Patents by Inventor Michael R. Lyons
Michael R. Lyons has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240156516Abstract: An end effector assembly of a surgical instrument includes an ultrasonic blade adapted to receive ultrasonic energy from a source of ultrasonic energy to vibrate the ultrasonic blade. A jaw member is movable relative to the ultrasonic blade from a spaced-apart position to an approximated position for clamping tissue. A jaw liner is engaged with the jaw member such that the jaw liner contacts the ultrasonic blade when the jaw member is in the approximated position. The ultrasonic blade is adapted to receive electrosurgical energy from a source of electrosurgical energy. The ultrasonic blade defines a distal tip. The distal tip of the ultrasonic blade is configured to direct electrosurgical energy.Type: ApplicationFiled: March 7, 2022Publication date: May 16, 2024Inventors: Thomas E. Drochner, Matthew S. Cowley, Kenlyn Bonn, James R. Fagan, Michael B. Lyons, David J. Van Tol
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Publication number: 20240156512Abstract: An end effector assembly of a surgical instrument includes an ultrasonic blade. A jaw member is movable relative to the ultrasonic blade from a spaced-apart position to an approximated position. The jaw member includes a structural body. The structural body defines a first side facing the ultrasonic blade and a second side facing away from the ultrasonic blade. A jaw liner is engaged with the first side of the structural body such that the jaw liner contacts the ultrasonic blade when the jaw member is in the approximated position. An electrode is engaged with the second side of the structural body. The electrode is adapted to connect to a source of electrosurgical energy. The electrode defines a first portion and a second portion. The first portion of the electrode is in contact with the structural body and the second portion of the electrode tapers to a pointed edge.Type: ApplicationFiled: March 10, 2022Publication date: May 16, 2024Applicant: Covidien LPInventors: Thomas E. Drochner, Matthew S. Cowley, Kenlyn Bonn, James R. Fagan, Michael B. Lyons, David J. Van Tol
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Publication number: 20240152245Abstract: A computer system displays a first object that includes at least a first portion of the first object and a second portion of the first object and detects a first gaze input that meets first criteria, wherein the first criteria require that the first gaze input is directed to the first portion of the first object in order for the first criteria to be met. In response, the computer system displays a first control element that corresponds to a first operation associated with the first object, wherein the first control element was not displayed prior to detecting that the first gaze input met the first criteria, and detects a first user input directed to the first control element. In response to detecting the first user input directed to the first control element, the computer system performs the first operation with respect to the first object.Type: ApplicationFiled: September 21, 2023Publication date: May 9, 2024Inventors: Lee S. Broughton, Israel Pastrana Vicente, Matan Stauber, Miquel Estany Rodriguez, James J. Owen, Jonathan R. Dascola, Stephen O. Lemay, Christian Schnorr, Zoey C. Taylor, Jay Moon, Benjamin H. Boesel, Benjamin Hylak, Richard D. Lyons, Willliam A. Sorrentino, III, Lynn I. Streja, Jonathan Ravasz, Nathan Gitter, Peter D. Anton, Michael J. Rockwell, Peter L. Hajas, Evgenii Krivoruchko, Mark A. Ebbole, James Magahern, Andrew J. Sawyer, Christopher D. McKenzie, Michael E. Buerli, Olivier D. R. Gutknecht
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Publication number: 20240130778Abstract: A surgical end effector includes an ultrasonic blade and a jaw member. The blade is adapted to receive ultrasonic and electrosurgical energy and defines a distal face. The jaw member is movable relative to the blade from a spaced-apart to an approximated position for clamping tissue and includes a structural body having a body portion and a distal cap portion. The distal cap portion defines an electrode that receives electrosurgical energy. The jaw member further includes a jaw liner engaged within the body portion and extending therefrom towards the blade such that, in the approximated position, the jaw liner contacts the blade to define a gap distance between the electrode and the distal face to facilitate bipolar electrosurgical tissue treatment upon conduction of bipolar energy between the electrode and the distal face and through tissue in contact therewith.Type: ApplicationFiled: March 1, 2022Publication date: April 25, 2024Applicant: Covidien LPInventors: Thomas E. Drochner, Matthew S. Cowley, Kenlyn S. Bonn, James R. Fagan, Michael B. Lyons, David J. Van Tol
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Patent number: 11967937Abstract: A packaged semiconductor chip includes a semiconductor sub strate having formed thereon: radio-frequency (RF) input and output contact pads, DC contact pads, and first and second amplifier stages. An input of the first amplifier stage is coupled with the RF input contact pad. An input and an output of the second amplifier stage are respectively coupled to an output of the first amplifier stage and the RF output contact pad. The DC contact pads and the input of the first amplifier stages are connected via an input bias coupling path. The outputs of the amplifier stages are connected via an output bias coupling path. The chip further includes a lead frame having RF input and output pins electrically coupled to the RF input and output contact pads, and input bias pins electrically coupled to the DC contact pad.Type: GrantFiled: January 17, 2019Date of Patent: April 23, 2024Assignee: Viasat, Inc.Inventors: Shih Peng Sun, Kenneth V. Buer, Michael R. Lyons, Gary P. English, Qiang R. Chen, Ramanamurthy V. Darapu, Douglas J. Mathews, Mark S. Berkheimer, Brandon C. Drake
