Abstract: Mechanical modifications to a spinal rod that will enable the rod to accept various coating technologies in such a way that the spinal construct's biomechanical performance is not compromised. These modifications preserve construct biomechanics in the presence of a coating and increase the bactericidal payload of an anti-infective spinal rod coating.

Abstract: A waste bag dispensing system comprising a base member defining a cavity configured to receive a waste bag roll, a cap configured to removably secure to the base member, a slit opening extending through the base member, a separator, and a securement means to secure the system to an object, such as a leash. The roll may comprise a plurality of waste bags in perforated connection around a hollow spool configured to removably receive a base friction post and a cap friction post, the friction posts applying a lateral pressure on the waste bag roll and a tab may apply pressure on an exterior of the roll. An end of the roll may extend through the slit opening towards the separator which may engage the perforated connection and permit the removal of one waste bag from the roll. The securement means may comprise a lateral and vertical stability means.

Abstract: The present invention relates to compounds of formula I that function as inhibitors of RET (rearranged during transfection) kinase enzyme activity: wherein HET, X1, X2, X3, X4, integer a and R3 are each as defined herein. The present invention also relates to processes for the preparation of these compounds, to pharmaceutical compositions comprising them, and to their use in the treatment of proliferative disorders, such as cancer, as well as other diseases or conditions in which RET kinase activity is implicated.

Abstract: Novel tools and techniques are provided for implementing global Internet Protocol management system (“GIMS”) for monitoring network devices for fault management. In various embodiments, a computing system may receive a first alert associated with a first device among layer 2 and/or layer 3 devices disposed in a plurality of networks; may collect first alert data and/or first device data; may store the first alert together with the collected first alert data and/or first device data as first consolidated alert data in a first database; may perform, using an enrichment system, enrichment of the first alert, by retrieving first enrichment data from one or more second databases and adding the first enrichment data to the first consolidated alert data in the first database; and may send the first consolidated alert data to a fault management system for display to a user to facilitate addressing of the first alert by the user.

Abstract: Novel tools and techniques are provided for implementing real-time fault management or real-time fault management system (“RFM”). In various embodiments, RFM may receive alerts from or associated with network devices (e.g., layer 2, 3, and/or 4 devices, or the like) that are disposed in a plurality of disparate networks that may utilize different alert management protocols and/or different fault management protocols. RFM may collect, enrich, normalize, aggregate, and display the alerts in a user interface to facilitate addressing of the alerts by a user. To enable continuous and real-time functionality, RFM may be implemented in a plurality of siloed platforms in a primary data center, with processing of alerts being load balanced across the siloed platforms, with mirrored group of siloed platforms in a secondary data center located geographically distant from the primary data center and configured to be on “hot standby” and to completely take over RFM processing operations.

Abstract: A hybrid experimental-numerical approach is disclosed to determine the Mixed Mode (I/III) dynamic fracture initiation toughness of engineering materials. Cylindrical Aluminum alloy specimens with a V-notch spiral crack on the surface at spiral angles of 0°, 11.25°, 22.5°, 33.75°, and 45° are subjected to dynamic torsion load using torsional Hopkinson bar apparatus. The torque applied to the specimen at the onset of fracture is measured through strain gages attached to the incident and transmitter bars. A stereo digital image correlation is performed to measure the full-field deformation, and the crack mouth opening displacement as a function of loading time and is used to estimate the time at which the crack initiation is started. The dynamic stress intensity factors are extracted numerically based on the dynamic interaction integral method using Abaqus. The Mode-I (KId), Mode-III (KIIId), and Mixed Mode (K(I/III)d) dynamic initiation toughness is presented as a function of spiral angles and loading rate.

Abstract: A coupling device provides galvanic isolation using a leadframe that is configured to support two integrated circuit chips in a coplanar manner. Each chip contains an inductive coupling coil. The lead frame includes a set of bond pads for attaching bond wires to couple to the two integrated circuit chips. Two separated die attach pads support the two chips. Each die attach pad is configured to support one of the two integrated circuit chips with a plurality of cantilevered fingers.

Abstract: An applicator head for applying an adhesive tape on a surface or substrate, wherein the adhesive tape comprises a material and at least one removable liner, the applicator head comprising: an application tip; a cutting mechanism positioned adjacent an outer most point of the application tip; a positioning device is configured such that the cutting mechanism severs the material while maintaining the at least one removable liner intact.

Abstract: A system comprising: a source of a tape comprising a material associated with an adhesive and at least one removable liner; an applicator head; a cutting mechanism; at least one drive feeding mechanism configured to index the tape from the source to the applicator head at a controlled rate; wherein the applicator head is controllable to apply the material on a surface or a substrate; and wherein the applicator head comprises a cutting mechanism configured to sever the material while leaving the at least one removable liner intact.

Abstract: A feeding system configured to transport a material to a tape applicator, the feeding system comprising: a flexible conduit coupled between a spool unloading device and a tape applicator, wherein the flexible conduit receives the material from a source; and a fluid amplifier coupled to the flexible conduit to facilitate movement of the material therein by creating a vacuum effect.

