Patents by Inventor Michal P. Warzecha

Michal P. Warzecha has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6728099
    Abstract: An electrical component having a hybrid air cooling system. The electrical component comprises an air plenum that extends across the width of the component and a first set of air movers that is positionable in a first lateral position downstream of the air plenum within the component enclosure and a second set of air movers that is positionable in a second lateral position downstream of the air plenum within the component enclosure. The first and second sets of air movers each include at least two air movers arranged adjacent each other in series. When both positioned in the component enclosure, the first and second sets of air movers are arranged in parallel such that both serial and parallel air flows are provided within the component enclosure to dissipate heat generated therein.
    Type: Grant
    Filed: November 13, 1998
    Date of Patent: April 27, 2004
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Victoria M. Tsang, Michal P. Warzecha, Mike T. Strickler
  • Patent number: 6496386
    Abstract: Method and system for shielding a circuit board from electrostatic discharge and from mechanical damage. A circuit board shield of dimensions roughly equivalent to those of the circuit board that the circuit board shield is designed to protect is manufactured to contain apertures complementary in shape, size, and position to heat-producing components affixed to the surface of a circuit board. When the circuit board shield is placed on top of the circuit board, the heat-producing components of the circuit board remain exposed to an external environment via the apertures, while other parts of the circuit board are protected from electrostatic discharge and mechanical damage by the overlying circuit board shield.
    Type: Grant
    Filed: December 22, 2000
    Date of Patent: December 17, 2002
    Assignee: Hewlett-Packard Company
    Inventors: Michal P. Warzecha, Herbert J. Tanzer, Timothy M. Sheridon