Abstract: An optoelectronic semiconductor component comprising: a main body (100) having a recess; (102), a first optoelectronic element (104) and a second optoelectronic element; (106) a surface structured element; (110) and a filling compound (112) embedding the first optoelectronic element (104) and the second optoelectronic element (106) in the recess, wherein the surface structured element configures a surface of the filling compound (112) such that at least two domed regions (114, 116, 118) of the surface are formed.

Abstract: A radiation-emitting semiconductor device includes a housing body having a chip mounting area, a chip connection region, a radiation-emitting semiconductor chip, and a light-absorbing material, wherein the radiation-emitting semiconductor chip is fixed to the chip connection region, the chip connection region is covered with the light-absorbing material at selected locations at which the chip connection region is not covered by the radiation-emitting semiconductor chip, the radiation-emitting semiconductor chip is free of the light-absorbing material in selected locations, the housing body has a cavity in which the at least one radiation-emitting semiconductor chip is arranged, the chip mounting area is a surface of the housing body which abuts the cavity, and the chip mounting area is free of the light-absorbing material in selected locations remote from the chip connection region.

Abstract: The invention relates to a microwave oven (1) comprising an oven muffle (2), a high-frequency oscillator for generating microwaves propagating within the oven muffle (2), an opening (3) within a muffle wall (2.1) of the oven muffle (2) for passing a rotatable shaft (4) of a motor (5) through the muffle wall (2.1) and means (6) for suppressing microwave leakage through said opening (3), wherein the means (6) for suppressing microwave leakage are arranged at a distance to the muffle wall by means of a motor mounting element (7) bearing the motor (5) and wherein there is no direct physical contact between the muffle wall (2.1) and the suppression means (6).

Abstract: A radiation-emitting semiconductor device includes a chip connection region, a radiation-emitting semiconductor chip, and a light-absorbing material, wherein the radiation-emitting semiconductor chip is fixed to the chip connection region, the chip connection region is covered with the light-absorbing material at selected locations at which said chip connection region is not covered by the radiation-emitting semiconductor chip, and the radiation-emitting semiconductor chip is free of the light-absorbing material in locations.

Abstract: A gasket (20) adapted for a microwave oven or a cooking oven with microwave heating function, that includes at least one elastic material and includes a front portion (30) and a rear portion (32), wherein the front portion (30) of the gasket (20) is an electrically non-conductive material, whereas the rear portion (32) of the gasket (20) is an electrically conductive material.

Abstract: A microwave oven or multifunctional oven with microwave heating function. The oven includes a cavity with an open front side and a front frame enclosing at least partially a front portion of the cavity. The cavity and the front frame include metal sheet. The front frame is connected to the cavity by fixing elements. A gap is formed between the cavity and the front frame. The gap encloses at least partially the front portion of the cavity and the front frame encloses the gap. The oven includes a door covering the open front side and the gap in a closed state of the door. The gap is at least partially filled by a gasket at least part of which includes one or more materials having low heat conductivity, so that the front frame is thermally decoupled from the cavity by the part of the gasket or the gap.

Abstract: An optoelectronic semiconductor component includes a first functional region having an active zone provided for generating radiation or for receiving radiation, and a second functional region, which is suitable for contributing to the driving of the first functional region. The first functional region and the second functional region are integrated on the same carrier substrate.

Abstract: An optoelectronic semiconductor component includes a carrier which has an upper side and a lower side opposite to the upper side. At least one radiation-emitting semiconductor device is disposed on the upper side and has a radiation emission surface, through which at least a portion of the electromagnetic radiation, which is generated during operation of the semiconductor device, leaves the semiconductor device. A radiation-absorbing layer is arranged to absorb ambient light, which impinges upon the component, such that an outer surface of the component facing away from the carrier appears black at least in places.

Abstract: A method is provided for storing tire information in a tire sensor. For this purpose, a tire sensor is fastened to a tire having a passive RFID transponder. The RFID transponder is then supplied with energy via an energy field, with the result that the RFID transponder emits the stored tire information. If the tire sensor has determined that the tire sensor is fastened to the tire, the tire information is received and is permanently stored in the tire sensor. The tire information written to a tire sensor is preferably transmitted to the vehicle by the tire sensor and is then taken into account during a movement-dynamic function, for example.

Abstract: In at least one embodiment, an optoelectronic semiconductor component includes at least two optoelectronic semiconductor chips, which are designed to emit electromagnetic radiation in mutually different wavelength ranges when in operation. The semiconductor chips are mounted on a mounting surface of a common carrier. Furthermore, the optoelectronic semiconductor component contains at least two non-rotationally symmetrical lens bodies, which are designed to shape the radiation into mutually different emission angles in two mutually orthogonal directions parallel to the mounting surface. One of the lens bodies is here associated with or arranged downstream of each of the semiconductor chips in an emission direction.

Abstract: An optoelectronic semiconductor component includes a carrier which has an upper side and a lower side opposite to the upper side. At least one radiation-emitting semiconductor device is disposed on the upper side and has a radiation emission surface, through which at least a portion of the electromagnetic radiation, which is generated during operation of the semiconductor device, leaves the semiconductor device. A radiation-absorbing layer is arranged to absorb ambient light, which impinges upon the component, such that an outer surface of the component facing away from the carrier appears black at least in places.

Abstract: A radiation-emitting semiconductor device includes a chip connection region, a radiation-emitting semiconductor chip, and a light-absorbing material, wherein the radiation-emitting semiconductor chip is fixed to the chip connection region, the chip connection region is covered with the light-absorbing material at selected locations at which said chip connection region is not covered by the radiation-emitting semiconductor chip, and the radiation-emitting semiconductor chip is free of the light-absorbing material in locations.

Abstract: An optoelectronic semiconductor component comprising: a main body (100) having a recess; (102), a first optoelectronic element (104) and a second optoelectronic element; (106) a surface structured element; (110) and a filling compound (112) embedding the first optoelectronic element (104) and the second optoelectronic element (106) in the recess, wherein the surface structured element configures a surface of the filling compound (112) such that at least two domed regions (114, 116, 118) of the surface are formed.

Abstract: In at least one embodiment, an optoelectronic semiconductor component includes at least two optoelectronic semiconductor chips, which are designed to emit electromagnetic radiation in mutually different wavelength ranges when in operation. The semiconductor chips are mounted on a mounting surface of a common carrier. Furthermore, the optoelectronic semiconductor component contains at least two non-rotationally symmetrical lens bodies, which are designed to shape the radiation into mutually different emission angles in two mutually orthogonal directions parallel to the mounting surface. One of the lens bodies is here associated with or arranged downstream of each of the semiconductor chips in an emission direction.