Patents by Inventor Michael R. Lucas

Michael R. Lucas has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Therapeutic compounds
    Patent number: 12098148
    Abstract: The present invention relates to compounds that are Nrf2 activators. The compounds have the structural formula I defined herein. The present invention also relates to processes for the preparation of these compounds, to pharmaceutical compositions comprising them, and to their use in the treatment of diseases or disorders associated with Nrf2 activation.
    Type: Grant
    Filed: October 22, 2019
    Date of Patent: September 24, 2024
    Assignee: C4X Discovery Limited
    Inventors: Emma L. Blaney, Duncan J. Crick, Simon R. Crumpler, George Hynd, Cathy L Lucas, Barrie P. Martin, Nick C. Ray, Eileen M. Seward, David G. Evans, Lucille Le Bozec, Thorsten Nowak, Michael G. Russell, Siew K. Yeap, Fabien J. Roussel, Sanjeet S. Sehmi
  • Piperidinone Derivatives as MDM2 Inhibitors for the Treatment of Cancer
    Publication number: 20240300892
    Abstract: The present invention provides MDM2 inhibitor compounds of Formula I, wherein the variables are defined above, which compounds are useful as therapeutic agents, particularly for the treatment of cancers. The present invention also relates to pharmaceutical compositions that contain an MDM2 inhibitor.
    Type: Application
    Filed: October 11, 2023
    Publication date: September 12, 2024
    Inventors: Michael D. Bartberger, Ana Gonzalez Buenrostro, Hilary Plake Beck, Xiaoqi Chen, Richard Victor Connors, Jeffrey Deignan, Jason A. Duquette, I, John Eksterowicz, Benjamin Fisher, Brian M. Fox, Jiasheng Fu, Zice Fu, Felix Gonzalez Lopez De Turiso, Michael W. Gribble, Darin J. Gustin, Julie A. Heath, Xin Huang, XianYun Jiao, Michael G. Johnson, Frank Kayser, David John Kopecky, SuJen Lai, Yihong Li, Zhihong Li, Jiwen Liu, Jonathan D. Low, Brian S. Lucas, Zhihua MA, Lawrence R. McGee, Joel McIntosh, Dustin L. McMinn, Julio C. Medina, Jeffrey Thomas Mihalic, Steven H. Olson, Yossup Rew, Philip M. Roveto, Daqing Sun, Xiaodong Wang, Yingcai Wang, Xuelei Yan, Ming Yu, Jiang Zhu
  • Low stress leadless chip carrier and method of assembly
    Patent number: 4554575
    Abstract: A leadless integrated circuit chip carrier apparatus and method of assembly to a printed circuit board. A plurality of castellations are provided in the perimeter walls of the carrier member and solder preforms are deformably fitted in the castellations for reflow vapor phase soldering to the printed circuit board. A spacer member is disposed between the carrier member and the printed circuit board and has a thermal coefficient of expansion matched to that of the solder. The spacer includes a high thermal conductivity planar metal portion sandwiched between an adhesive epoxy layer which facilitates assembly of the carrier to the circuit board.
    Type: Grant
    Filed: May 12, 1983
    Date of Patent: November 19, 1985
    Assignee: Westinghouse Electric Corp.
    Inventor: Michael R. Lucas
  • Method for interconnecting close lead center integrated circuit packages to boards
    Patent number: 4531285
    Abstract: The invention is a method for interconnecting close lead center integrated ircuit package to boards by forming the leads as follows: (1) bonding the lead frame material to a thin insulating film, and the (2) forming the leads. Next, the film base is removed selectively where connections to the package and board will be made. The lead material is then plated and formed to provide stress relief in the package-to-board interconnect. The lead frame is then attached to the package and board.
    Type: Grant
    Filed: March 21, 1983
    Date of Patent: July 30, 1985
    Assignee: The United States of America as represented by the Secretary of the Navy
    Inventor: Michael R. Lucas