Abstract: A thin film of tin is plated directly on nickel coating a metal substrate followed by plating silver directly on the thin film of tin. The silver has good adhesion to the substrate even at high temperatures.

Abstract: The present invention provides inter alia copper electroplating compositions, methods for use of the compositions and products formed by the compositions. Electroplating compositions of the invention contain an increased brightener concentration that can provide effective copper plate on difficult-to-plate aperture walls, including high aspect ratio, small diameter microvias.

Abstract: The present invention provides inter alia copper electroplating compositions, methods for use of the compositions and products formed by the compositions. Electroplating compositions of the invention contain an increased brightener concentration that can provide effective copper plate on difficult-to-plate aperture walls, including high aspect ratio, small diameter microvias.

Abstract: Disclosed are electrolyte compositions for depositing tin-copper alloys that are substantially free of lead. Also disclosed are methods of plating tin-copper alloys that are substantially free of lead on substrates and uses for such plated substrates.

Abstract: An electrolyte employed to selectively deposit a tin or tin alloy film on a composite substrate. A method for depositing the tin or tin alloy on the composite substrate also is described.

Abstract: Disclosed are methods of forming an electronic device. The methods involve (a) providing a substrate and a component to be bonded to the substrate, wherein the component is chosen from an electronic component, an optical component, a device lid, and a combination thereof; (b) applying solder paste to the substrate and/or the component, wherein the solder paste includes a carrier vehicle and a metal portion with metal particles; and (c) bringing the substrate and the component into contact with each other. The solder paste has a solidus temperature lower than the solidus temperature that would result after melting of the solder paste and re-solidification of the melt. Also provided are electronic devices which can be formed by the inventive methods. Particular applicability can be found in the electronics industry in the formation of hermetic electronic device packages, for example, hermetic optoelectronic device packages, formed from semiconductor wafers.

Abstract: Disclosed are methods of forming solder areas on electronic components. The methods involve: (a) providing a substrate having one or more contact pads; and (b) applying a solder paste over the contact pads. The solder paste includes a carrier vehicle and a metal component having metal particles. The solder paste has a solidus temperature lower than the solidus temperature that would result after melting of the solder paste and resolidification of the melt. Also provided are electronic components which can be formed by the inventive methods. Particular applicability can be found in the semiconductor industry in the formation of interconnect bumps on a semiconductor component, for example, for bonding an integrated circuit to a module circuit or printed wiring board using a bump bonding process.

Abstract: The present invention provides inter alia copper electroplating compositions, methods for use of the compositions and products formed by the compositions. Electroplating compositions of the invention contain an increased brightener concentration that can provide effective copper plate on difficult-to-plate aperture walls, including high aspect ratio, small diameter microvias.

Abstract: The present invention provides methods for the use of copper electroplating compositions. Electroplating compositions of the invention contain an increased brightener concentration that can provide effective copper plate on difficult-to-plate aperture walls, including high aspect ratio, small diameter microvias.

Abstract: The present invention provides inter alia copper electroplating compositions, methods for use of the compositions and products formed by the compositions. Electroplating compositions of the invention contain an increased brightener concentration that can provide effective copper plate on difficult-to-plate aperture walls, including high aspect ratio, small diameter microvias.