Abstract: Embodiments of switches (10) include first and second electrical conductors (34, 36) suspended within an electrically-conductive housing (28), and a contact element (16) having an electrically-conductive portion (53b) that establishes electrical contact between the first and second electrical conductors (34, 36) when the contact element (16) is in a closed position. The electrically-conductive portion (53b) is electrically isolated from a ground plane (27) of the switch (10) by adjacent electrically-insulative portions (53a, 53c) of the contact element (16).

Abstract: Embodiments of switches (10) include electrically-conductive housings (30, 60), and electrical conductors (34, 64) suspended within and electrically isolated from the housings (30, 60). Another electrical conductor (52) is configured to move between a first position at which the electrical conductor (52) is electrically isolated from the electrical conductors (34, 64) within the housings (30, 60), and a second position at which the electrical conductor (52) is in electrical contact with the electrical conductors (34, 64) within the housings (30, 60). The switches (10) further include an actuator (70, 72, 74, 76) comprising an electrically-conductive base (80) and an electrically-conductive arm (82a, 82b) having a first end restrained by the base (80). The electrical conductor (52) is supported by the arm (82a, 82b), and the arm (82a, 82b) is operative to deflect and thereby move the electrical conductor (52) between its first and second positions.

Abstract: Miniaturized devices such as MEMS switches (10) have encapsulating enclosures (100). The enclosure (100) and the remainder of the switch (10) are fabricated on a concurrent basis by depositing layers of an electrically-conductive material, such as copper, on a substrate (26).

Abstract: Digital data system disposed on a substrate includes a digital data device and at least one digital data interconnect disposed on the substrate. The digital data interconnect is comprised of a plurality of material layers stacked to form a three-dimensional structure. The material layers form a conductive shield, a plurality of straps which are periodically spaced along an interior length of the shield, and a core which includes one or more conductors. The conductors extends along the length of the tubular form parallel to the opposing walls and are suspended on the straps, separated from the conductive shield by an air gap. First and second conductors of the core can facilitate a differential signaling mode.

Abstract: Digital data system disposed on a substrate includes a digital data device and at least one digital data interconnect disposed on the substrate. The digital data interconnect is comprised of a plurality of material layers stacked to form a three-dimensional structure. The material layers form a conductive shield, a plurality of straps which are periodically spaced along an interior length of the shield, and a core which includes one or more conductors. The conductors extends along the length of the tubular form parallel to the opposing walls and are suspended on the straps, separated from the conductive shield by an air gap. First and second conductors of the core can facilitate a differential signaling mode.

Abstract: Systems (100) and methods (900) for providing a compliant micro-coaxial interconnect with an integrated circuit or other electronic device. The methods comprise: forming a well (108) in a first substrate (102) having a first Coefficient of Thermal Expansion (“CTE”); forming at least one three-dimensional micro-coaxial interconnect (100) on the first substrate so as to have a cantilevered end portion (110) disposed over the well; and using a first coupler (606) to electrically couple the cantilevered end portion to a second substrate (604) having a second CTE different from the first CTE. The cantilevered end portion has an angled joint (302) so that at least one of a pushing force and a pulling force applied thereby to the first coupler is minimized when mismatching movements of the first and second substrates occur.

Abstract: Embodiments of switches (10) include first and second electrical conductors (34, 36) suspended within an electrically-conductive housing (28), and a contact element (16) having an electrically-conductive portion (53b) that establishes electrical contact between the first and second electrical conductors (34, 36) when the contact element (16) is in a closed position. The electrically-conductive portion (53b) is electrically isolated from a ground plane (27) of the switch (10) by adjacent electrically-insulative portions (53a, 53c) of the contact element (16).

Abstract: Embodiments of switches (10) include first and second electrical conductors (34, 36) suspended within an electrically-conductive housing (28), and a contact element (16) having an electrically-conductive portion (53b) that establishes electrical contact between the first and second electrical conductors (34, 36) when the contact element (16) is in a closed position. The electrically-conductive portion (53b) is electrically isolated from a ground plane (27) of the switch (10) by adjacent electrically-insulative portions (53a, 53c) of the contact element (16).

