Abstract: In general, the invention provides high pH cleaning compositions for dielectric surfaces such as PETEOS, SiO2, thermal oxide, silicon nitride, silicon, etc. The compositions of the invention afford superior surface wetting, dispersion of particles and organic residues, and prevents redeposition and re-agglomeration of the dispersed residue during cleaning to afford superior cleaning and low defectivity.

Abstract: The present disclosure relates to removal compositions for at least partially removing post-chemical mechanical polishing (post-CMP) residues from the surface of a microelectronic device. The removal compositions comprise an aqueous base composition and various molybdenum etching inhibitors that reduce the amount of molybdenum removed from the surface of the microelectronic device compared to the aqueous base composition.

Abstract: The invention provides compositions useful in post-CMP cleaning operations where ceria is present. In one aspect, the invention provides a composition comprising a reducing agent; a chelating agent; an amino(C6-C12 alkyl)alcohol; and water; wherein the composition has a pH of less than about 8. The compositions of the invention were found to show improved ceria removal on, for example, poly silicon (poly Si) substrates. Also provided is a method for cleaning a microelectronic device substrate using such compositions and a kit comprising, in one or more containers, selected components of the compositions.

Abstract: The invention provides compositions useful in post-CMP cleaning operations, particularly those substrates which contain exposed copper surfaces. The compositions of the invention provide excellent cleaning of such substrates while showing fewer defects from silica and organic materials present at the surface of the substrate. Also provided is a method for cleaning a microelectronic device substrate using such compositions and a kit comprising, in two or more containers, the components of the compositions.

Abstract: Provided are compositions and methods useful in the post-CMP cleaning of microelectronic devices, in particular, devices which contain one or more surfaces comprising hydrophobic carbon or SiC. In general, the compositions comprise a chelating agent; a water-miscible solvent; a reducing agent; and a pH adjustor, wherein the composition has a pH of about 2 to about 13.

Abstract: An etchant composition and method for etching molybdenum from a microelectronic device at an etch rate are described. A microelectronic device is contacted with an etchant composition for a time sufficient to at least partially remove the molybdenum. The etchant composition comprises at least one oxidizing agent, at least one oxidizing agent stabilizer, and at least one base and has a pH of from 7.5 to 13. The etchant composition selectively removes molybdenum at an etch rate of 5-200 ?/min.

Abstract: An etchant composition and method for etching molybdenum from a microelectronic device at an etch rate are described. A microelectronic device is contacted with an etchant composition for a time sufficient to at least partially remove the molybdenum. The etchant composition comprises at least one oxidizing agent, at least one oxidizing agent stabilizer, and at least one base and has a pH of from 7.5 to 13. The etchant composition selectively removes molybdenum at an etch rate of 5-200 ?/min.

Abstract: Provided are compositions useful for the cleaning of microelectronic device structures. The residues may include post-CMP, post-etch, post-ash residues, pad and brush debris, metal and metal oxide particles and precipitated metal organic complexes such as copper-benzotriazole complexes. Advantageously, the compositions as described herein show improved aluminum, cobalt, and copper compatibility.

Abstract: A composition for cleaning a microelectronic device substrate is provided. The composition is useful for cleaning in-process microelectronic device substrates possessing exposed cobalt, molybdenum, copper, molybdenum, tungsten, and dielectric surfaces. Also provided is a method for cleaning such devices and a kit comprising one or more of the components of the composition.

Abstract: In general, the invention provides high pH cleaning compositions for dielectric surfaces such as PETEOS, SiO2, thermal oxide, silicon nitride, silicon, etc. The compositions of the invention afford superior surface wetting, dispersion of particles and organic residues, and prevents redeposition and re-agglomeration of the dispersed residue during cleaning to afford superior cleaning and low defectivity.