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Publication number: 20200366259Abstract: A packaged semiconductor chip includes a power amplifier die including a semiconductor substrate, and an input contact pad, an output contact pad, first and second direct-current (DC) contact pads, one or more transistors having an input coupled to the input contact pad, and an input bias coupling path electrically coupling the first DC contact pad to the second DC contact pad and the input contact pad implemented on the semiconductor substrate. The chip further includes a lead frame having one or more radio-frequency input pins electrically coupled to the input contact pad, one or more radio-frequency output pins electrically coupled to the output contact pad, and first and second input bias pins electrically coupled to the first and second DC contact pads, respectively.Type: ApplicationFiled: January 17, 2019Publication date: November 19, 2020Applicant: VIASAT, INC.Inventors: Shih Peng SUN, Kenneth V. BUER, Michael R. LYONS, Gary P. ENGLISH, Qiang R. CHEN, Ramanamurthy V. DARAPU, Douglas J. MATHEWS, Mark S. BERKHEIMER, Brandon C. DRAKE
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Patent number: 10734960Abstract: Systems, devices, and methods for determining and establishing frequency-dependent gain compensation in wide bandwidth communication systems are disclosed. Variable frequency-dependent gain compensation circuits, or variable equalizers, have settings that configure them to establish discrete frequency-dependent gain compensation. The frequency-dependent gain compensation can include various types and levels of gain slope and/or ripple. The settings of the variable equalizers can be set by control signals established a control circuit in response to signals from an external computer. The variable equalizers are coupled to other circuits or devices and the frequency-dependent gain of the combined circuit are measured. The settings of the variable equalizer are then changed to establish an optimal frequency-dependent gain profile or frequency-dependent gain that is closest to a predetermined frequency-dependent target gain profile. The settings can then be saved in a memory or register.Type: GrantFiled: January 22, 2019Date of Patent: August 4, 2020Assignee: Viasat, Inc.Inventors: Kenneth V Buer, Michael R Lyons
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Publication number: 20190341896Abstract: Systems, devices, and methods for determining and establishing frequency-dependent gain compensation in wide bandwidth communication systems are disclosed. Variable frequency-dependent gain compensation circuits, or variable equalizers, have settings that configure them to establish discrete frequency-dependent gain compensation. The frequency-dependent gain compensation can include various types and levels of gain slope and/or ripple. The settings of the variable equalizers can be set by control signals established a control circuit in response to signals from an external computer. The variable equalizers are coupled to other circuits or devices and the frequency-dependent gain of the combined circuit are measured. The settings of the variable equalizer are then changed to establish an optimal frequency-dependent gain profile or frequency-dependent gain that is closest to a predetermined frequency-dependent target gain profile. The settings can then be saved in a memory or register.Type: ApplicationFiled: January 22, 2019Publication date: November 7, 2019Applicant: VIASAT, INC.Inventors: KENNETH V. BUER, MICHAEL R. LYONS
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Patent number: 10224893Abstract: Systems, devices, and methods for determining and establishing frequency-dependent gain compensation in wide bandwidth communication systems are disclosed. Variable frequency-dependent gain compensation circuits, or variable equalizers, have settings that configure them to establish discrete frequency-dependent gain compensation. The frequency-dependent gain compensation can include various types and levels of gain slope and/or ripple. The settings of the variable equalizers can be set by control signals established a control circuit in response to signals from an external computer. The variable equalizers are coupled to other circuits or devices and the frequency-dependent gain of the combined circuit are measured. The settings of the variable equalizer are then changed to establish an optimal frequency-dependent gain profile or frequency-dependent gain that is closest to a predetermined frequency-dependent target gain profile. The settings can then be saved in a memory or register.Type: GrantFiled: July 31, 2018Date of Patent: March 5, 2019Assignee: VIASAT, INC.Inventors: Kenneth V Buer, Michael R Lyons
