Abstract: A range limiter to secure or position a adjustable height, foldable table at a particular height. A two-way spring-loaded plunger is positioned at the end of a leg for engagement with a stop component. The stop component is affixed to the bottom of the table top. When the leg is in a storage position, the plunger is pushed outward preventing the table leg from opening too far. The two springs have different forces or strengths associated with them. An extension section of the leg pushes against a heavy spring when the table is collapsed, thereby pushing the plunger outward. A light spring keeps the plunger withdrawn when the leg is extended.

Abstract: A method for preparing diresorcinol sulfide includes reacting sulfur with resorcinol, wherein the sulfur is S8. Another method for preparing diresorcinol sulfide includes reacting sulfur with resorcinol, in the presence of an alkali or acidic catalyst. A further method for preparing diresorcinol sulfide includes reacting sulfur with resorcinol, at a temperature of from about 150° C. to about 200° C. to form a reaction mixture, wherein the sulfur is S8; and heating the reaction mixture to a temperature of from about 205° C. to 250° C. A particular method for preparing diresorcinol sulfide includes reacting S8 with resorcinol, in the presence of an alkali or acidic catalyst, at a temperature of from about 150° C. to about 200° C. to form a reaction mixture; and heating the reaction mixture to a temperature of from about 205° C. to 250° C.

Abstract: A rubber composition comprising a rubber and diresorcinol sulfide.

Abstract: A process for making phenylene dioxydiacetic acid comprises (a) contacting a dihydroxybenzene under reaction conditions with a salt of haloacetic acid in a solution without adding a haloacetic acid to produce a salt of phenylene dioxydiacetic acid; and (b) optionally converting the salt of phenylene dioxydiacetic acid to free phenylene dioxydiacetic acid. In some embodiments, 1,3-phenylene dioxydiacetic acid (RDOA) is made by reacting resorcinol with sodium chloroacetic acid in a reaction mixture with a pH in the range of about 7 to about 11 and at a temperature from about 70° C. to 105° C. By adjusting the reactions conditions, a relatively high yield of 1,3-phenylene dioxydiacetic acid (i.e., greater than 80%) is obtained. The purified acid can be used in the synthesis of polyester, such as polyethylene terephthalate.

Abstract: Improved methods for the simultaneous production of dihydroxybenzene and dicarbinol from diisopropylbenzene are provided. These methods provide for continuous and simultaneous production of diisopropylbenzene dihydroperoxide (DHP) and diisopropylbenzene hydroxyhydroperoxide (HHP) using Karr Column extractors operated in series. A very high purity DHP-containing solution, the precursor to the dihydroxybenzene, can be produced according to the reported methods. A safe and efficient method for producing dicarbinol from HHP is also disclosed.

Abstract: A corrosion resistant, light weight composite twisted rope rebar is disclosed for reinforcing concrete material, including providing a plurality of continuous glass fibers oriented substantially in the longitudinal axis and coated with a thermoset polyester resin and catalyst. In one aspect, the twisted rope rebar includes two or more bundles in a helical pitch of about two inches to six inches to form the twisted rope rebar.

Abstract: A non-elastomeric epoxy having a mol wt less than about 10,000 and curing agent therefor ("epoxy-curing-agent"), both of which (epoxy/epoxy-curing-agent) are liquid while at curing temperatures, provide a continuous liquid phase in which a polyimide (PI) generally, and a bisimide (BI) in particular, may be homogeneously dispersed to form a fluidized dispersion. In one embodiment, the less viscous epoxy/epoxy-curing-agent is the dispersive medium (continuous phase) and the PI the dispersed or discontinuous phase. In the more preferred embodiment, the epoxy/epoxy-curing-agent and PI are miscible, forming a single liquid phase in which the PI is homogeneously dispersed. In each embodiment, the epoxy is essentially unreactive with the PI. Upon curing the epoxy in a first stage, to form a polymeric epoxy matrix (also referred to as "cured epoxy resin" herein) at a temperature below 150.degree. C.