switch controlled by a first controller to receive a first electrical signal. The system also includes an optical transmitter controlled by a first controller to receive the first electrical signal and convert it into an optical signal and send it through an optical cable. The system further includes an optical receiver controlled by a second controller to receive the optical signal and convert it into a second electrical signal. The system further includes a second electrical switch controlled by a second controller to send the second electrical signal to a receiving device.

Abstract: An assembly to connect two electronic components is provided herein. The assembly includes a lever unit with a lever and a base. The lever includes a primary cam member and a secondary cam member connected thereto. The lever also includes a hook member extending therefrom. The base includes a guide structure to engage with a drive pin. Rotation of the lever to move a first electronic component along a y-axis towards, a backplane. The secondary cam member to move the drive pin along the guide structure, and the hook member to engage with a second electronic component and mate the first electronic component and the second electronic component along the second axis.

Abstract: An example of a server rack lifting apparatus can include a first side portion, a second side portion opposing the first side portion, a back portion connecting the first side portion to the second side portion, a first lifting surface associated with the first side portion to engage a portion of a server rack, a second lifting surface associated with the second side portion to engage an opposing portion of the server rack, and a motive component to adjust a height of the first and second lifting surfaces.

Abstract: An assembly for liquid cooling is provided herein. The assembly includes a thermal member, a support member, and a gasket. The thermal member includes an array of cooling pins formed of a thermally conductive material to extend from the thermal member. The support member includes an inlet channel and an outlet channel. The inlet channel to provide a fluid to the array of cooling pins. The outlet channel to receive the fluid from the array of cooling pins. The gasket between the thermal member and the support member to form a cooling channel with a fluid tight seal therebetween.

Abstract: Example embodiments relate to providing serial ATA (SATA) initiator addressing and storage device slicing. In example embodiments, an expander device configures an initiator serial attached SCSI (SAS) address to uniquely identify a SATA initiator, where the SATA initiator is associated with a target address of a SATA storage bridge. Further, the STP storage bridge of the expander device is configured to associate the initiator SAS address with a drive slice of an SATA storage device. At this stage, the expander device receives a SATA request from the SATA initiator, where the SATA request comprises a SATA command and a logical block addressing (LBA) address, and after inserting the initiator SAS address into the SATA request, sends an STP connection request to the target address. The expander device may then offset the LBA address based on the initiator SAS address to obtain an offset LBA address of the SATA storage device.

Abstract: In one implementation of a modular rack system, a rack module (22, 24, 222, 522, 722, 724) comprises a bay (30, 730) comprising a first side wall (32, 732), a second side wall (32, 732) and floor (36, 736) and an intermediate wall positioning mechanism (280, 380, 390, 392, 790, 792) to support a wall (282,782) at different spacings with respect to the first side wall (32, 732). In another implementation of the modular rack system, a utility bay (148) extends across rack modules (22, 24, 222, 522, 722, 724).