Abstract: A spool unloading device comprising: a spindle; a first bulk spool of material is mounted on the spindle, wherein the spindle is rotatably controlled to dispense the material; a series of pulleys for receiving the unspooled material such that a variable length of the material is stored within the device before exiting the device to an upstream equipment; and a drive mechanism for indexing the unspooled material exiting the spool unloading machine at a controlled rate.

Abstract: A coupling device provides galvanic isolation using a leadframe that is configured to support two integrated circuit chips in a coplanar manner. Each chip contains an inductive coupling coil. The lead frame includes a set of bond pads for attaching bond wires to couple to the two integrated circuit chips. Two separated die attach pads support the two chips. Each die attach pad is configured to support one of the two integrated circuit chips with a plurality of cantilevered fingers.

Abstract: A self contained, automatic water quality monitoring and treatment system includes a water quality interface control module having a signal processor configured to: receive signaling containing information about a baseline test of pH and ORP levels of water to be monitored and also about a subsequent test of the pH and ORP levels of water to be monitored later in time to the baseline test; determine corresponding signaling containing information about the quality of the water being monitored based upon a percentage of change between the baseline test and the subsequent test later in time to the baseline of the pH and ORP levels of water being monitored; and provide the corresponding signaling for remote awareness, including wireless signaling for providing mobile or Internet awareness, and/or for controlling the treatment of the water being monitored.

Abstract: A coupling device provides galvanic isolation using a leadframe that is configured to support two integrated circuit chips in a coplanar manner. Each chip contains an inductive coupling coil. The lead frame includes a set of bond pads for attaching bond wires to couple to the two integrated circuit chips. Two separated die attach pads support the two chips. Each die attach pad is configured to support one of the two integrated circuit chips with a plurality of cantilevered fingers.

Abstract: An embedded coil assembly embodiment includes a ferrite ring having an annular axis. The ferrite ring is positioned on a conductive metal surface. A plurality of separate, spaced apart conductive structures extend over the ferrite ring and are attached to the conductive metal surface in a first region of the conductive surface positioned radially outwardly of the annular axis of the ferrite ring and in a second region of the conductive surface positioned radially inwardly of the annular axis of the ferrite ring. An encapsulation layer covers, the ferrite ring and at least a portion of the plurality of conductive structures.

Abstract: An electronics module includes a housing with: (i) a forced convection chamber including an internal forced convection space; and, (ii) a passive chamber including an internal passive space that is separated from the forced convection space. At least one fan is connected to the housing and adapted to induce forced convection airflow in the forced convection space. A heat sink is connected to the housing and includes: (i) a heat input portion exposed to the passive space; and, (ii) a heat output portion exposed to the forced convection space. A circuit board assembly is located in the passive space and includes at least one electronic component that is thermally engaged with the heat input portion of the heat sink. A clamping plate is secured to the heat sink and captures the circuit board to the heat sink. The circuit board is isolated from the fan-induced forced convection airflow.

Abstract: A hybrid experimental-numerical approach is disclosed to determine the Mixed Mode (I/III) dynamic fracture initiation toughness of engineering materials. Cylindrical Aluminum alloy specimens with a V-notch spiral crack on the surface at spiral angles of 0°, 11.25°, 22.5°, 33.75°, and 45° are subjected to dynamic torsion load using torsional Hopkinson bar apparatus. The torque applied to the specimen at the onset of fracture is measured through strain gages attached to the incident and transmitter bars. A stereo digital image correlation is performed to measure the full-field deformation, and the crack mouth opening displacement as a function of loading time and is used to estimate the time at which the crack initiation is started. The dynamic stress intensity factors are extracted numerically based on the dynamic interaction integral method using Abaqus. The Mode-I (KId), Mode-III (KIIId), and Mixed Mode (K(I/III)d) dynamic initiation toughness is presented as a function of spiral angles and loading rate.

Abstract: An embedded coil assembly embodiment includes a ferrite ring having an annular axis. The ferrite ring is positioned on a conductive metal surface. A plurality of separate, spaced apart conductive structures extend over the ferrite ring and are attached to the conductive metal surface in a first region of the conductive surface positioned radially outwardly of the annular axis of the ferrite ring and in a second region of the conductive surface positioned radially inwardly of the annular axis of the ferrite ring. An encapsulation layer covers, the ferrite ring and at least a portion of the plurality of conductive structures.

Abstract: A coupling device provides galvanic isolation using a leadframe that is configured to support two integrated circuit chips in a coplanar manner. Each chip contains an inductive coupling coil. The lead frame includes a set of bond pads for attaching bond wires to couple to the two integrated circuit chips. Two separated die attach pads support the two chips. Each die attach pad is configured to support one of the two integrated circuit chips with a plurality of cantilevered fingers.

Abstract: A coupling device provides galvanic isolation using a leadframe that is configured to support two integrated circuit chips in a coplanar manner. Each chip contains an inductive coupling coil. The lead frame includes a set of bond pads for attaching bond wires to couple to the two integrated circuit chips. Two separated die attach pads support the two chips. Each die attach pad is configured to support one of the two integrated circuit chips with a plurality of cantilevered fingers.