Abstract: Described herein is a system and method for determining one or more data modulation profiles for one or more devices. The system and method described herein may measure signal quality, such as a modulation error ratio (MER), signal-to-noise ratio (SNR), receive power, transmit power, etc. Based on the signal quality, the system may determine one or more data modulation profile(s) (e.g., quadrature amplitude modulation (QAM) profiles) for a subcarrier, a plurality of subcarriers, a device, and/or a grouping of devices.

Abstract: Described herein is a system and method for determining one or more data modulation profiles for one or more devices. The system and method described herein may measure signal quality, such as a modulation error ratio (MER), signal-to-noise ratio (SNR), receive power, transmit power, etc. Based on the signal quality, the system may determine one or more data modulation profile(s) (e.g., quadrature amplitude modulation (QAM) profiles) for a subcarrier, a plurality of subcarriers, a device, and/or a grouping of devices.

Abstract: Compositions and designs are described for a sectional porous carrier used in processing microelectronics where thin device substrates are affixed by adhesive to the carrier and form an impervious bonded stack that is resistant to thermal and chemical products during processing and is easily handled by a substrate handling vacuum robot, and subsequently allows rapid removal (debonding) in batch operations by directional penetration into sectional porous regions by selective liquids which release the carrier from the device wafer without harm. The invention carrier with porous regions is used for temporary support of thin and fragile device substrates having capabilities of selective penetration of chemical liquids to pass through the porous regions, access and breakdown the bonding adhesive, and allow it to release without damage to the device substrate.

Abstract: Described herein is a system and method for determining one or more data modulation profiles for one or more devices. The system and method described herein may measure signal quality, such as a modulation error ratio (MER), signal-to-noise ratio (SNR), receive power, transmit power, etc. Based on the signal quality, the system may determine one or more data modulation profile(s) (e.g., quadrature amplitude modulation (QAM) profiles) for a subcarrier, a plurality of subcarriers, a device, and/or a grouping of devices.

Abstract: Described herein is a system and method for determining one or more data modulation profiles for one or more devices. The system and method described herein may measure signal quality, such as a modulation error ratio (MER), signal-to-noise ratio (SNR), receive power, transmit power, etc. Based on the signal quality, the system may determine one or more data modulation profile(s) (e.g., quadrature amplitude modulation (QAM) profiles) for a subcarrier, a plurality of subcarriers, a device, and/or a grouping of devices.

Abstract: Methods and compositions are described for a temporary adhesive used to affix a work unit onto a carrier substrate whereby its porosity is tuned by choosing and adjusting the polymeric resin and filler components to provide sufficient adhesion to support a manufacturing process, and upon completion, there is advanced penetration of a liquid into the interfacial bond causing release of the work unit without harm. The temporary adhesive provides a tunable porosity that is dependent upon the mathematical calculation of the weight basis ratio of filler to binder, that is preferably greater than 1.0, more preferably greater than 2.0, and most preferably greater than 3.0. The temporary adhesive may be applied and cured in a variety of ways that meet the needs of the form of the work unit and objectives of the manufacturing process. The invention provides benefits of flexibility and reduced cost when establishing practices to handle difficult work units in the manufacture of semiconductors and flat panel displays.

Abstract: Methods and compositions are described for a temporary adhesive used to affix a work unit onto a carrier substrate whereby its porosity is tuned by choosing and adjusting the polymeric resin and filler components to provide sufficient adhesion to support a manufacturing process, and upon completion, there is advanced penetration of a liquid into the interfacial bond causing release of the work unit without harm. The temporary adhesive provides a tunable porosity that is dependent upon the mathematical calculation of the weight basis ratio of filler to binder, that is preferably greater than 1.0, more preferably greater than 2.0, and most preferably greater than 3.0. The temporary adhesive may be applied and cured in a variety of ways that meet the needs of the form of the work unit and objectives of the manufacturing process. The invention provides benefits of flexibility and reduced cost when establishing practices to handle difficult work units in the manufacture of semiconductors and flat panel displays.