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Publication number: 20190013787Abstract: Systems, devices, and methods for determining and establishing frequency-dependent gain compensation in wide bandwidth communication systems are disclosed. Variable frequency-dependent gain compensation circuits, or variable equalizers, have settings that configure them to establish discrete frequency-dependent gain compensation. The frequency-dependent gain compensation can include various types and levels of gain slope and/or ripple. The settings of the variable equalizers can be set by control signals established a control circuit in response to signals from an external computer. The variable equalizers are coupled to other circuits or devices and the frequency-dependent gain of the combined circuit are measured. The settings of the variable equalizer are then changed to establish an optimal frequency-dependent gain profile or frequency-dependent gain that is closest to a predetermined frequency-dependent target gain profile. The settings can then be saved in a memory or register.Type: ApplicationFiled: July 31, 2018Publication date: January 10, 2019Applicant: VIASAT, INC.Inventors: KENNETH V. BUER, MICHAEL R. LYONS
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Patent number: 10063206Abstract: Systems, devices, and methods for determining and establishing frequency-dependent gain compensation in wide bandwidth communication systems are disclosed. Variable frequency-dependent gain compensation circuits, or variable equalizers, have settings that configure them to establish discrete frequency-dependent gain compensation. The frequency-dependent gain compensation can include various types and levels of gain slope and/or ripple. The settings of the variable equalizers can be set by control signals established a control circuit in response to signals from an external computer. The variable equalizers are coupled to other circuits or devices and the frequency-dependent gain of the combined circuit are measured. The settings of the variable equalizer are then changed to establish an optimal frequency-dependent gain profile or frequency-dependent gain that is closest to a predetermined frequency-dependent target gain profile. The settings can then be saved in a memory or register.Type: GrantFiled: November 9, 2017Date of Patent: August 28, 2018Assignee: VIASAT, INC.Inventors: Kenneth V Buer, Michael R Lyons
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Publication number: 20180069519Abstract: Systems, devices, and methods for determining and establishing frequency-dependent gain compensation in wide bandwidth communication systems are disclosed. Variable frequency-dependent gain compensation circuits, or variable equalizers, have settings that configure them to establish discrete frequency-dependent gain compensation. The frequency-dependent gain compensation can include various types and levels of gain slope and/or ripple. The settings of the variable equalizers can be set by control signals established a control circuit in response to signals from an external computer. The variable equalizers are coupled to other circuits or devices and the frequency-dependent gain of the combined circuit are measured. The settings of the variable equalizer are then changed to establish an optimal frequency-dependent gain profile or frequency-dependent gain that is closest to a predetermined frequency-dependent target gain profile. The settings can then be saved in a memory or register.Type: ApplicationFiled: November 9, 2017Publication date: March 8, 2018Applicant: VIASAT, INC.Inventors: KENNETH V. BUER, MICHAEL R. LYONS
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Patent number: 9847766Abstract: Systems, devices, and methods for determining and establishing frequency-dependent gain compensation in wide bandwidth communication systems are disclosed. Variable frequency-dependent gain compensation circuits, or variable equalizers, have settings that configure them to establish discrete frequency-dependent gain compensation. The frequency-dependent gain compensation can include various types and levels of gain slope and/or ripple. The settings of the variable equalizers can be set by control signals established a control circuit in response to signals from an external computer. The variable equalizers are coupled to other circuits or devices and the frequency-dependent gain of the combined circuit are measured. The settings of the variable equalizer are then changed to establish an optimal frequency-dependent gain profile or frequency-dependent gain that is closest to a predetermined frequency-dependent target gain profile. The settings can then be saved in a memory or register.Type: GrantFiled: October 5, 2016Date of Patent: December 19, 2017Assignee: VIASAT, INC.Inventors: Kenneth V Buer, Michael R Lyons
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Patent number: 9584089Abstract: A nested multi-stage polyphase filter can comprise: a first filter stage and a second filter stage. The first filter stage can be connected to the second filter stage via first through fourth intermediate connections. The first filter stage and the second filter stage can be laid out in a nested-ring layout. The first through fourth intermediate connections can be laid out so as to not cross over each other.Type: GrantFiled: November 18, 2014Date of Patent: February 28, 2017Assignee: ViaSat, Inc.Inventors: Qiang Richard Chen, Michael R Lyons
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Publication number: 20170054426Abstract: Systems, devices, and methods for determining and establishing frequency-dependent gain compensation in wide bandwidth communication systems are disclosed. Variable frequency-dependent gain compensation circuits, or variable equalizers, have settings that configure them to establish discrete frequency-dependent gain compensation. The frequency-dependent gain compensation can include various types and levels of gain slope and/or ripple. The settings of the variable equalizers can be set by control signals established a control circuit in response to signals from an external computer. The variable equalizers are coupled to other circuits or devices and the frequency-dependent gain of the combined circuit are measured. The settings of the variable equalizer are then changed to establish an optimal frequency-dependent gain profile or frequency-dependent gain that is closest to a predetermined frequency-dependent target gain profile. The settings can then be saved in a memory or register.Type: ApplicationFiled: October 5, 2016Publication date: February 23, 2017Applicant: VIASAT, INC.Inventors: KENNETH V. BUER, MICHAEL R. LYONS
