Patents by Inventor Michael M. Ghadaksaz

Michael M. Ghadaksaz has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7986647
    Abstract: A portable wireless signal repeater module having embedded integrated patch antennas is installed on a window of a house or office or the interior surface of a vehicle's windshield. The module has two sets of embedded patch antennas, which, when mounted on a window, one set faces outdoors and another face indoors. Signals from nearby cellular service provider's transmitters are received by embedded patch antennas facing outdoors, filtered, amplified, and through a duplexer, passed on to the embedded patch antennas facing indoors for propagation within the indoor environment. Signals from handsets indoors are received by embedded patch antennas of the repeater module facing indoors, filtered, amplified, and through a duplexer, passed on to the embedded antennas facing outdoors for propagation toward nearby cellular service provider's receiver.
    Type: Grant
    Filed: September 29, 2007
    Date of Patent: July 26, 2011
    Assignee: iCover Wireless, Inc.
    Inventor: Michael M. Ghadaksaz
  • Patent number: 7982480
    Abstract: A calibrated passive impedance probe has a wide bandwidth operating range for impedance and performance measurements of RF and microwave components, devices, and circuits in 50? and 75? environments. The probe is calibrated at the probe tip, thus allowing accurate impedance and performance measurements of in-circuit functions and on-board components. The calibrated probe can be used to eliminate RF connectors and provide input and output connections to a circuit board for prototype design and quick performance verification thus realizing cost savings on RF connectors.
    Type: Grant
    Filed: August 1, 2008
    Date of Patent: July 19, 2011
    Assignee: AES Technologies, Inc.
    Inventor: Michael M. Ghadaksaz
  • Patent number: 7982477
    Abstract: A universal test fixture for testing and characterization of high-power flange-packaged RF and microwave transistors and diodes includes a precision-machined heat sink having a built-in center cavity with a finger catch on either side of the cavity which uses a plurality of matching modules that are installed in the center cavity and designed as transistor or diode carrier modules to provide mounting for the high-power packaged RF and microwave devices in a wide variety of flange type packages, an adjustable clamping structure connected to a movable arm, and a plurality of non-conductive high temperature pressure clamps. Each carrier module is made of a gold-plated rectangular aluminum block having a center cavity that is machined to the package outline. A non-conductive black-anodized high-temperature resistant pressure clamp machined to the package outline holds the packaged device in the carrier module.
    Type: Grant
    Filed: August 1, 2008
    Date of Patent: July 19, 2011
    Assignee: AES Technologies, Inc.
    Inventor: Michael M. Ghadaksaz
  • Publication number: 20110102007
    Abstract: A calibrated passive impedance probe has a wide bandwidth operating range for impedance and performance measurements of RF and microwave components, devices, and circuits in 50? and 75? environments. The probe is calibrated at the probe tip, thus allowing accurate impedance and performance measurements of in-circuit functions and on-board components. The calibrated probe can be used to eliminate RF connectors and provide input and output connections to a circuit board for prototype design and quick performance verification thus realizing cost savings on RF connectors.
    Type: Application
    Filed: August 1, 2008
    Publication date: May 5, 2011
    Inventor: Michael M. Ghadaksaz
  • Publication number: 20110080188
    Abstract: A universal test fixture for testing and characterization of high-power flange-packaged RF and microwave transistors and diodes includes a precision-machined heat sink having a built-in center cavity with a finger catch on either side of the cavity which uses a plurality of matching modules that are installed in the center cavity and designed as transistor or diode carrier modules to provide mounting for the high-power packaged RF and microwave devices in a wide variety of flange type packages, an adjustable clamping structure connected to a movable arm, and a plurality of non-conductive high temperature pressure clamps. Each carrier module is made of a gold-plated rectangular aluminum block having a center cavity that is machined to the package outline. A non-conductive black-anodized high-temperature resistant pressure clamp machined to the package outline holds the packaged device in the carrier module.
    Type: Application
    Filed: August 1, 2008
    Publication date: April 7, 2011
    Inventor: Michael M. Ghadaksaz
  • Publication number: 20090086655
    Abstract: A portable wireless signal repeater module having embedded integrated patch antennas is installed on a window of a house or office or the interior surface of a vehicle's windshield. The module has two sets of embedded patch antennas, which, when mounted on a window, one set faces outdoors and another face indoors. Signals from nearby cellular service provider's transmitters are received by embedded patch antennas facing outdoors, filtered, amplified, and through a duplexer, passed on to the embedded patch antennas facing indoors for propagation within the indoor environment. Signals from handsets indoors are received by embedded patch antennas of the repeater module facing indoors, filtered, amplified, and through a duplexer, passed on to the embedded antennas facing outdoors for propagation toward nearby cellular service provider's receiver.
    Type: Application
    Filed: September 29, 2007
    Publication date: April 2, 2009
    Inventor: Michael M. Ghadaksaz