Abstract: A laser machining system is used to precision laser drill holes in an elastomeric material, preferably silicone rubber, to form holes to support miniature electronic components temporarily while they are being processed or tested. The holes are formed by directing laser pulses from a laser to a top surface of the elastomeric material in a plurality of passes in a direction proceeding from a non-zero inner diameter to the desired diameter or from the desired diameter to the inner diameter. The plurality of passes forms a first pattern such that a successive pass of the plurality of passes overlaps a previous pass of the plurality of passes. The first pattern is repeated without changing direction or the first pattern is repeated while reversing the direction until the hole is formed through a bottom surface of the elastomeric material.

Abstract: A method and laser processing system (2) addresses a substrate (102) with three different sets of laser processing parameters to achieve different surface effects in the substrate (102). A first set of laser parameters is employed to form a recess (106) in the substrate. A second set of laser parameters is employed to polish a surface (108) of the recess (106). A third set of laser parameters is employed to modify a polished surface (108) of the recess (106) to have optical characteristics that satisfy conditions for a desirable visual appearance.

Abstract: The invention is method and an apparatus for performing the method having the steps of providing a workpiece, cleaving the workpiece to form a first unit piece and a second unit piece having a spatial relationship with the first unit piece in which the second unit piece abuts the first unit piece. Without substantially altering the spatial relationship after cleaving the workpiece, forming a first crack within the first unit piece and propagating the first crack from the first unit piece into the second unit piece.

Abstract: A laser machining system is used to precision laser drill holes in an elastomeric material, preferably silicone rubber, to form holes to support miniature electronic components temporarily while they are being processed or tested. The holes are formed by directing laser pulses from a laser to a top surface of the elastomeric material in a plurality of passes in a direction proceeding from a non-zero inner diameter to the desired diameter or from the desired diameter to the inner diameter. The plurality of passes forms a first pattern such that a successive pass of the plurality of passes overlaps a previous pass of the plurality of passes. The first pattern is repeated without changing direction or the first pattern is repeated while reversing the direction until the hole is formed through a bottom surface of the elastomeric material.