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Patent number: 9484878Abstract: Systems, devices, and methods for determining and establishing frequency-dependent gain compensation in wide bandwidth communication systems are disclosed. Variable frequency-dependent gain compensation circuits, or variable equalizers, have settings that configure them to establish discrete frequency-dependent gain compensation. The frequency-dependent gain compensation can include various types and levels of gain slope and/or ripple. The settings of the variable equalizers can be set by control signals established a control circuit in response to signals from an external computer. The variable equalizers are coupled to other circuits or devices and the frequency-dependent gain of the combined circuit are measured. The settings of the variable equalizer are then changed to establish an optimal frequency-dependent gain profile or frequency-dependent gain that is closest to a predetermined frequency-dependent target gain profile. The settings can then be saved in a memory or register.Type: GrantFiled: February 10, 2015Date of Patent: November 1, 2016Assignee: VIASAT, INC.Inventors: Kenneth V Buer, Michael R Lyons
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Patent number: 9426929Abstract: A MMIC package is disclosed comprising: a leadframe based overmolded package, a die positioned within the overmolded package; and a partial waveguide interface, wherein the partial waveguide interface is integral with the overmolded package facilitating low cost and reliable assembly. Also disclosed is an overmolded package where the die sits on a metal portion exposed on the bottom of the package and the package is configured for attachment to a chassis of a transceiver such that heat from the die is easily dissipated to the chassis with a direct thermal path. The disclosure facilitates parallel assembly of MMIC packages and use of pick and place/surface mounting technology for attaching the MMIC packages to the chassis of transceivers. This facilitates reliable and low cost transceivers.Type: GrantFiled: July 7, 2015Date of Patent: August 23, 2016Assignee: ViaSat, Inc.Inventors: David R. Laidig, Kenneth V. Buer, Michael R. Lyons, Noel A. Lopez
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Publication number: 20160050793Abstract: A MMIC package is disclosed comprising: a leadframe based overmolded package, a die positioned within the overmolded package; and a partial waveguide interface, wherein the partial waveguide interface is integral with the overmolded package facilitating low cost and reliable assembly. Also disclosed is an overmolded package where the die sits on a metal portion exposed on the bottom of the package and the package is configured for attachment to a chassis of a transceiver such that heat from the die is easily dissipated to the chassis with a direct thermal path. The disclosure facilitates parallel assembly of MMIC packages and use of pick and place/surface mounting technology for attaching the MMIC packages to the chassis of transceivers. This facilitates reliable and low cost transceivers.Type: ApplicationFiled: July 7, 2015Publication date: February 18, 2016Applicant: VIASAT, INC.Inventors: David R. Laidig, Kenneth V. Buer, Michael R. Lyons, Noel A. Lopez
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Patent number: 9178515Abstract: The present disclosure includes systems and methods for sharing bias current. In one embodiment, shared bias current passes through a first level device to one or more second level devices along a bias current path. Multiple active devices may share bias current along a bias current path and process signal along the same or different signal paths. In one embodiment, bias current from one device is split among multiple devices. In another embodiment, bias current is combined from multiple devices into a device. Embodiments may include an interstage circuit along a signal path that improves stability of the circuit.Type: GrantFiled: March 15, 2013Date of Patent: November 3, 2015Assignee: VIASAT, INC.Inventors: Michael R Lyons, Kenneth V Buer, Qiang Richard Chen, Algirdas Navickas
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Patent number: 9142492Abstract: A MMIC package is disclosed comprising: a leadframe based overmolded package, a die positioned within the overmolded package; and a partial waveguide interface, wherein the partial waveguide interface is integral with the overmolded package facilitating low cost and reliable assembly. Also disclosed is an overmolded package where the die sits on a metal portion exposed on the bottom of the package and the package is configured for attachment to a chassis of a transceiver such that heat from the die is easily dissipated to the chassis with a direct thermal path. The disclosure facilitates parallel assembly of MMIC packages and use of pick and place/surface mounting technology for attaching the MMIC packages to the chassis of transceivers. This facilitates reliable and low cost transceivers.Type: GrantFiled: November 22, 2013Date of Patent: September 22, 2015Assignee: ViaSat, Inc.Inventors: David R. Laidig, Kenneth V. Buer, Michael R. Lyons, Noel A. Lopez