Patents by Inventor Michael Leidner
Michael Leidner has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20230155310Abstract: A method for treating an electrically conductive contact element includes applying a lubricant to at least a partial region of a contact surface of the electrically conductive contact element. The contact surface is metallic. The contact surface is changed by plasma treatment to produce a coating of a solid lubricant on the partial region of the contact surface.Type: ApplicationFiled: November 18, 2022Publication date: May 18, 2023Applicant: TE Connectivity Germany GmbHInventors: Felix Greiner, Stefan Thoss, Michael Leidner, Frank Ostendorf, Helge Schmidt, Esteban Sanchez, Stefan Job
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Patent number: 11239593Abstract: An electrically conductive contact element for an electrical connector comprises a contact surface having a plurality of caverns arranged under the contact surface in a microstructure and an auxiliary material filled in the plurality of caverns.Type: GrantFiled: February 8, 2019Date of Patent: February 1, 2022Assignees: TE Connectivity Germany GmbH, Steinbeiss-ForschungszentrumInventors: Michael Leidner, Frank Mucklich, Leander Reinert, Herr Kim Eric Trinh Quoc, Helge Schmidt, Stefan Thoss
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Patent number: 10958006Abstract: A contact element comprises an electrically conductive layer and a masking layer. A contact side of the contact element is at least partly covered by the masking layer and the electrically conductive layer. The electrically conductive layer and the masking layer form a contact surface having alternating regions of the masking layer and the electrically conductive layer.Type: GrantFiled: November 29, 2018Date of Patent: March 23, 2021Assignee: TE Connectivity Germany GmbHInventors: Michael Leidner, Helge Schmidt, Stefan Thoss
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Patent number: 10862259Abstract: The invention relates to a method for producing at least one functional region on an electrical contact element such as, for example, a switching contact or a plug type contact. In order to prevent the high environmental burden which is disadvantageous in wet-chemical methods and to overcome the restriction to a very small number of materials caused in hot dip methods in physical technical terms, and to substantially improve the spatial possibility for selection and structuring which is insufficient in both techniques, there is provision according to the invention for at least one material coating to be applied mechanically in a highly selective manner to the contact element in the functional region and subsequently highly energetic thermal radiation such as, for example, a particle beam in the form of an ion and/or electron beam, to be directed onto the at least on material coating.Type: GrantFiled: May 12, 2017Date of Patent: December 8, 2020Assignee: TE CONNECTIVITY GERMANY GMBHInventors: Helge Schmidt, Michael Leidner, Soenke Sachs
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Publication number: 20190173214Abstract: An electrically conductive contact element for an electrical connector comprises a contact surface having a plurality of caverns arranged under the contact surface in a microstructure and an auxiliary material filled in the plurality of caverns.Type: ApplicationFiled: February 8, 2019Publication date: June 6, 2019Applicants: TE Connectivity Germany GmbH, Steinbeiss-ForschungszentrumInventors: Michael Leidner, Frank Mucklich, Leander Reinert, Herr Kim Eric Trinh Quoc, Helge Schmidt, Stefan Thoss
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Publication number: 20190097342Abstract: A contact element comprises an electrically conductive layer and a masking layer. A contact side of the contact element is at least partly covered by the masking layer and the electrically conductive layer. The electrically conductive layer and the masking layer form a contact surface having alternating regions of the masking layer and the electrically conductive layer.Type: ApplicationFiled: November 29, 2018Publication date: March 28, 2019Applicant: TE Connectivity Germany GmbHInventors: Michael Leidner, Helge Schmidt, Stefan Thoss
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Patent number: 10154595Abstract: A method of manufacturing an electrical component includes providing an electrically insulating substrate having an outer surface, applying a coated structure on the outer surface and irradiating the coated structure with an electron beam to form an electrical conductor on the substrate. The irradiating may include heating the coating layer to melt the coating layer to form the electrical conductor. The coating layer may have a low binder concentration and a high metal concentration. The irradiating may include vaporizing substantially all the binder leaving a substantially pure metallic layer to form the electrical conductor. The coating layer may be irradiated until non-metallic material of the coating layer is completely removed.Type: GrantFiled: May 13, 2015Date of Patent: December 11, 2018Assignees: TE CONNECTIVITY CORPORATION, TE CONNECTIVITY GERMANY GMBHInventors: Soenke Sachs, Helge Schmidt, Michael Leidner, Eva Henschel, Dominique Freckmann, Marjorie Myers
