Abstract: Methods and systems for providing hardware compute resiliency by using a compute fabric that includes sensors and re-programmable data processing components.

Abstract: Systems and methods for semiconductor design evaluation. IC layout information of a circuit design is received, and the circuit design is decomposed into smaller circuit pieces. Each circuit piece has IC layout information and a netlist. For each circuit piece, a set of strike models is selected based on the layout information and the net-list of the circuit piece and received radiation environment information. Each strike model has circuit components with voltage values corresponding to a respective particle strike. For each selected strike model of a circuit piece: a radiation susceptibility metric is determined by comparing functional results of simulation of the of the strike model with functional results of simulation of the circuit piece. For each circuit piece, a radiation susceptibility metric is determined based on the radiation susceptibility metrics generated for each selected strike model of the circuit piece.

Abstract: Methods and systems for providing hardware compute resiliency by using a compute fabric that includes sensors and re-programmable data processing components.

Abstract: Systems and methods for semiconductor design evaluation. IC layout information of a circuit design is received, and the circuit design is decomposed into smaller circuit pieces. Each circuit piece has IC layout information and a netlist. For each circuit piece, a set of strike models is selected based on the layout information and the net-list of the circuit piece and received radiation environment information. Each strike model has circuit components with voltage values corresponding to a respective particle strike. For each selected strike model of a circuit piece: a radiation susceptibility metric is determined by comparing functional results of simulation of the of the strike model with functional results of simulation of the circuit piece. For each circuit piece, a radiation susceptibility metric is determined based on the radiation susceptibility metrics generated for each selected strike model of the circuit piece.

Abstract: A microelectronic device for generating analysis results from data received from a sensor.

Abstract: A microelectronic device for generating analysis results from data received from a sensor.

Abstract: A microelectronic device that includes a sensor die, compute fabric dies each having processing components and data storage components, and storage component dies. Within each compute fabric die at least one of the processing components is coupled to at least one of the data storage components. Each storage component die is coupled to at least one compute fabric die. A least one of a data processing component and a storage component of the microelectronic device is electrically coupled to a sensor of the sensor die. At least one processing component is constructed to select an intrinsic properties component and generate identifying information by: changing biasing and control parameters of the selected intrinsic properties component, and generating the identifying information based on the results of the changing of the biasing and control parameters.

Abstract: A microelectronic device that includes a sensor die, compute fabric dies, and storage component dies. Each compute fabric die has processing circuit components and data storage circuit components. A circuit component is selected and identifying information is generated by changing biasing and control parameters of the selected circuit component.

Abstract: Systems and methods for semiconductor design evaluation. IC layout information of a circuit design is received, and the circuit design is decomposed into smaller circuit pieces. Each circuit piece has IC layout information and a netlist. For each circuit piece, a set of strike models is selected based on the layout information and the net-list of the circuit piece and received radiation environment information. Each strike model has circuit components with voltage values corresponding to a respective particle strike. For each selected strike model of a circuit piece: a radiation susceptibility metric is determined by comparing functional results of simulation of the of the strike model with functional results of simulation of the circuit piece. For each circuit piece, a radiation susceptibility metric is determined based on the radiation susceptibility metrics generated for each selected strike model of the circuit piece.

Abstract: Methods and systems for providing hardware compute resiliency by using a compute fabric that includes sensors and re-programmable data processing components.

Abstract: Systems and methods for semiconductor design evaluation. IC layout information of a circuit design is received, and the circuit design is decomposed into smaller circuit pieces. Each circuit piece has IC layout information and a netlist. For each circuit piece, a set of strike models is selected based on the layout information and the net-list of the circuit piece and received radiation environment information. Each strike model has circuit components with voltage values corresponding to a respective particle strike. For each selected strike model of a circuit piece: a radiation susceptibility metric is determined by comparing functional results of simulation of the of the strike model with functional results of simulation of the circuit piece. For each circuit piece, a radiation susceptibility metric is determined based on the radiation susceptibility metrics generated for each selected strike model of the circuit piece.

Abstract: Methods and systems for providing hardware compute resiliency by using a compute fabric that includes sensors and re-programmable data processing components.

