Patents by Inventor Michael Lee Dawson

Michael Lee Dawson has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Ex-situ manufacture of metal micro-wires and FIB placement in IC circuits
    Patent number: 11967569
    Abstract: A method includes attaching a first portion of a preformed metal micro-wire to a multilayer structure. The preformed metal micro-wire has a diameter of 10 microns or less. The method also includes attaching a second portion of the preformed metal micro-wire to the multilayer structure.
    Type: Grant
    Filed: December 17, 2021
    Date of Patent: April 23, 2024
    Assignee: Texas Instruments Incorporated
    Inventors: Michael Lee Dawson, Edward J. Pryor, III, Jeffrey L. Large, Mary Coles
  • EX-SITU MANUFACTURE OF METAL MICRO-WIRES AND FIB PLACEMENT IN IC CIRCUITS
    Publication number: 20220108960
    Abstract: A method includes attaching a first portion of a preformed metal micro-wire to a multilayer structure. The preformed metal micro-wire has a diameter of 10 microns or less. The method also includes attaching a second portion of the preformed metal micro-wire to the multilayer structure.
    Type: Application
    Filed: December 17, 2021
    Publication date: April 7, 2022
    Inventors: Michael Lee Dawson, Edward J. Pryor, Jeffrey L. Large, Mary Coles
  • Ex-situ manufacture of metal micro-wires and FIB placement in IC circuits
    Patent number: 11233017
    Abstract: An integrated circuit package includes a first conductive element that is fabricated as part of the integrated circuit package and a micro-wire having a first end coupled to the first conductive element. The micro-wire has been fabricated ex-situ and is of a metal having a diameter of 10 microns or less.
    Type: Grant
    Filed: October 3, 2019
    Date of Patent: January 25, 2022
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Michael Lee Dawson, Edward J. Pryor, III, Jeffrey L. Large, Mary Coles
  • EX-SITU MANUFACTURE OF METAL MICRO-WIRES AND FIB PLACEMENT IN IC CIRCUITS
    Publication number: 20210104474
    Abstract: An integrated circuit package includes a first conductive element that is fabricated as part of the integrated circuit package and a micro-wire having a first end coupled to the first conductive element. The micro-wire has been fabricated ex-situ and is of a metal having a diameter of 10 microns or less.
    Type: Application
    Filed: October 3, 2019
    Publication date: April 8, 2021
    Inventors: Michael Lee Dawson, Edward J. Pryor, III, Jeffrey L. Large, Mary Coles
  • Framing template
    Patent number: D455085
    Type: Grant
    Filed: February 28, 2000
    Date of Patent: April 2, 2002
    Inventor: Michael Lee Dawson