Abstract: Packages and methods for storage and dispensing of materials, e.g., high purity liquid reagents and chemical mechanical polishing compositions used in the manufacture of microelectronic device products, including containment structures and methods adapted for pressure-dispensing of high-purity liquids. Liner packaging of liquid or liquid-containing media is described, in which zero or near-zero head space conformations are employed to minimize adverse effects of particle generation, formation of bubbles and degradation of contained material.

Abstract: One or more PTFE films are heated to greater than 150 degrees centigrade (C) and for a time greater than 20 hours, then the PTFE films are cooled. The PTFE films may be heated to temperatures greater than 200° C. and less than 250° C. and most preferably heated to a temperature of about 228° C. The PTFE films may be kept at a temperature for greater than 50 hours or most preferably kept at a temperature for around 100 hours. The PTFE films may be heat processable PTFE fluoropolymer films and may have a number of heat affected zones. The heat affected zones may be created before or after heat treating. The heat affected zones are generally caused by welding two or more PTFE films together, usually under-pressure. An “optimal” temperature and “optimal” time period are determined at which heat processed polytetrafluoroethylene (PTFE) fluoropolymers should be heat treated.

Abstract: A container for holding and dispensing liquid having a container wall comprising a rigid portion that dimensionally defines the container, a liner portion disposed within the container adjacent to the rigid portion, and an adhesive layer disposed between the rigid portion and the liner portion. The adhesive layer removably secures the liner portion to the rigid portion such that the liner portion is capable of being separated from the rigid portion and collapsed within the container, for dispensing the liquid.