Patents by Inventor Michael Windham
Michael Windham has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11982008Abstract: An electroplating system has a vessel assembly holding an electrolyte. A weir thief electrode assembly in the vessel assembly includes a plenum inside of a weir frame. The plenum divided into at least a first, a second and a third virtual thief electrode segment. A plurality of spaced apart openings through the weir frame lead out of the plenum. A weir ring is attached to the weir frame and guides flow of current during electroplating. The electroplating system provides process determined radial and circumferential current density control and does not require changing hardware components during set up.Type: GrantFiled: January 24, 2023Date of Patent: May 14, 2024Assignee: APPLIED Materials, Inc.Inventors: Paul R. McHugh, Gregory J. Wilson, Kyle M. Hanson, John L. Klocke, Paul Van Valkenburg, Eric J. Bergman, Adam Marc McClure, Deepak Saagar Kalaikadal, Nolan Layne Zimmerman, Michael Windham, Mikael R. Borjesson
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Publication number: 20240090532Abstract: The present disclosure provides, inter alia, a method for making a solid fermented product useful for animal feed comprising the steps of adding a source of calcium to a fermented liquid comprising ammonium lactate.Type: ApplicationFiled: November 21, 2023Publication date: March 21, 2024Inventors: Tony ARNOLD, Michael DE VETH, Aaron HANKE, Gerald POPPY, Brant WINDHAM
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Publication number: 20230167573Abstract: An electroplating system has a vessel assembly holding an electrolyte. A weir thief electrode assembly in the vessel assembly includes a plenum inside of a weir frame. The plenum divided into at least a first, a second and a third virtual thief electrode segment. A plurality of spaced apart openings through the weir frame lead out of the plenum. A weir ring is attached to the weir frame and guides flow of current during electroplating. The electroplating system provides process determined radial and circumferential current density control and does not require changing hardware components during set up.Type: ApplicationFiled: January 24, 2023Publication date: June 1, 2023Inventors: Paul R. McHugh, Gregory J. Wilson, Kyle M. Hanson, John L. Klocke, Paul Van Valkenburg, Eric J. Bergman, Adam Marc McClure, Deepak Saagar Kalaikadal, Nolan Layne Zimmerman, Michael Windham, Mikael R. Borjesson
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Patent number: 11578422Abstract: An electroplating system has a vessel assembly holding an electrolyte. A weir thief electrode assembly in the vessel assembly includes a plenum inside of a weir frame. The plenum divided into at least a first, a second and a third virtual thief electrode segment. A plurality of spaced apart openings through the weir frame lead out of the plenum. A weir ring is attached to the weir frame and guides flow of current during electroplating. The electroplating system provides process determined radial and circumferential current density control and does not require changing hardware components during set up.Type: GrantFiled: January 24, 2022Date of Patent: February 14, 2023Assignee: APPLIED MATERIALS, INC.Inventors: Paul R. McHugh, Gregory J. Wilson, Kyle M. Hanson, John L. Klocke, Paul Van Valkenburg, Eric J. Bergman, Adam Marc McClure, Deepak Saagar Kalaikadal, Nolan Layne Zimmerman, Michael Windham, Mikael R. Borjesson
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Publication number: 20220145489Abstract: An electroplating system has a vessel assembly holding an electrolyte. A weir thief electrode assembly in the vessel assembly includes a plenum inside of a weir frame. The plenum divided into at least a first, a second and a third virtual thief electrode segment. A plurality of spaced apart openings through the weir frame lead out of the plenum. A weir ring is attached to the weir frame and guides flow of current during electroplating. The electroplating system provides process determined radial and circumferential current density control and does not require changing hardware components during set up.Type: ApplicationFiled: January 24, 2022Publication date: May 12, 2022Inventors: Paul R. McHugh, Gregory J. Wilson, Kyle M. Hanson, John L. Klocke, Paul Van Valkenburg, Eric J. Bergman, Adam Marc McClure, Deepak Saagar Kalaikadal, Nolan Layne Zimmerman, Michael Windham, Mikael R. Borjesson
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Patent number: 11268208Abstract: An electroplating system has a vessel assembly holding an electrolyte. A weir thief electrode assembly in the vessel assembly includes a plenum inside of a weir frame. The plenum divided into at least a first, a second and a third virtual thief electrode segment. A plurality of spaced apart openings through the weir frame lead out of the plenum. A weir ring is attached to the weir frame and guides flow of current during electroplating. The electroplating system provides process determined radial and circumferential current density control and does not require changing hardware components during set up.Type: GrantFiled: May 8, 2020Date of Patent: March 8, 2022Assignee: APPLIED MATERIALS, INC.Inventors: Paul R McHugh, Gregory J Wilson, Kyle M Hanson, John L Klocke, Paul Van Valkenburg, Eric J Bergman, Adam Marc McClure, Deepak Saagar Kalaikadal, Nolan Layne Zimmerman, Michael Windham, Mikael R Borjesson
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Publication number: 20210348296Abstract: An electroplating system has a vessel assembly holding an electrolyte. A weir thief electrode assembly in the vessel assembly includes a plenum inside of a weir frame. The plenum divided into at least a first, a second and a third virtual thief electrode segment. A plurality of spaced apart openings through the weir frame lead out of the plenum. A weir ring is attached to the weir frame and guides flow of current during electroplating. The electroplating system provides process determined radial and circumferential current density control and does not require changing hardware components during set up.Type: ApplicationFiled: May 8, 2020Publication date: November 11, 2021Inventors: Paul R McHugh, Gregory J Wilson, Kyle M Hanson, John L Klocke, Paul Van Valkenburg, Eric J Bergman, Adam Marc McClure, Deepak Saagar Kalaikadal, Nolan Layne Zimmerman, Michael Windham, Mikael R Borjesson
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Patent number: 10174437Abstract: A wafer is placed into a chuck assembly within an electroplating system. The chuck assembly includes a backing plate assembly engageable with a ring. A hub may be provided on one side of the backing plate assembly for attaching the chuck assembly to a rotor of a processor for electroplating a wafer. A wafer plate may be provided on the other side of the backing plate assembly. The ring has contact fingers electrically connected to a ring bus bar, and with the ring bus bar electrically connected to a power source in the processor via the backing plate assembly when the ring is engaged to the backing plate assembly. A wafer seal on the ring overlies the contact fingers. A chuck seal may be provided around a perimeter. Maintenance of the electrical contacts and the seal is performed remotely from the processors.Type: GrantFiled: June 30, 2016Date of Patent: January 8, 2019Assignee: Applied Materials, Inc.Inventors: Randy A. Harris, Michael Windham
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Publication number: 20170009367Abstract: A wafer is placed into a chuck assembly within an electroplating system. The chuck assembly includes a backing plate assembly engageable with a ring. A hub may be provided on one side of the backing plate assembly for attaching the chuck assembly to a rotor of a processor for electroplating a wafer. A wafer plate may be provided on the other side of the backing plate assembly. The ring has contact fingers electrically connected to a ring bus bar, and with the ring bus bar electrically connected to a power source in the processor via the backing plate assembly when the ring is engaged to the backing plate assembly. A wafer seal on the ring overlies the contact fingers. A chuck seal may be provided around a perimeter. Maintenance of the electrical contacts and the seal is performed remotely from the processors.Type: ApplicationFiled: June 30, 2016Publication date: January 12, 2017Inventors: Randy A. Harris, Michael Windham