Abstract: Compositions and designs are described for a sectional porous carrier used in processing microelectronics where thin device substrates are affixed by adhesive to the carrier and form an impervious bonded stack that is resistant to thermal and chemical products during processing and is easily handled by a substrate handling vacuum robot, and subsequently allows rapid removal (debonding) in batch operations by directional penetration into sectional porous regions by selective liquids which release the carrier from the device wafer without harm. The invention carrier with porous regions is used for temporary support of thin and fragile device substrates having capabilities of selective penetration of chemical liquids to pass through the porous regions, access and breakdown the bonding adhesive, and allow it to release without damage to the device substrate.

Abstract: Compositions and designs are described for a sectional porous carrier used in processing microelectronics where thin device substrates are affixed by adhesive to the carrier and form an impervious bonded stack that is resistant to thermal and chemical products during processing and is easily handled by a substrate handling vacuum robot, and subsequently allows rapid removal (debonding) in batch operations by directional penetration into sectional porous regions by selective liquids which release the carrier from the device wafer without harm. The invention carrier with porous regions is used for temporary support of thin and fragile device substrates having capabilities of selective penetration of chemical liquids to pass through the porous regions, access and breakdown the bonding adhesive, and allow it to release without damage to the device substrate.

Abstract: Described herein is a system and method for determining one or more data modulation profiles for one or more devices. The system and method described herein may measure signal quality, such as a modulation error ratio (MER), signal-to-noise ratio (SNR), receive power, transmit power, etc. Based on the signal quality, the system may determine one or more data modulation profile(s) (e.g., quadrature amplitude modulation (QAM) profiles) for a subcarrier, a plurality of subcarriers, a device, and/or a grouping of devices.

Abstract: Compositions and designs are described for a sectional porous carrier used in processing microelectronics where thin device substrates are affixed by adhesive to the carrier and form an impervious bonded stack that is resistant to thermal and chemical products during processing and is easily handled by a substrate handling vacuum robot, and subsequently allows rapid removal (debonding) in batch operations by directional penetration into sectional porous regions by selective liquids which release the carrier from the device wafer without harm. The invention carrier with porous regions is used for temporary support of thin and fragile device substrates having capabilities of selective penetration of chemical liquids to pass through the porous regions, access and breakdown the bonding adhesive, and allow it to release without damage to the device substrate.

Abstract: It is a primary object of the present invention to provide a pre-stressed rolling mill which has the advantages of a conventional mono-block mill housing and utilizes a standard Cluster mill gauge eccentric bearing gauge control system. It is highly desirable to have a rolling mill with a low cost mill housing design, a high mill stiffness, a simplified gauge control system, a capacity for multiple work roll ranges, and satisfactory side to side tilting. Such a mill is capable of operating satisfactorily as a commercial temper mill and a commercial cold mill.

Abstract: It is a primary object of the present invention to provide a pre-stressed rolling mill which has the advantages of a conventional mono-block mill housing and utilizes a standard Cluster mill gauge eccentric bearing gauge control system. It is highly desirable to have a rolling mill with a low cost mill housing design, a high mill stiffness, a simplified gauge control system, a capacity for multiple work roll ranges, and satisfactory side to side tilting. Such a mill is capable of operating satisfactorily as a commercial temper mill and a commercial cold mill.

Abstract: A frame apparatus capable of being flush mounted relative to a wall, ceiling or floor surface, is made up by joining linear frame sections each providing interconnected elements formed by an extrusion process. A first planar element is spaced apart from a second planar element and positioned for abutting a common surface. A first channel element is formed between the first and second planar elements. A third planar element is positioned normal to the first and second planar elements and terminates with a rib directed toward the first planar element. When mounted onto studs in a building structure, wall putty or mud may be placed into a space between the wall panels and the third planar element and with rib elements protruding from the third planar element, the mud is captured in place forming a smooth interface between the frame assembly and the surrounding wall surfaces.

Abstract: A frame apparatus capable of being flush mounted relative to a wall, ceiling or floor surface, is made up by joining linear frame sections each providing interconnected elements formed by an extrusion process. A first planar element is spaced apart from a second planar element and positioned for abutting a common surface. A first channel element is formed between the first and second planar elements. A third planar element is positioned normal to the first and second planar elements and terminates with a rib directed toward the first planar element. When mounted onto studs in a building structure, wall putty or mud may be placed into a space between the wall panels and the third planar element and with rib elements protruding from the third planar element, the mud is captured in place forming a smooth interface between the frame assembly and the surrounding wall surfaces.