Abstract: Embodiments of switches (10) include electrically-conductive housings (30, 60), and electrical conductors (34, 64) suspended within and electrically isolated from the housings (30, 60). Another electrical conductor (52) is configured to move between a first position at which the electrical conductor (52) is electrically isolated from the electrical conductors (34, 64) within the housings (30, 60), and a second position at which the electrical conductor (52) is in electrical contact with the electrical conductors (34, 64) within the housings (30, 60). The switches (10) further include an actuator (70, 72, 74, 76) comprising an electrically-conductive base (80) and an electrically-conductive arm (82a, 82b) having a first end restrained by the base (80). The electrical conductor (52) is supported by the arm (82a, 82b), and the arm (82a, 82b) is operative to deflect and thereby move the electrical conductor (52) between its first and second positions.

Abstract: Miniaturized devices such as MEMS switches (10) have encapsulating enclosures (100). The enclosure (100) and the remainder of the switch (10) are fabricated on a concurrent basis by depositing layers of an electrically-conductive material, such as copper, on a substrate (26).

Abstract: Embodiments of switches (10) include electrically-conductive housings (30, 60), and electrical conductors (34, 64) suspended within and electrically isolated from the housings (30, 60). Another electrical conductor (52) is configured to move between a first position at which the electrical conductor (52) is electrically isolated from the electrical conductors (34, 64) within the housings (30, 60), and a second position at which the electrical conductor (52) is in electrical contact with the electrical conductors (34, 64) within the housings (30, 60). The switches (10) further include an actuator (70, 72, 74, 76) comprising an electrically-conductive base (80) and an electrically-conductive arm (82a, 82b) having a first end restrained by the base (80). The electrical conductor (52) is supported by the arm (82a, 82b), and the arm (82a, 82b) is operative to deflect and thereby move the electrical conductor (52) between its first and second positions.

Abstract: Miniaturized devices such as MEMS switches (10) have encapsulating enclosures (100). The enclosure (100) and the remainder of the switch (10) are fabricated on a concurrent basis by depositing layers of an electrically-conductive material, such as copper, on a substrate (26).

Abstract: Miniaturized devices such as MEMS switches (10) have encapsulating enclosures (100). The enclosure (100) and the remainder of the switch (10) are fabricated on a concurrent basis by depositing layers of an electrically-conductive material, such as copper, on a substrate (26).

Abstract: Embodiments of switches (10) include electrically-conductive housings (30, 60), and electrical conductors (34, 64) suspended within and electrically isolated from the housings (30, 60). Another electrical conductor (52) is configured to move between a first position at which the electrical conductor (52) is electrically isolated from the electrical conductors (34, 64) within the housings (30, 60), and a second position at which the electrical conductor (52) is in electrical contact with the electrical conductors (34, 64) within the housings (30, 60). The switches (10) further include an actuator (70, 72, 74, 76) comprising an electrically-conductive base (80) and an electrically-conductive arm (82a, 82b) having a first end restrained by the base (80). The electrical conductor (52) is supported by the arm (82a, 82b), and the arm (82a, 82b) is operative to deflect and thereby move the electrical conductor (52) between its first and second positions.

Abstract: Embodiments of switches (10) include first and second electrical conductors (34, 36) suspended within an electrically-conductive housing (28), and a contact element (16) having an electrically-conductive portion (53b) that establishes electrical contact between the first and second electrical conductors (34, 36) when the contact element (16) is in a closed position. The electrically-conductive portion (53b) is electrically isolated from a ground plane (27) of the switch (10) by adjacent electrically-insulative portions (53a, 53c) of the contact element (16).

Abstract: A method for constructing a radio frequency filter (100) includes depositing on a dielectric substrate (102) a plurality of layers of a conductive material (210, 216, 218, 220, 222), a dielectric material (217), and a sacrificial material (1200, 1500, 1700, 1900). The deposition is controlled to form at least one transmission line (104, 106, 108) including a shield (202) and a center conductor (204) disposed coaxially within the shield. The deposition is further controlled to form at least one distributed filter element electrically coupled to the center conductor (204), and at least one housing (402) electrically coupled to the shield. The method also includes dissolving at least one layer of the sacrificial material to form an interior channel (226) within at least one shield. The dissolving of the sacrificial material also results in the formation of a interior space within at least one housing containing the distributed filter element.