Abstract: A MEMS device can include a substrate having a first side and a second side, the substrate including an aperture extending from the first side through the substrate to the second side. The device can include a support structure coupled to the substrate the first side. The device can include a resilient structure coupled to the support structure. The device can include a rigid movable plate coupled to the support structure via the resilient structure and positioned over the aperture. The device can include a proof mass coupled to the movable plate, the proof mass extending into the aperture. The device can include an electrode located on an opposite side of the movable plate from the proof mass.

Abstract: The present disclosure provides a scanning system for scanning an object, including a scanner device including an image sensor for acquiring images; a mounting-interface for detachably mounting at least one of a plurality of types of scanning-tips, wherein each of the plurality of types scanning-tips is configured for providing light to the object in an illumination-mode that differs for each of the plurality of types of scanning-tips.

Abstract: An acoustic sensor assembly that produces an electrical signal representative of an acoustic signal, includes an acoustic transduction element disposed in a housing and acoustically, a heat source causing air pressure variations within the housing when energized, and an electrical circuit electrically coupled to the acoustic transduction element and to contacts on an external-device interface of the housing, wherein the electrical circuit is configured to energize the heat source and determine a non-acoustic condition or change therein based on an amplitude of air pressure variations detected by the acoustic transduction element.

Abstract: A support system for hanging of a cabinet door is provided having support arm and a main body with a top member and a front member. The upper end of the front member is operably connected to the forward end of the top member. The front member has lock features located at a plurality of positions between the upper end and the lower end on a front surface. The support arm has an elongated shape extending between a connection end and a support end. The support arm has lock features configured to engage and lock with lock features of the front member. The support end of the support arm having a platform configured to support the cabinet door during installation onto a cabinet. The support arm is movable between the plurality of positions to facilitate adjustment of a height at which the cabinet door is supported.

Abstract: Acoustic transducers for generating electrical signals in response to acoustic signals are disclosed. In some embodiments, an acoustic transducer includes an at least partially evacuated hermetically sealed cavity defined in part by a first diaphragm. The acoustic transducer also includes a backplate disposed at least partially within the cavity. The cavity having a pressure lower than atmospheric pressure. The acoustic transducer further includes a pressure sensor coupled to the backplate and configured to sense the pressure in the cavity.

Abstract: Disclosed is an intra-oral scanning system including: a scanning device including at least a first magnetic induction coil; a replaceable scanning tip including at least a second magnetic induction coil; the scanning tip being removably connected to the scanning device; wherein the at least first and second magnetic induction coils are configured to provide power transfer and/or a communication signal between the scanning device and the scanning tip during operation of the scanning system.

Abstract: A system includes an outflow vent that has a cap releasably mounted to a panel within an internal cabin of a vehicle. The cap is elongated from a first end of the cap to a second end of the cap opposite the first end. The cap has a base wall that is overlaid on the panel and defines at least one slot therethrough. The cap receives an airflow generated by an airflow generator, and the at least one slot emits the airflow from the cap to form an air curtain within the internal cabin.

Abstract: A MEMS vibration sensor die can include a substrate having a top portion, a mounting surface, and an aperture extending at least partially through the substrate. The die can include a first electrode coupled to the top portion of the substrate and positioned over the aperture. The die can include a second electrode disposed between the substrate and the first electrode. The second electrode can be spaced apart from the first electrode. The die can include a proof mass that can have a first portion coupled to the first electrode or the second electrode. The proof mass can have a second end opposite the first portion. The second end can be recessed within the aperture relative to the mounting surface of the substrate. The proof mass can be suspended freely within the aperture. The proof mass can move the first electrode or the second electrode from which it is suspended in response to vibration.

Abstract: A micro-electromechanical system (MEMS) transducer assembly includes a transducer including a condenser microphone, an integrated circuit electrically connected to the transducer to receive an output voltage from the transducer, wherein the integrated circuit comprises a test signal generator configured to induce a test acoustic response in the transducer, and an evaluation circuit configured to compare the test acoustic response to a baseline acoustic response to identify a fault in the transducer.

Abstract: A capacitive sensor assembly includes a capacitive transduction element and an electrical circuit disposed in the housing and electrically coupled to contacts on an external-device interface of the housing. The electrical circuit includes a sampling circuit having an operational sampling phase during which a voltage produced by the capacitive sensor is sampled by a sampling capacitor coupled to a comparator and an operational charging phase during which a second capacitor is charged by a charge and discharge circuit until the output of the comparator changes state, wherein the output of the sampling circuit is a pulse width modulated signal representative of the voltage on the input of the sampling circuit during each sample period. The output of the sampling circuit can be coupled to a delta-sigma analog-to-digital (A/D) converter.

Abstract: A MEMS transducer for a microphone includes a closed chamber, an array of conductive pins, a dielectric grid, and a diaphragm. The closed chamber is at a pressure lower than atmospheric pressure. The array of conductive pins is in a fixed position in the closed chamber, distributed in two dimensions, and have gaps formed therebetween. The dielectric grid is positioned within the closed chamber, includes a grid of dielectric material positioned between the gaps of the array of conductive pins, and is configured to move parallel to the conductive pins. The diaphragm is configured to form a portion of the closed chamber and deflect in response to changes in a differential pressure between the pressure within the closed chamber and a pressure outside the transducer. The diaphragm is configured to move the dielectric grid relative to the array of conductive pins in response to a change in the differential pressure.

