Abstract: A micro-inverter assembly for use in a photovoltaic system includes a housing, a direct current (DC)-to-alternating current (AC) micro-inverter disposed within the housing, and a DC connector electrically coupled to the DC-to-AC micro-inverter. The DC connector is positioned within a recess formed in a bottom surface of the housing such that at least one electrical contact of the DC connector is accessible from outside the housing. According to alternative embodiments, the DC connector comprises a plug-and-play connector constructed for one of a rotational engagement and a translational engagement with a DC connector of a photovoltaic (PV) panel.

Abstract: An alternating current (AC) harness for a photovoltaic (PV) system includes a wire assembly having a first end and a second end, the wire assembly having a plurality of lead wires, and at least one AC connection module positioned at a location along a length of the wire assembly between the first end and the second end. Further, the at least one AC connection module includes a first connection terminal electrically coupled to the plurality of lead wires of the wire assembly and constructed to electrically couple the wire assembly with an output of a first PV module of the PV system. The at least one AC connection module also includes a second connection terminal electrically coupled to the plurality of lead wires of the wire assembly and constructed to electrically couple the wire assembly with an output of a second PV module of the PV system.

Abstract: A micro-inverter assembly for use in a photovoltaic system includes a housing, a direct current (DC)-to-alternating current (AC) micro-inverter disposed within the housing, and a DC connector electrically coupled to the DC-to-AC micro-inverter. The DC connector is positioned within a recess formed in a bottom surface of the housing such that at least one electrical contact of the DC connector is accessible from outside the housing. According to alternative embodiments, the DC connector comprises a plug-and-play connector constructed for one of a rotational engagement and a translational engagement with a DC connector of a photovoltaic (PV) panel.

Abstract: A micro-inverter assembly includes a housing having an opening formed in a bottom surface thereof, and a direct current (DC)-to-alternating current (AC) micro-inverter disposed within the housing at a position adjacent to the opening. The micro-inverter assembly further includes a micro-inverter DC connector electrically coupled to the DC-to-AC micro-inverter and positioned within the opening of the housing, the micro-inverter DC connector having a plurality of exposed electrical contacts.

Abstract: A deployable solar panel system including a basic unit of a plurality of photovoltaic (PV) panels electrically interconnected to each other and mechanically interconnected to each other by a hinge bonded to each PV panel, thereby allowing the basic unit to be folded for transportation and storage into a compact form and then unfolded for installation.

Abstract: An alternating current (AC) harness for a photovoltaic (PV) system includes a wire assembly having a first end and a second end, the wire assembly having a plurality of lead wires, and at least one AC connection module positioned at a location along a length of the wire assembly between the first end and the second end. Further, the at least one AC connection module includes a first connection terminal electrically coupled to the plurality of lead wires of the wire assembly and constructed to electrically couple the wire assembly with an output of a first PV module of the PV system. The at least one AC connection module also includes a second connection terminal electrically coupled to the plurality of lead wires of the wire assembly and constructed to electrically couple the wire assembly with an output of a second PV module of the PV system.

Abstract: A micro-inverter assembly includes a housing having an opening formed in a bottom surface thereof, and a direct current (DC)-to-alternating current (AC) micro-inverter disposed within the housing at a position adjacent to the opening. The micro-inverter assembly further includes a micro-inverter DC connector electrically coupled to the DC-to-AC micro-inverter and positioned within the opening of the housing, the micro-inverter DC connector having a plurality of exposed electrical contacts.

Abstract: An organic electroluminescent device includes a transparent substrate having a conductive coating, a plurality of electroactive layers, a cathode layer, and a protective wax layer. The wax layer may be disposed directly on an electrode, particularly a cathode. The wax layer alone protects the cathode and no getter material is required to exclude oxygen and/or moisture. An OLED lighting device capable of emitting light from front and back surfaces, wherein an adhesive layer, particularly a wax layer, is disposed between cathodes of two organic electroluminescent devices positioned back to back.

Abstract: An article of manufacture comprises a thin film solid state lighting device, such as an organic light emitting diode (OLED) device, having a planar light emitting side and an opposite planar mounting side and including electrodes disposed on the planar mounting side of the thin film solid state lighting device, the electrodes including a magnetic material configured to conductively convey electrical drive current to drive the thin film solid state lighting device to emit light at the planar light emitting principal side. The article of manufacture may further comprise a fixture having a planar surface with magnets arranged to mate with the electrodes to magnetically secure the thin film solid state lighting device with the fixture and to concurrently form electrically conductive paths including the magnetic material of the electrodes configured to conductively convey electrical drive current. Thus this magnetic connection provides both mechanical support and electrical conduction path.

