Abstract: An apparatus includes a first processor having a first instruction set and a second processor having a second instruction set that is different than the first instruction set. The apparatus also includes a memory storing at least a portion of an operating system. The operating system is concurrently executable on the first processor and the second processor.

Abstract: An apparatus includes a first processor having a first instruction set and a second processor having a second instruction set that is different than the first instruction set. The apparatus also includes a memory storing at least a portion of an operating system. The operating system is concurrently executable on the first processor and the second processor.

Abstract: An interface circuit for allowing a computer system to communicate over existing household wiring in multiple frequency bands. The interface circuit includes an isolation circuit that connects the interface circuit to the household wiring. An analog-to-digital/digital-to-analog converter receives analog signals in multiple frequency bands and digitizes them. A digital splitter/combiner operates to filter the combined frequency digital signals received from the analog-to-digital/digital-to-analog converter. The frequency bands preferably comprise a voice band typically used for transmitting voice telephone signals, a DSL band for transmitting and receiving high-speed digital data over a twisted pair of telephone wires, and a Home PNA frequency band used for networking computers and peripherals on a twisted pair of telephone wires.

Abstract: A heat sink including a pedestal. The heat sink is used to dissipate heat from an electrical component such as a processor (e.g., a Pentium® Pro processor). The pedestal is arranged on the heat sink such that a gap which is formed between a surface of the electrical component and the heat sink is maintained to be less than an acceptable gap size. The gap between the heat sink and the electrical component can occur, for example, due to excessive warping of a surface of the electrical component. The excessive warping can be caused, for example, from manufacturing process problems or thermal changes. The pedestal can be arranged on an end of the heat sink facing the electrical component in a manner advantageous to cover a maximum surface area of the electrical component caused due to a particular size and shape of warping which uniquely occurs on a particular type of electrical component.