Patents by Inventor Michal Lavi

Michal Lavi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20140096146
    Abstract: Systems and methods for translating time-stamped events to performance indicators are provided. A data component can receive sequences of time-stamped events associated with a device with a set of subsystem components. A conversion component can convert the sequences to time series based upon log transformations of event-intervals associated with the events. An estimation component can estimate local event-descriptor distribution characteristics at an event count associated with the time series. A translation component can translate the local event-descriptor distributions characteristics into performance indicators.
    Type: Application
    Filed: September 28, 2012
    Publication date: April 3, 2014
    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
    Inventors: Alina Maor, Ron Maurer, Michal Lavi
  • Patent number: 6122566
    Abstract: A method and apparatus for controlling a multiple chamber semiconductor wafer processing system. The processing system includes a plurality of process chambers about the periphery of the transfer chamber. A centrally located wafer transfer mechanism effects moving wafers between the process chambers. The process sequencer control is a real time, multi-tasking control program having a presequencer or look ahead feature for preventing delays in the processing. In one implementation, the look ahead feature identifies mid-sequence or oriented wafers which cannot be further processed because their destination chamber is busy. Rather than expend system resources waiting for the destination chamber to become available, the wafers are transferred to a holding position, preferably the load lock, and rescheduled at the earliest time to finish their processing.
    Type: Grant
    Filed: March 3, 1998
    Date of Patent: September 19, 2000
    Assignee: Applied Materials Inc.
    Inventors: Thu Nguyen, Michal Lavi