Abstract: Packaged optoelectronic device include a first barrier layer having a plurality of feedthrough apertures communicating with at least one electrode layer of the device, and a plurality of conductive patches disposed on at least one of the plurality of feedthrough apertures for electrically connecting the device to a power supply. Each conductive patch includes a conductive metal surface layer and a non-conducting surface layer having an opening exposing the metal surface layer.

Abstract: An optoelectonice device array includes a plurality of packages, each enclosing an optoelectronic device, and positioned in at least one row. Each package overlaps at least one adjacent package, and may be hermetically sealed.

Abstract: An optoelectronic device having a monolithic interconnect structure includes a continuous anode layer, a discontinuous cathode layer, and an electroactive layer sandwiched between the continuous anode layer and the discontinuous cathode layer.

Abstract: An encapsulated optoelectronic device includes: a first barrier layer; an electroluminescence device coupled to the first barrier layer, and comprising a substrate and an electroluminescence element both defining a lateral side, and the electroluminescence element comprising a first electrode disposed on the substrate, a second electrode, and an optoelectronically active layer between the first and second electrodes; a second barrier layer coupled to the electroluminescence device; and an adhesive located between and connecting the first and second barrier layers, and at least coupled to the lateral side of the electroluminescence device to seal the electroluminescence device; a first conductive area electrically coupled to the first electrode and electrically insulated from the second electrode and a second conductive area; the second conductive area electrically coupled to the second electrode and electrically insulated from the first electrode and the first conductive area.

Abstract: An optoelectonice device array includes a plurality of packages, each enclosing an optoelectronic device, and positioned in at least one row. Each package overlaps at least one adjacent package, and may be hermetically sealed.

Abstract: An optoelectronic device having a monolithic interconnect structure includes a continuous anode layer, a discontinuous cathode layer, and an electroactive layer sandwiched between the continuous anode layer and the discontinuous cathode layer.

Abstract: Packaged optoelectronic device include a first barrier layer having a plurality of feedthrough apertures communicating with at least one electrode layer of the device, and a plurality of conductive patches disposed on at least one of the plurality of feedthrough apertures for electrically connecting the device to a power supply. Each conductive patch includes a conductive metal surface layer and a non-conducting surface layer having an opening exposing the metal surface layer.

Abstract: A hermetic electrical package includes a first transparent barrier layer; a second barrier layer bonded to the first barrier layer, and defining a plurality of feedthrough apertures; an optoelectronic device sandwiched between the first and second barrier layers, the optoelectronic device comprising an anode, a photoelectrically active layer, and a cathode; and a conductive patch electrically coupled to the cathode or anode and disposed across at least one feedthrough aperture.

Abstract: An article of manufacture comprises a thin film solid state lighting device, such as an organic light emitting diode (OLED) device, having a planar light emitting side and an opposite planar mounting side and including electrodes disposed on the planar mounting side of the thin film solid state lighting device, the electrodes including a magnetic material configured to conductively convey electrical drive current to drive the thin film solid state lighting device to emit light at the planar light emitting principal side. The article of manufacture may further comprise a fixture having a planar surface with magnets arranged to mate with the electrodes to magnetically secure the thin film solid state lighting device with the fixture and to concurrently form electrically conductive paths including the magnetic material of the electrodes configured to conductively convey electrical drive current. Thus this magnetic connection provides both mechanical support and electrical conduction path.

Abstract: An encapsulated optoelectronic device includes: a first barrier layer; an electroluminescence device configured to be coupled to the first barrier layer, and comprising a substrate and an electroluminescence element both defining a lateral side, and the electroluminescence element comprising a first electrode disposed on the substrate, a second electrode, and an optoelectronically active layer disposed between the first and second electrodes; a second barrier layer configured to be coupled to the electroluminescence device; and an adhesive configured to locate between and connect the first and second barrier layers, and at least to be coupled to the lateral side of the electroluminescence device to seal the electroluminescence device between the first and second barrier layers; a first conductive area disposed on the first barrier layer, located between the first and second barrier layers, and configured to be electrically coupled to the first electrode and electrically insulated from the second electrode and

Abstract: An illumination source including a first OLED layer capable of emitting light of a first color, a second OLED layer capable of emitting light of a second color and disposed on the first OLED layer, each of said first, second OLED layers including alternating active light-emitting areas and inactive non-light emitting areas; said first OLED layer comprising a first substrate, a first transparent electrode layer disposed on the substrate, a first electroluminescent layer capable of emitting light of the first color disposed on the first transparent electrode layer, and a first patterned metallized electrode layer forming the alternating active light-emitting areas and inactive non-light emitting areas; and said second OLED layer comprising a second substrate, a second transparent electrode layer disposed on the substrate, a second electroluminescent layer capable of emitting light of the second color disposed on the second transparent electrode layer, and a second patterned metallized electrode layer forming th