Abstract: Systems and methods relating to improving the experience of gig-economy workers are disclosed, with particular reference to gig-economy work involving vehicle use. During or after performance of gig-economy work, data automatically collected may be used to generate and present recommendations or education points to gig-economy workers. Such recommendations may include targeted alerts to notify gig-economy workers of high-demand situations or to coordinate between gig-economy workers and gig-economy customers. Alerts may be generated based upon current excess demand for gig-economy services, as well as gig-economy worker availability and preferences. For example, alerts may be generated in response to detecting emergency conditions in an area in order to mobilize a large number of gig-economy transportation service providers.

Abstract: The present invention automates the operation of multiple malware removal software products using a computerized system that systematically operates the multiple selected software products. These products are operated them in a customized “Safe Mode” using a shell that is different than the computer's other shell environments. Unlike the ordinary Safe Modes shells, the Custom Safe Mode prevents malware from functioning that ties itself to the normal shell, such as the Windows Explorer shell. In addition, the Custom Safe Mode allows the automation of tasks beyond that which is available under the standard command line shell.

Abstract: Modified MZ (Mach-Zender) interferometers are utilized to analyze the transmitted, aspherical wavefront of an ophthalmic lens by mounting the lens in a cuvette having a rotatable carousel that can hold multiple lenses. Fresh, temperature controlled, saline solution is circulated about the lenses, and the cuvette is positioned in a vertical test arm of the interferometer configuration. Reverse raytracing is utilized to remove aberrations induced into the wavefront as it is imaged from immediately behind the lens to the detector of the interferometer.

Abstract: The present invention automates the operation of multiple malware removal software products using a computerized system that systematically operates the multiple selected software products. These products are operated them in a customized “Safe Mode” using a shell that is different than the computer's other shell environments. Unlike the ordinary Safe Modes shells, the Custom Safe Mode prevents malware from functioning that ties itself to the normal shell, such as the Windows Explorer shell. In addition, the Custom Safe Mode allows the automation of tasks beyond that which is available under the standard command line shell.

Abstract: The present invention automates the operation of multiple malware removal software products using a computerized system that systematically operates the multiple selected software products. These products are operated them in a customized “Safe Mode” using a shell that is different than the computer's other shell environments. Unlike the ordinary Safe Modes shells, the Custom Safe Mode prevents malware from functioning that ties itself to the normal shell, such as the Windows Explorer shell. In addition, the Custom Safe Mode allows the automation of tasks beyond that which is available under the standard command line shell.

Abstract: The present invention automates the operation of multiple malware removal software products using a computerized system that systematically operates the multiple selected software products. These products are executed within a customized Diagnostic Operating System, which is different from the Normal Operating System in which the computer normally operates. Thus, any malware that may be attached to any of the programs, shells, drivers, services, or data files associated with the Normal Operating System cannot corrupt the malware removal process performed under the Diagnostic Operating System. Preferably, the Diagnostic Operating System is accessed from a read-only device prepared on a secure computer separate from the computer that is the target of the malware removal process, and the Diagnostic Operating System executes in a read-only environment.

Abstract: The present invention automates the operation of multiple malware removal software products using a computerized system that systematically operates the multiple selected software products. These products are executed within a customized Diagnostic Operating System, which is different from the Normal Operating System in which the computer normally operates. Thus, any malware that may be attached to any of the programs, shells, drivers, services, or data files associated with the Normal Operating System cannot corrupt the malware removal process performed under the Diagnostic Operating System. Preferably, the Diagnostic Operating System is accessed from a read-only device prepared on a secure computer separate from the computer that is the target of the malware removal process, and the Diagnostic Operating System executes in a read-only environment.

Abstract: The present invention automates the operation of multiple malware removal software products using a computerized system that systematically operates the multiple selected software products. These products are operated them in a customized “Safe Mode” using a shell that is different than the computer's other shell environments. Unlike the ordinary Safe Modes shells, the Custom Safe Mode prevents malware from functioning that ties itself to the normal shell, such as the Windows Explorer shell. In addition, the Custom Safe Mode allows the automation of tasks beyond that which is available under the standard command line shell.

Abstract: Modified MZ (Mach-Zender) interferometers are utilized to analyze the transmitted, aspherical wavefront of an ophthalmic lens by mounting the lens in a cuvette having a rotatable carousel that can hold multiple lenses. Fresh, temperature controlled, saline solution is circulated about the lenses, and the cuvette is positioned in a vertical test arm of the interferometer configuration. Reverse raytracing is utilized to remove aberrations induced into the wavefront as it is imaged from immediately behind the lens to the detector of the interferometer.

Abstract: A wafer polishing head utilizes a wafer backing member having a wafer facing pocket which is sealed against the wafer and is pressurized with air or other fluid to provide a uniform force distribution pattern across the width of the wafer inside an edge seal feature at the perimeter of the wafer to urge (or press) the wafer uniformly toward a polishing pad. Wafer polishing is carried out uniformly without variations in the amount of wafer material across the usable area of the wafer. A frictional force between the seal feature of the backing member and the surface of the wafer transfers rotational movement of the head to the wafer during polishing. A pressure controlled bellows supports and presses the wafer backing member toward the polishing pad and accommodates any dimensional variation between the polishing head and the polishing pad as the polishing head is moved relative to the polishing pad.

