Abstract: A method of operating variable pitch fans in series to cool an operating computer system. The method comprises running a first variable pitch fan with blades positioned at an operational pitch to induce airflow through the computer system and through a second variable pitch fan disposed in series with the first fan, and, simultaneously, not running the second variable pitch fan with blades positioned for minimal impedance to the airflow. In response to detecting a failure condition of the first fan, the method includes running the second fan with blades positioned at an operational pitch to induce airflow through the computer system and through the first fan, and, simultaneously, not running the first fan with blades positioned for minimal impedance to the airflow. Preferably, the method includes locking the rotor of a fan that is not running, and locking the blades of the non-running fan in a minimal impedance position.

Abstract: In one embodiment, a single electrical power supply is used to interchangeably power either a single motherboard or dual motherboards. Switchable output power and individual sequencing may be provided to each motherboard using FETs, such that the power supply may respond to the sequencing of each motherboard as if it were dedicated to that motherboard. In a two motherboard system, power to the first motherboard is reduced by removing some output voltages from the first motherboard. Fault circuitry may also be provided so that a power related fault on one domain does not affect operation of the other motherboard.

Abstract: A rack for supporting electronic devices and modules with adjustable rails. The rack has a vertical wall with a set of holes at various elevations, each set of holes including at least a proximal hole evenly spaced apart from a distal hole. A longitudinally-extending rail has a set of clips for selectively securing the rail to the vertical wall, wherein the set of clips includes at least a proximal clip selectively receivable in the proximal hole at a selected elevation for supporting a proximal end of the rail and a distal clip selectively receivable in the distal hole at the selected elevation for supporting a distal end of the rail. The system may include a second rail for securing to an opposing vertical wall of the rack to form a shelf or bay for an electronic device. Each rail may be latched in place and can be selectively installed and removed without use of tools.

Abstract: An apparatus, system, and method are disclosed for identifying and differentiating among multiple groups of devices, comprising at least two LEDs, a controller, and a blending medium. The at least two LEDs emit a wavelength of light that is different from a wavelength of each other LED. The controller drives the at least two LEDs to each emit light at specified intensities in response to a color identifying value. The blending medium combines the light emitted by the at least two LEDs into an identifying color that identifies a group of devices.

Abstract: A system comprising a chassis that includes a plurality of modules and a fan assembly disposed in a distal end of the chassis for drawing air in parallel pathways through the plurality of modules. At least one of the modules is a compute module having a thermal sensor disposed to sense the temperature of air flowing across a processor mounted on a motherboard. The system further comprises a fan controller receiving output from the thermal sensor, wherein the fan controller operates the fan assembly to cool the plurality of modules and maintain the thermal sensor output within an operating temperature range. The fan controller controls the fan speed according to predetermined thermal profile settings associated with one of the compute modules received in the chassis. For example, the predetermined thermal profile settings may include a minimum fan speed, a maximum fan speed, and control loop feedback settings.

Abstract: Method and apparatus for blind docking an electronic device or module with an electrical connector, for example within a rack for a computer system. A forwardly-directed power connector is secured to a distal end of at least one rail or shelf bracket for blind docking with a rearwardly-directed power connector on the electronic module. The shelf bracket securing the forwardly-directed electrical connector is included in a pair of longitudinally-extending shelf brackets secured to opposing vertical side walls of a rack at a common elevation to form a module bay. The electronic module may slide along the shelf bracket until a rearwardly-directed power connector of the electronic module blind docks with the forwardly-directed power connector. A boss or alignment stud may be included on the bracket to improve alignment of the connectors. The forwardly-direct electrical connector may also be secured to the bracket with a floating connection to enable minor adjustments in alignment during blind docking.

Abstract: A power supply module configured for removable insertion into a power supply bay of an electronic system. A telescopic power connector disposed within the power supply housing includes a plurality of internal fixed contacts in electrical communication with an electrical socket and a movable member carrying a plurality of elongate sliding contacts in sliding contact with the internal fixed contacts. The movable member is movable generally perpendicular to an insertion direction of the power supply housing. A mechanical actuator is configured for moving the movable member of the telescopic power connector into connection with an external power connector, such as on a motherboard, so that ends of the sliding contacts are moved into electrical connection with terminals on the external power connector while remaining in sliding contact with the internal fixed contacts.