Abstract: A microphone assembly comprises a substrate and an enclosure disposed on the substrate. A port is defined in one of the substrate or the enclosure. An acoustic transducer is configured to generate an electrical signal in response to acoustic activity. The acoustic transducer comprises a membrane separating a front volume from a back volume of the microphone assembly. The front volume is in fluidic communication with the port, and the back volume is filled with a first gas having a thermal conductivity lower than a thermal conductivity of air. An integrated circuit is electrically coupled to the acoustic transducer and configured to receive the electrical signal from the acoustic transducer. At least a portion of a boundary defining at least one of the front volume or the back volume is configured to have compliance so as to allow pressure equalization. The first gas is different from the second gas.

Abstract: The problem of contaminants entering a microphone assembly through a pressure equalization aperture is mitigated by moving the pressure equalization aperture from a location near the acoustic port to a location on the cover of the microphone assembly. This is achieved by fabricating an aperture reduction structure using a separate dedicated die, with an aperture of diameter ˜25 microns or less disposed on the aperture reduction structure, and then coupling the aperture reduction structure to the cover of the microphone. The relatively smaller aperture on the cover after the coupling of the aperture reduction structure is used for pressure equalization of the back volume of the microphone with a pressure outside of the microphone assembly.

Abstract: A method for water filtration to reduce scaling is disclosed herein. The method includes determining that a pump has been inactive for a threshold period of time. The method also includes closing a first valve to a filtered drinking water tank and opening a second valve to a source water tank based on determining that the pump has been inactive for the threshold period of time. The method further includes activating, based on the first valve being closed and the second valve being opened, the pump for a period of time to circulate water from the source water tank through a filter system and back to the source water tank.

Abstract: A method for the etching of deep, high-aspect ratio features into silicon carbide (SiC), gallium nitride (GaN) and similar materials using an Inductively-Coupled Plasma (ICP) etch process technology is described. This technology can also be used to etch features in silicon carbide and gallium nitride having near vertical sidewalls. The disclosed method has application in the fabrication of electronics, microelectronics, power electronics, Monolithic Microwave Integrated Circuits (MMICs), high-voltage electronics, high-temperature electronics, high-power electronics, Light-Emitting Diodes (LEDs), Micro-Electro-Mechanical Systems (MEMS), micro-mechanical devices, microelectronic devices and systems, nanotechnology devices and systems, Nano-Electro-Mechanical Systems (NEMS), photonic devices, and any devices and/or structures made from silicon carbide and/or gallium nitride.

Abstract: A microelectromechanical system (MEMS) transducer for integration in a microphone assembly is designed to produce heat-generated acoustic signals. The MEMS transducer generally comprises a substrate having an aperture, a transduction element located at least partially over the aperture and coupled to the substrate, electrical contacts coupled to the transduction element, and a resistor integrated with the substrate or the transduction element. The resistor is coupled to electrical contacts that are electrically isolated from the contacts of the MEMS transducer or transduction element. The transduction element includes an insulating material coupled to the substrate. The transduction element comprises a fixed electrode and a movable electrode located at least partially over the aperture of the substrate. The fixed electrode or the moving electrode is formed on the insulating material. The resistor can be formed on the insulating material or suspended from the insulating material.

Abstract: Acoustic transducers for generating electrical signals in response to acoustic signals are disclosed. In some embodiments, an acoustic transducer includes an at least partially evacuated hermetically sealed cavity defined in part by a first diaphragm. The acoustic transducer also includes a backplate disposed at least partially within the cavity. The cavity having a pressure lower than atmospheric pressure. The acoustic transducer further includes a pressure sensor coupled to the backplate and configured to sense the pressure in the cavity.

Abstract: A microphone assembly includes a substrate, an acoustic transducer, an integrated circuit, and a cover couples to the substrate to enclose a back volume of the microphone assembly in which the acoustic transducer and the integrated circuit are disposed. The acoustic transducer includes a back plate and a diaphragm oriented parallel to the back plate disposed over an aperture in the substrate to receive acoustic signals. The cover is a metallic material with a thickness and a corresponding thermal diffusivity to attenuate incoming radio-frequency signals. The attenuation of the radio-frequency signals prevents ambient noise detectable by the microphone assembly.

Abstract: A method for the etching of deep, high-aspect ratio features into silicon carbide (SiC), gallium nitride (GaN) and similar materials using an Inductively-Coupled Plasma (ICP) etch process technology is described. This technology can also be used to etch features in silicon carbide and gallium nitride having near vertical sidewalls. The disclosed method has application in the fabrication of electronics, microelectronics, power electronics, Monolithic Microwave Integrated Circuits (MMICs), high-voltage electronics, high-temperature electronics, high-power electronics, Light-Emitting Diodes (LEDs), Micro-Electro-Mechanical Systems (MEMS), micro-mechanical devices, microelectronic devices and systems, nanotechnology devices and systems, Nano-Electro-Mechanical Systems (NEMS), photonic devices, and any devices and/or structures made from silicon carbide and/or gallium nitride.

Abstract: The disclosure describes devices and methods of providing a DC bias voltage in a microphone assembly. Particularly, one implementation of such a device may be implemented on an integrated circuit that includes a direct current (DC) bias circuit. The DC bias circuit may be coupled to a transducer and configured to supply a DC bias signal to the transducer. The DC bias circuit includes a multi-stage charge pump and a low pass filter (LUFF) circuit. The multi-stage charge pump includes transistors that are fabricated with deep trench isolation (DTI).