Patents by Inventor Michael Zaffarano

Michael Zaffarano has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Broadband amplifier having offset microstrip section in a housing module
    Patent number: 7026869
    Abstract: A broadband driver amplifier module is made using an arrangement of MMICS and microstrip to provide inline rf connectors for the input and output and a small package size. The input and output microstrips incorporate a microstrip portion which is at an angle to the axis of the input connector providing an offset from the axis of the input connector. There is provided at least one MMIC extending from the input microstrip at the offset across the input connector axis and having an output on the other side of the axis. This arrangement provides for an overall zigzag configuration which reduces the axial length of the package while maintaining inline input and output connectors. The invention further includes novel arrangements for MMIC mounting and d.c. blocks used in the amplifier.
    Type: Grant
    Filed: January 8, 2003
    Date of Patent: April 11, 2006
    Assignee: L-3 Communications
    Inventors: Joseph L. Merenda, Michael Zaffarano, Eric Darvin
  • Broadband amplifier
    Publication number: 20040130417
    Abstract: A broadband driver amplifier module is made using an arrangement of MMICS and microstrip to provide inline rf connectors for the input and output and a small package size. The input and output microstrips incorporate a microstrip portion which is at an angle to the axis of the input connector providing an offset from the axis of the input connector. There is provided at least one MMIC extending from the input microstrip at the offset across the input connector axis and having an output on the other side of the axis. This arrangement provides for an overall zigzag configuration which reduces the axial length of the package while maintaining inline input and output connectors. The invention further includes novel arrangements for MMIC mounting and d.c. blocks used in the amplifier.
    Type: Application
    Filed: January 8, 2003
    Publication date: July 8, 2004
    Inventors: Joseph L. Merenda, Michael Zaffarano, Eric Darvin