Abstract: A microelectronic device for generating analysis results from data received from a sensor.

Abstract: A microelectronic device. The device includes: a first sensor die that includes sensors, and compute fabric dies that each include data processing circuit components and data storage circuit components. Within each compute fabric die at least one of the programmable data processing circuit components is electrically coupled to at least one of the data storage circuit components The device includes storage component dies, wherein each storage component die is electrically coupled to at least one compute fabric die. The first sensor die and each compute fabric die and storage component die is an integrated circuit semiconductor die. The compute fabric dies include at least a first compute fabric die and a second compute fabric die electrically coupled to the first compute fabric die. At least one of a data processing component and a storage component of the microelectronic device is electrically coupled to the first sensor.

Abstract: Methods and systems for providing hardware compute resiliency by using a compute fabric that includes sensors and re-programmable data processing components.

Abstract: Systems and methods for semiconductor design evaluation. IC layout information of a circuit design is received, and the circuit design is decomposed into smaller circuit pieces. Each circuit piece has IC layout information and a netlist. For each circuit piece, a set of strike models is selected based on the layout information and the net-list of the circuit piece and received radiation environment information. Each strike model has circuit components with voltage values corresponding to a respective particle strike. For each selected strike model of a circuit piece: a radiation susceptibility metric is determined by comparing functional results of simulation of the of the strike model with functional results of simulation of the circuit piece. For each circuit piece, a radiation susceptibility metric is determined based on the radiation susceptibility metrics generated for each selected strike model of the circuit piece.

Abstract: A microelectronic device that includes a sensor die, compute fabric dies each having processing components and data storage components, and storage component dies. Within each compute fabric die at least one of the processing components is coupled to at least one of the data storage components. Each storage component die is coupled to at least one compute fabric die. A least one of a data processing component and a storage component of the microelectronic device is electrically coupled to a sensor of the sensor die. At least one processing component is constructed to select an intrinsic properties component and generate identifying information by: changing biasing and control parameters of the selected intrinsic properties component, and generating the identifying information based on the results of the changing of the biasing and control parameters.

Abstract: A microelectronic device. The device includes: a first sensor die that includes sensors, and compute fabric dies that each include data processing circuit components and data storage circuit components. Within each compute fabric die at least one of the programmable data processing circuit components is electrically coupled to at least one of the data storage circuit components The device includes storage component dies, wherein each storage component die is electrically coupled to at least one compute fabric die. The first sensor die and each compute fabric die and storage component die is an integrated circuit semiconductor die. The compute fabric dies include at least a first compute fabric die and a second compute fabric die electrically coupled to the first compute fabric die. At least one of a data processing component and a storage component of the microelectronic device is electrically coupled to the first sensor.

Abstract: Systems and methods for semiconductor design evaluation. IC layout information of a circuit design is received, and the circuit design is decomposed into smaller circuit pieces. Each circuit piece has IC layout information and a netlist. For each circuit piece, a set of strike models is selected based on the layout information and the net-list of the circuit piece and received radiation environment information. Each strike model has circuit components with voltage values corresponding to a respective particle strike. For each selected strike model of a circuit piece: a radiation susceptibility metric is determined by comparing functional results of simulation of the of the strike model with functional results of simulation of the circuit piece. For each circuit piece, a radiation susceptibility metric is determined based on the radiation susceptibility metrics generated for each selected strike model of the circuit piece.

Abstract: Systems and methods for semiconductor design evaluation. IC layout information of a circuit design is received, and the circuit design is decomposed into smaller circuit pieces. Each circuit piece has IC layout information and a netlist. For each circuit piece, a set of strike models is selected based on the layout information and the net-list of the circuit piece and received radiation environment information. Each strike model has circuit components with voltage values corresponding to a respective particle strike. For each selected strike model of a circuit piece: a radiation susceptibility metric is determined by comparing functional results of simulation of the of the strike model with functional results of simulation of the circuit piece. For each circuit piece, a radiation susceptibility metric is determined based on the radiation susceptibility metrics generated for each selected strike model of the circuit piece.