Abstract: An etchant composition and method for etching molybdenum from a microelectronic device at an etch rate are described. A microelectronic device is contacted with an etchant composition for a time sufficient to at least partially remove the molybdenum. The etchant composition comprises at least one oxidizing agent, at least one oxidizing agent stabilizer, and at least one base and has a pH of from 7.5 to 13. The etchant composition selectively removes molybdenum at an etch rate of 5-200 ?/min.

Abstract: A wagering game having a primary game and a secondary game. In one embodiment, an intermediate game outcome for the primary game is first determined. The intermediate game outcome provides the player with an indication of the probability of receiving a winning primary game outcome. The player may then use this indication for determining whether to play the secondary game. The optional secondary game, if won, modifies the play of the primary game to the advantage of the player. Consequently, the intermediate game outcome is resolved to determine the primary game outcome in accordance with the modified primary game. If the secondary game outcome is lost, the immediate game outcome is resolved to determine the primary game outcome without modifying the primary game.

Abstract: The present invention provides a chemical-mechanical polishing (CMP) composition suitable for polishing semiconductor materials. The composition has a pH of about 5 or less and comprises colloidal silica, at least one onium compound selected from the group consisting of a phosphonium salt, a sulfonium salt, and a combination thereof, and an aqueous carrier therefor; A CMP method for polishing a surface of a semiconductor material utilizing the composition is also disclosed.

Abstract: A wagering game that forms an array of indicia that contains multiple individual games that are played serially. The game array is built by a series of primary games. Primary games are those games that are played serially—the game outcome for one primary game is determined before the subsequent primary game begins. Secondary games are progressively formed through the sequential completion of the primary games—the secondary games are formed from indicia contributed by a plurality of primary games.

Abstract: A wagering game having a primary game and a secondary game. In one embodiment, an intermediate game outcome for the primary game is first determined. The intermediate game outcome provides the player with an indication of the probability of receiving a winning primary game outcome. The player may then use this indication for determining whether to play the secondary game. The optional secondary game, if won, modifies the play of the primary game to the advantage of the player. Consequently, the intermediate game outcome is resolved to determine the primary game outcome in accordance with the modified primary game. If the secondary game outcome is lost, the immediate game outcome is resolved to determine the primary game outcome without modifying the primary game.

Abstract: In contrast to slot-type gaming machines with their preset paylines designating predetermined array positions, the paylines of this novel wagering game are unknown until the indicia in the array have been selected. The indicia are selected from a variety of indicium types, each having a different number of members for identifying adjacent indicia. The randomly selected indicia determine the paylines, if any, in the array. Conditions may be imposed that limit the size and geometry of the paylines in this wagering game.

Abstract: The player makes a wager to receive a plurality of primary game arrays. Winning primary game outcomes occur when specific primary game array positions, designated by paylines, are randomly assigned winning combinations of indicia. The winning game outcomes of a plurality of primary game arrays are converted to symbols corresponding to the winning primary game outcomes to form a secondary game array. Winning secondary game outcomes occur when winning combinations of symbols occur on the secondary game array paylines.

Abstract: A wagering game having a primary game and a secondary game. In one embodiment, an intermediate game outcome for the primary game is first determined. The intermediate game outcome provides the player with an indication of the probability of receiving a winning primary game outcome. The player may then use this indication for determining whether to play the secondary game. The optional secondary game, if won, modifies the play of the primary game to the advantage of the player. Consequently, the intermediate game outcome is resolved to determine the primary game outcome in accordance with the modified primary game. If the secondary game outcome is lost, the immediate game outcome is resolved to determine the primary game outcome without modifying the primary game.

Abstract: In contrast to slot-type gaming machines with their preset paylines designating predetermined array positions, the paylines of this novel wagering game are unknown until the indicia in the array have been selected. The indicia are selected from a variety of indicium types, each having a different number of members for identifying adjacent indicia. The randomly selected indicia determine the paylines, if any, in the array. Conditions may be imposed that limit the size and geometry of the paylines in this wagering game.