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Publication number: 20170326841Abstract: Electronic components and processes of producing electronic components are disclosed. The electronic component includes a substrate and a thermal grain modified layer positioned on the substrate. The thermal grain modified layer includes a modified grain structure. The modified grain structure includes a thermal grain modification additive. A method for forming the electronic component is also disclosed.Type: ApplicationFiled: July 28, 2017Publication date: November 16, 2017Applicants: TE Connectivity Corporation, TE Connectivity Germany GmbHInventors: Lavanya Bharadwaj, Barry C. Mathews, Dominique Freckmann, Shallu Soneja, Michael A. Oar, Gokce Gulsoy, Helge Schmidt, Michael Leidner, Soenke Sachs
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Patent number: 9758858Abstract: A method of manufacturing a coated structure on a substrate includes positioning a substrate in a vapor deposition chamber having a crucible with source material. The method includes evaporating the source material with electron beams from an irradiation source, the evaporated source material being deposited on the substrate as a coating layer. The method includes ablating the coating layer with the electron beams to selectively remove portions of the coating layer leaving a circuit structure on the substrate. The evaporating and ablating are accomplished in situ within the vapor deposition chamber using the same irradiation source.Type: GrantFiled: March 15, 2013Date of Patent: September 12, 2017Assignees: TYCO ELECTRONICS CORPORATION, TE CONNECTIVITY GERMANY GMBHInventors: Soenke Sachs, Helge Schmidt, Michael Leidner, Eva Henschel, Dominique Freckmann, Marjorie Myers
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Publication number: 20170250513Abstract: The invention relates to a method for producing at least one functional region on an electrical contact element such as, for example, a switching contact or a plug type contact. In order to prevent the high environmental burden which is disadvantageous in wet-chemical methods and to overcome the restriction to a very small number of materials caused in hot dip methods in physical technical terms, and to substantially improve the spatial possibility for selection and structuring which is insufficient in both techniques, there is provision according to the invention for at least one material coating to be applied mechanically in a highly selective manner to the contact element in the functional region and subsequently highly energetic thermal radiation such as, for example, a particle beam in the form of an ion and/or electron beam, to be directed onto the at least on material coating.Type: ApplicationFiled: May 12, 2017Publication date: August 31, 2017Applicant: TE CONNECTIVITY GERMANY GMBHInventors: Helge SCHMIDT, Michael LEIDNER, Soenke SACHS
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Patent number: 9667015Abstract: The invention relates to a method for producing at least one functional region (1) on an electrical contact element (30) such as, for example, a switching contact or a plug type contact. The at least one functional region (1), for example, a contact location or a connection region for crimping or soldering connections is limited to a partial area of the contact element.Type: GrantFiled: April 2, 2012Date of Patent: May 30, 2017Assignee: TE Connectivity Germany GmbHInventors: Helge Schmidt, Michael Leidner, Soenke Sachs
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Publication number: 20170100916Abstract: Electronic components and processes of producing electronic components are disclosed. The electronic component includes a substrate and a thermal grain modified layer positioned on the substrate. The thermal grain modified layer includes a modified grain structure. The modified grain structure includes a thermal grain modification additive. A method for forming the electronic component is also disclosed.Type: ApplicationFiled: October 12, 2015Publication date: April 13, 2017Applicants: Tyco Electronics Corporation, TE Connectivity Germany GmbHInventors: Lavanya Bharadwaj, Barry C. Mathews, Dominique Freckmann, Shallu Soneja, Michael A. Oar, Gokce Gulsoy, Helge Schmidt, Michael Leidner, Soenke Sachs
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Patent number: 9543679Abstract: An electrical contact assembly includes a first electrical contact having a first mating element, and a second electrical contact having a second mating element. The first and second electrical contacts being configured to mate together at the first and second mating elements such that the first and second mating elements engage each other at a contact interface. A distribution of contact pressure across the contact interface at least partially coincides with a distribution of electrical current flow across the contact interface.Type: GrantFiled: March 15, 2013Date of Patent: January 10, 2017Assignees: TYCO ELECTRONICS CORPORATION, TE CONNECTIVITY GERMANY GMBHInventors: Helge Schmidt, Michael Leidner, Marjorie Myers
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Publication number: 20150319865Abstract: A method of manufacturing an electrical component includes providing an electrically insulating substrate having an outer surface, applying a coated structure on the outer surface and irradiating the coated structure with an electron beam to form an electrical conductor on the substrate. The irradiating may include heating the coating layer to melt the coating layer to form the electrical conductor. The coating layer may have a low binder concentration and a high metal concentration. The irradiating may include vaporizing substantially all the binder leaving a substantially pure metallic layer to form the electrical conductor. The coating layer may be irradiated until non-metallic material of the coating layer is completely removed.Type: ApplicationFiled: May 13, 2015Publication date: November 5, 2015Inventors: Soenke Sachs, Helge Schmidt, Michael Leidner, Eva Henschel, Dominique Freckmann, Marjorie Myers
