Patents by Inventor Michael R. Cowan

Michael R. Cowan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6039241
    Abstract: The inventive mechanism conducts heat through the leads of the connector to the solder connection points, and simultaneously reflows all of the solder on all of the pads. The inventive mechanism comprises a machined aluminum piece that mimics the mating geometry for the connector and couples to the connector as if it were a chip device. The inventive mechanism couples to the connector via heat conducting fins. Heat is transferred to the aluminum piece, and down through the fins and into the internal portion of the connector. The fins contact the internal portion of the connector leads. Thus, heat is transferred from the internal portion of the leads to the exterior portion of the leads, and down to the soldered connection point with the PCB board. Since the fins contact all of the internal leads of the connector, each of the soldered connections is reflowed at approximately the same time, and thus, the connector is then removed from the board.
    Type: Grant
    Filed: April 17, 1998
    Date of Patent: March 21, 2000
    Assignee: Hewlett-Packard Company
    Inventors: Sean W. Tucker, Michael R. Cowan, Mark P. Martin
  • Patent number: D361964
    Type: Grant
    Filed: July 9, 1993
    Date of Patent: September 5, 1995
    Inventors: Michael R. Cowan, Thomas E. Wheeler