Abstract: Rack assemblies and methods for cooling one or more rack-based computer systems, as well as data center configurations that utilize the rack assembly. The rack assembly comprises a rack providing support for multiple columns of heat-generating electronic devices and device fans for moving air from an air inlet side of the rack through the devices and through an air outlet side of the rack. The rack assembly also comprises a unitary door having a support frame spanning the air outlet side of the rack and hingedly coupling the door to a rear vertical edge of the rack. The door includes an air-to-liquid heat exchanger panel spanning an air outlet passage inside the support frame so that substantially all of the air passing through the air outlet must pass through the heat exchanger panel. The air outlet passage has a cross-sectional area that is substantially equal to or greater than the cross-sectional area of the multiple columns of heat-generating devices.

Abstract: A power supply module configured for removable insertion into a power supply bay of an electronic system. A telescopic power connector disposed within the power supply housing includes a plurality of internal fixed contacts in electrical communication with an electrical socket and a movable member carrying a plurality of elongate sliding contacts in sliding contact with the internal fixed contacts. The movable member is movable generally perpendicular to an insertion direction of the power supply housing. A mechanical actuator is configured for moving the movable member of the telescopic power connector into connection with an external power connector, such as on a motherboard, so that ends of the sliding contacts are moved into electrical connection with terminals on the external power connector while remaining in sliding contact with the internal fixed contacts.

Abstract: A system for receiving and supporting a plurality of devices connected to a network. The system comprises a rack having a front side providing access to a plurality of chassis bays for receiving a chassis and aligning a back end of the chassis for blind docking with an electrical power source. The chassis includes a power supply, a fan, and a front side providing access to a plurality of module bays for receiving a module and aligning a back end of the module for blind docking with the power supply. A compute module is received in a module bay and directly blind docked to the power supply. The system further includes at least one other module received in a module bay within the same chassis as the compute module and directly blind docked with the same power supply along with the compute module.

Abstract: Method and apparatus for blind docking an electronic device or module with an electrical connector, for example within a rack for a computer system. A forwardly-directed power connector is secured to a distal end of at least one rail or shelf bracket for blind docking with a rearwardly-directed power connector on the electronic module. The shelf bracket securing the forwardly-directed electrical connector is included in a pair of longitudinally-extending shelf brackets secured to opposing vertical side walls of a rack at a common elevation to form a module bay. The electronic module may slide along the shelf bracket until a rearwardly-directed power connector of the electronic module blind docks with the forwardly-directed power connector. A boss or alignment stud may be included on the bracket to improve alignment of the connectors. The forwardly-direct electrical connector may also be secured to the bracket with a floating connection to enable minor adjustments in alignment during blind docking.

Abstract: A rack for supporting electronic devices and modules with adjustable rails. The rack has a vertical wall with a set of holes at various elevations, each set of holes including at least a proximal hole evenly spaced apart from a distal hole. A longitudinally-extending rail has a set of clips for selectively securing the rail to the vertical wall, wherein the set of clips includes at least a proximal clip selectively receivable in the proximal hole at a selected elevation for supporting a proximal end of the rail and a distal clip selectively receivable in the distal hole at the selected elevation for supporting a distal end of the rail. The system may include a second rail for securing to an opposing vertical wall of the rack to form a shelf or bay for an electronic device. Each rail may be latched in place and can be selectively installed and removed without use of tools.

Abstract: Rack assemblies and methods for cooling one or more rack-based computer systems, as well as data center configurations that utilize the rack assembly. The rack assembly comprises a rack providing support for multiple columns of heat-generating electronic devices and device fans for moving air from an air inlet side of the rack through the devices and through an air outlet side of the rack. The rack assembly also comprises a unitary door having a support frame spanning the air outlet side of the rack and hingedly coupling the door to a rear vertical edge of the rack. The door includes an air-to-liquid heat exchanger panel spanning an air outlet passage inside the support frame so that substantially all of the air passing through the air outlet must pass through the heat exchanger panel. The air outlet passage has a cross-sectional area that is substantially equal to or greater than the cross-sectional area of the multiple columns of heat-generating devices.