Abstract: A flash curing system for solid freeform fabrication which generates a plurality of radiation emitting pulses that forms a planar flash. The planar flash initiates curing of a curable material dispensed by a solid freeform fabrication apparatus. The radiation emitting pulses have a high peak power value that releases a sufficient quantity of free radicals from the photoinitiator to initiate curing and overcome the problem of oxygen inhibition. Substantially less power is consumed and less heat generated by the flash curing system compared to conventional continuous emission curing systems.

Abstract: A chemical mechanical head includes a retaining ring to maintain a substrate beneath the mounting surface during polishing. The retaining ring has a lower portion with a bottom surface for contacting a polishing pad during polishing and made of a first material, such as plastic, and an upper portion made of a second, different material, such as metal.

Abstract: A wafer polishing head utilizes a wafer backing member having a wafer facing pocket which is sealed against the wafer and is pressurized with air or other fluid to provide a uniform force distribution pattern across the width of the wafer inside an edge seal feature at the perimeter of the wafer to urge (or press) the wafer uniformly toward a polishing pad. A pressure controlled bellows supports and presses the wafer backing member toward the polishing pad and accommodates any dimensional variation between the polishing head and the polishing pad as the polishing head is moved relative to the polishing pad. An integral, but independently retractable and extendable retaining ring assembly is provided around the wafer backing member and wafer to uniformly and independently control the pressure of a wafer perimeter retaining ring on the polishing ad of a wafer polishing bed.

Abstract: A telephone call connection architecture is disclosed which establishes a call connection between two parties. A caller at a caller location initiates a call request to an intermediate location over a first communication network requesting a call be connected to a callee at a callee location over a second communication network. The caller location is connected to the callee location over the second communication network in response to the call request being made over the first communication network. In both a call back and call collect scenario, the caller initiates the call request to the intermediate location. However, in a call back situation, the caller is ultimately charged for the call, while in a call collect situation, the callee authorizes charges for the call.

Abstract: A wafer polishing head utilizes a wafer backing member having a wafer facing pocket which is sealed against the wafer and is pressurized with air or other fluid to provide a uniform force distribution pattern across the width of the wafer inside an edge seal feature at the perimeter of the wafer to urge (or press) the wafer uniformly toward a polishing pad. Wafer polishing is carried out uniformly without variations in the amount of wafer material across the usable area of the wafer. A frictional force between the seal feature of the backing member and the surface of the wafer transfers rotational movement of the head to the wafer during polishing. A pressure controlled bellows supports and presses the wafer backing member toward the polishing pad and accommodates any dimensional variation between the polishing head and the polishing pad as the polishing head is moved relative to the polishing pad.

Abstract: A wafer polishing head utilizes a wafer backing member having a wafer facing pocket which is sealed against the wafer and is pressurized with air or other fluid to provide a uniform force distribution pattern across the width of the wafer inside an edge seal feature at the perimeter of the wafer to urge (or press) the wafer uniformly toward a polishing pad. Wafer polishing is carried out uniformly without variations in the amount of wafer material across the usable area of the wafer. A frictional force between the seal feature of the backing member and the surface of the wafer transfers rotational movement of the head to the wafer during polishing. A pressure controlled bellows supports and presses the wafer backing member toward the polishing pad and accommodates any dimensional variation between the polishing head and the polishing pad as the polishing head is moved relative to the polishing pad.

Abstract: A wafer polishing head utilizes a wafer backing member having a wafer facing pocket which is sealed against the wafer and is pressurized with air or other fluid to provide a uniform force distribution pattern across the width of the wafer inside an edge seal feature at the perimeter of the wafer to urge (or press) the wafer uniformly toward a polishing pad. Wafer polishing is carried out uniformly without variations in the amount of wafer material across the usable area of the wafer. A frictional force between the seal feature of the backing member and the surface of the wafer transfers rotational movement of the head to the wafer during polishing. A pressure controlled bellows supports and presses the wafer backing member toward the polishing pad and accommodates any dimensional variation between the polishing head and the polishing pad as the polishing head is moved relative to the polishing pad.

Abstract: A wafer polishing head utilizes a wafer backing member having a wafer facing pocket which is sealed against the wafer and is pressurized with air or other fluid to provide a uniform force distribution pattern across the width of the wafer inside an edge seal feature at the perimeter of the wafer to urge (or press) the wafer uniformly toward a polishing pad. Wafer polishing is carried out uniformly without variations in the amount of wafer material across the usable area of the wafer. A frictional force between the seal feature of the backing member and the surface of the wafer transfers rotational movement of the head to the wafer during polishing. A pressure controlled bellows supports and presses the wafer backing member toward the polishing pad and accommodates any dimensional variation between the polishing head and the polishing pad as the polishing head is moved relative to the polishing pad.

Abstract: A wafer polishing head utilizes a wafer backing member having a wafer facing pocket which is sealed against the wafer and is pressurized with air or other fluid to provide a uniform force distribution pattern across the width of the wafer inside an edge seal feature at the perimeter of the wafer to urge (or press) the wafer uniformly toward a polishing pad. Wafer polishing is carried out uniformly without variations in the amount of wafer material across the usable area of the wafer. A frictional force between the seal feature of the backing member and the surface of the wafer transfers rotational movement of the head to the wafer during polishing. A pressure controlled bellows supports and presses the wafer backing member toward the polishing pad and accommodates any dimensional variation between the polishing head and the polishing pad as the polishing head is moved relative to the polishing pad.

Abstract: The outermost gutter of a reheat system has an extended outer wall to two or three times the length of the inner wall of the outermost gutter. This causes a single vortex to develop instead of the usual two vortices giving an increased basic burning stability.The outer wall also protects the jet pipe from excess heat.