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Publication number: 20150126026Abstract: A method of manufacturing an electrical component includes providing a substrate, applying an insulating layer on the substrate, applying a circuit layer on the insulating layer, irradiating the insulating layer with an electron beam to transform the insulating layer, and irradiating the circuit layer with an electron beam to transform the circuit layer. The substrate may be a metallic substrate that is highly thermally conductive. The insulating layer provides electrical isolation and effective heat transfer between the circuit layer and the substrate. The method may include coupling a light emitting diode module or other active circuits requiring thermal management to the circuit layer resident on the electrically insulating/thermally conducting layer.Type: ApplicationFiled: January 5, 2015Publication date: May 7, 2015Inventors: Soenke Sachs, Helge Schmidt, Michael Leidner, Eva Henschel, Dominique Freckmann, Marjorie Myers
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Publication number: 20140097002Abstract: A method of manufacturing an electrical component includes providing an electrically insulating substrate having an outer surface, applying a coated structure on the outer surface and irradiating the coated structure with an electron beam to form an electrical conductor on the substrate. The irradiating may include heating the coating layer to melt the coating layer to form the electrical conductor. The coating layer may have a low binder concentration and a high metal concentration. The irradiating may include vaporizing substantially all the binder leaving a substantially pure metallic layer to form the electrical conductor. The coating layer may be irradiated until non-metallic material of the coating layer is completely removed.Type: ApplicationFiled: March 15, 2013Publication date: April 10, 2014Applicants: Tyco Electronics AMP GmbH, Tyco Electronics CorporationInventors: Soenke Sachs, Helge Schmidt, Michael Leidner, Eva Henschel, Dominique Freckmann, Marjorie Myers
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Publication number: 20140097003Abstract: A method of manufacturing an electrical component includes providing a substrate, applying an insulating layer on the substrate, applying a circuit layer on the insulating layer, irradiating the insulating layer with an electron beam to transform the insulating layer, and irradiating the circuit layer with an electron beam to transform the circuit layer. The substrate may be a metallic substrate that is highly thermally conductive. The insulating layer provides electrical isolation and effective heat transfer between the circuit layer and the substrate. The method may include coupling a light emitting diode module or other active circuits requiring thermal management to the circuit layer resident on the electrically insulating/thermally conducting layer.Type: ApplicationFiled: March 15, 2013Publication date: April 10, 2014Applicants: TYCO ELECTRONICS AMP GMBH, TYCO ELECTRONICS CORPORATIONInventors: SOENKE SACHS, HELGE SCHMIDT, MICHAEL LEIDNER, EVA HENSCHEL, DOMINIQUE FRECKMANN, MARJORIE MYERS
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Publication number: 20140099450Abstract: A method of manufacturing a coated structure on a substrate includes positioning a substrate in a vapor deposition chamber having a crucible with source material. The method includes evaporating the source material with electron beams from an irradiation source, the evaporated source material being deposited on the substrate as a coating layer. The method includes ablating the coating layer with the electron beams to selectively remove portions of the coating layer leaving a circuit structure on the substrate. The evaporating and ablating are accomplished in situ within the vapor deposition chamber using the same irradiation source.Type: ApplicationFiled: March 15, 2013Publication date: April 10, 2014Applicants: Tyco Electronics AMP GmbH, Tyco Electronics CorporationInventors: Soenke Sachs, Helge Schmidt, Michael Leidner, Eva Henschel, Dominique Freckmann, Marjorie Myers
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Publication number: 20140099803Abstract: An electrical contact assembly includes a first electrical contact having a first mating element, and a second electrical contact having a second mating element. The first and second electrical contacts being configured to mate together at the first and second mating elements such that the first and second mating elements engage each other at a contact interface. A distribution of contact pressure across the contact interface at least partially coincides with a distribution of electrical current flow across the contact interface.Type: ApplicationFiled: March 15, 2013Publication date: April 10, 2014Applicant: Tyco Electronics CorporationInventors: Helge Schmidt, Michael Leidner, Marjorie Myers
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Publication number: 20140017393Abstract: The invention relates to a method for producing at least one functional region (1) on an electrical contact element (30) such as, for example, a switching contact or a plug type contact. The at least one functional region (1), for example, a contact location or a connection region for crimping or soldering connections is limited to a partial area of the contact element.Type: ApplicationFiled: April 2, 2012Publication date: January 16, 2014Applicant: TYCO ELECTRONICS AMP GMBHInventors: Helge Schmidt, Michael Leidner, Soenke Sachs