Abstract: A cabinet comprising a first baffle disposed so that a device may be mounted in the cabinet below the first baffle. The first baffle further disposed so as to prevent air in a front of the cabinet below the first baffle from mixing with air above the first baffle. A second baffle is disposed so as to prevent air in the first side of the cabinet below the second baffle from mixing with air in the first side of the cabinet above the second baffle. A third baffle is disposed so as to prevent air in the first side of the cabinet in front of the third baffle from mixing with air in a rear of the cabinet. A fourth baffle is disposed so as to prevent air below the device and toward a front of the fourth baffle from mixing with air in a rear of the cabinet.

Abstract: An electronic equipment cabinet is provided, which includes an upper portion, a lower portion and a support configured to receive electronic equipment. The bottom portion defines a base plenum configured to receive a low temperature gas and communicates with a gas flow distribution pathway, which includes a first plenum communicating with the base plenum and configured to direct the low temperature gas to the support. The gas flow distribution pathway further includes a second plenum configured to receive a high temperature gas flow from the support and direct the high temperature gas flow to the top portion. The top portion includes at least one fan configured to direct the high temperature gas flow from the gas flow distribution pathway. A temperature sensor senses the temperature of the high temperature gas flow and communicates with a control module to control the first plenum and the at least one fan for regulating temperature.

Abstract: An electronic equipment cabinet is provided, which includes an upper portion, a lower portion and a support configured to receive electronic equipment. The bottom portion defines a base plenum configured to receive a low temperature gas and communicates with a gas flow distribution pathway, which includes a first plenum communicating with the base plenum and configured to direct the low temperature gas to the support. The gas flow distribution pathway further includes a second plenum configured to receive a high temperature gas flow from the support and direct the high temperature gas flow to the top portion. The top portion includes at least one fan configured to direct the high temperature gas flow from the gas flow distribution pathway. A temperature sensor senses the temperature of the high temperature gas flow and communicates with a control module to control the first plenum and the at least one fan for regulating temperature.