Abstract: A method of operating variable pitch fans in series to cool an operating computer system. The method comprises running a first variable pitch fan with blades positioned at an operational pitch to induce airflow through the computer system and through a second variable pitch fan disposed in series with the first fan, and, simultaneously, not running the second variable pitch fan with blades positioned for minimal impedance to the airflow. In response to detecting a failure condition of the first fan, the method includes running the second fan with blades positioned at an operational pitch to induce airflow through the computer system and through the first fan, and, simultaneously, not running the first fan with blades positioned for minimal impedance to the airflow. Preferably, the method includes locking the rotor of a fan that is not running, and locking the blades of the non-running fan in a minimal impedance position.

Abstract: A system comprising a chassis that includes a plurality of modules and a fan assembly disposed in a distal end of the chassis for drawing air in parallel pathways through the plurality of modules. At least one of the modules is a compute module having a thermal sensor disposed to sense the temperature of air flowing across a processor mounted on a motherboard. The system further comprises a fan controller receiving output from the thermal sensor, wherein the fan controller operates the fan assembly to cool the plurality of modules and maintain the thermal sensor output within an operating temperature range. The fan controller controls the fan speed according to predetermined thermal profile settings associated with one of the compute modules received in the chassis. For example, the predetermined thermal profile settings may include a minimum fan speed, a maximum fan speed, and control loop feedback settings.

Abstract: An apparatus comprising a chassis providing a plurality of module bays, one or more modules received in the module bays, wherein each module has at least one damper actuator extending from a distal end of the module. A fan assembly and a plurality of air flow dampers are secured in a distal end of the chassis, wherein each damper is aligned with one module bay to control air flow through the aligned module bay. Each damper is biased to close in the absence of contact with a damper actuator and opens in response to contact with a damper actuator. Each damper opens to a variable extent determined by the profile of the contacting damper actuator. The damper actuator of a particular module has a profile corresponding to the thermal load of that module, such that installing a module into the chassis automatically opens the aligned damper to the desired extent.

Abstract: An apparatus, system, and method are disclosed for identifying and differentiating among multiple groups of devices, comprising at least two LEDs, a controller, and a blending medium. The at least two LEDs emit a wavelength of light that is different from a wavelength of each other LED. The controller drives the at least two LEDs to each emit light at specified intensities in response to a color identifying value. The blending medium combines the light emitted by the at least two LEDs into an identifying color that identifies a group of devices.

Abstract: An apparatus comprising a chassis providing a plurality of module bays, one or more modules received in the module bays, wherein each module has at least one damper actuator extending from a distal end of the module. A fan assembly and a plurality of air flow dampers are secured in a distal end of the chassis, wherein each damper is aligned with one module bay to control air flow through the aligned module bay. Each damper is biased to close in the absence of contact with a damper actuator and opens in response to contact with a damper actuator. Each damper opens to a variable extent determined by the profile of the contacting damper actuator. The damper actuator of a particular module has a profile corresponding to the thermal load of that module, such that installing a module into the chassis automatically opens the aligned damper to the desired extent.

Abstract: A system for receiving and supporting a plurality of devices connected to a network. The system comprises a rack having a front side providing access to a plurality of chassis bays for receiving a chassis and aligning a back end of the chassis for blind docking with an electrical power source. The chassis includes a power supply, a fan, and a front side providing access to a plurality of module bays for receiving a module and aligning a back end of the module for blind docking with the power supply. A compute module is received in a module bay and directly blind docked to the power supply. The system further includes at least one other module received in a module bay within the same chassis as the compute module and directly blind docked with the same power supply along with the compute module.

Abstract: In one embodiment, a single electrical power supply is used to interchangeably power either a single motherboard or dual motherboards. Switchable output power and individual sequencing may be provided to each motherboard using FETs, such that the power supply may respond to the sequencing of each motherboard as if it were dedicated to that motherboard. In a two motherboard system, power to the first motherboard is reduced by removing some output voltages from the first motherboard. Fault circuitry may also be provided so that a power related fault on one domain does not affect operation of the other motherboard.