Patents by Inventor Michele K. Koss

Michele K. Koss has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • POLISHING PAD, COMPOSITION FOR THE MANUFACTURE THEREOF, AND METHOD OF MAKING AND USING
    Publication number: 20150174726
    Abstract: A polyurethane layer for forming a polishing pad for a semiconductor wafer is described, wherein the polyurethane layer comprises: a foamed polyurethane, wherein the polyurethane foam has a density of about 640 to about 960 kg/m3, and a plurality of cells having an average diameter of about 20 to about 200 micrometers; and particles of a hydrophobic polymer having a critical surface energy of less than 35 mN/m and having a median particle size of 3 to 100 micrometers. Polishing pads as well as methods for polishing are also described.
    Type: Application
    Filed: March 5, 2015
    Publication date: June 25, 2015
    Applicant: ROGERS CORPORATION
    Inventors: Brian Litke, Michele K. Koss
  • Polishing pad, composition for the manufacture thereof, and method of making and using
    Patent number: 9056382
    Abstract: A polyurethane layer for forming a polishing pad for a semiconductor wafer is described, wherein the polyurethane layer comprises: a foamed polyurethane, wherein the polyurethane foam has a density of about 640 to about 960 kg/m3, and a plurality of cells having an average diameter of about 20 to about 200 micrometers; and particles of a hydrophobic polymer having a critical surface energy of less than 35 mN/m and having a median particle size of 3 to 100 micrometers. Polishing pads as well as methods for polishing are also described.
    Type: Grant
    Filed: May 27, 2010
    Date of Patent: June 16, 2015
    Assignee: Rogers Corporation
    Inventors: Brian Litke, Michele K. Koss
  • POLISHING PAD, COMPOSITION FOR THE MANUFACTURE THEREOF, AND METHOD OF MAKING AND USING
    Publication number: 20110130077
    Abstract: A polyurethane layer for forming a polishing pad for a semiconductor wafer is described, wherein the polyurethane layer comprises: a foamed polyurethane, wherein the polyurethane foam has a density of about 640 to about 960 kg/m3, and a plurality of cells having an average diameter of about 20 to about 200 micrometers; and particles of a hydrophobic polymer having a critical surface energy of less than 35 mN/m and having a median particle size of 3 to 100 micrometers. Polishing pads as well as methods for polishing are also described.
    Type: Application
    Filed: May 27, 2010
    Publication date: June 2, 2011
    Inventors: Brian Litke, Michele K. Koss