Patents by Inventor Michelle C. Jen

Michelle C. Jen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240160585
    Abstract: A first die has a port to couple the first die to a second die over a die-to-die interconnect. The port includes circuitry to implement a physical layer of the die-to-die interconnect, send first protocol identification data over the physical layer to identify a first protocol in a plurality of protocols, send first data over the interconnect to the second die, wherein the first data comprise data of the first protocol, send second protocol identification data over the physical layer to identify a different second protocol in the plurality of protocols, and send second data over the interconnect to the second die, wherein the second data comprise flits of the second protocol.
    Type: Application
    Filed: January 22, 2024
    Publication date: May 16, 2024
    Applicant: Intel Corporation
    Inventors: Debendra Das Sharma, Robert G. Blankenship, Suresh S. Chittor, Kenneth C. Creta, Balint Fleischer, Michelle C. Jen, Mohan J. Kumar, Brian S. Morris
  • Publication number: 20240012759
    Abstract: A shared memory controller receives a flit from another first shared memory controller over a shared memory link, where the flit includes a node identifier (ID) field and an address of a particular line of the shared memory. The node ID field identifies that the first shared memory controller corresponds to a source of the flit. Further, a second shared memory controller is determined from at least the address field of the flit, where the second shared memory controller is connected to a memory element corresponding to the particular line.
    Type: Application
    Filed: September 7, 2023
    Publication date: January 11, 2024
    Applicant: Intel Corporation
    Inventors: Debendra Das Sharma, Michelle C. Jen, Brian S. Morris
  • Patent number: 11789892
    Abstract: An interface couples a controller to a physical layer (PHY) block, where the interface includes a set of data pins comprising transmit data pins to send data to the PHY block and receive data pins to receive data from the PHY block. The interface further includes a particular set of pins to implement a message bus interface, where the controller is to send a write command to the PHY block over the message bus interface to write a value to at least one particular bit of a PHY message bus register, bits of the PHY message bus register are mapped to a set of control and status signals, and the particular bit is mapped to a recalibration request signal to request that the PHY block perform a recalibration.
    Type: Grant
    Filed: May 6, 2022
    Date of Patent: October 17, 2023
    Assignee: Intel Corporation
    Inventors: Michelle C. Jen, Minxi Gao, Debendra Das Sharma, Fulvio Spagna, Bruce A. Tennant, Noam Dolev Geldbard
  • Patent number: 11755486
    Abstract: A shared memory controller receives a flit from another first shared memory controller over a shared memory link, where the flit includes a node identifier (ID) field and an address of a particular line of the shared memory. The node ID field identifies that the first shared memory controller corresponds to a source of the flit. Further, a second shared memory controller is determined from at least the address field of the flit, where the second shared memory controller is connected to a memory element corresponding to the particular line. The flit is forwarded to the second shared memory controller using a shared memory link according to a routing path.
    Type: Grant
    Filed: April 21, 2021
    Date of Patent: September 12, 2023
    Assignee: Intel Corporation
    Inventors: Debendra Das Sharma, Michelle C. Jen, Brian S. Morris
  • Patent number: 11729096
    Abstract: Embodiments may be generally direct to apparatuses, systems, method, and techniques to provide multi-interconnect protocol communication. In an embodiment, an apparatus for providing multi-interconnect protocol communication may include a component comprising at least one connector operative to connect the component to at least one off-package device via a standard interconnect protocol, and logic, at least a portion of the logic comprised in hardware, the logic to determine data to be communicated via a multi-interconnect protocol, provide the data to a multi-protocol multiplexer to determine a route for the data, route the data on-package responsive to the multi-protocol multiplexer indicating a multi-interconnect on-package mode, and route the data off-package via the at least one connector responsive to the multi-protocol multiplexer indicating a multi-interconnect off-package mode. Other embodiments are described.
    Type: Grant
    Filed: August 2, 2021
    Date of Patent: August 15, 2023
    Assignee: Intel Corporation
    Inventors: Debendra Das Sharma, Michelle C. Jen, Mark S. Myers, Don Soltis, Ramacharan Sundararaman, Stephen R. Van Doren, Mahesh Wagh
  • Patent number: 11726939
    Abstract: Systems, methods, and devices can involve a host device that includes a root complex, a link, and an interconnect protocol stack coupled to a bus link. The interconnect protocol stack can include multiplexing logic to select one of a Peripheral Component Interconnect Express (PCIe) upper layer mode, or an accelerator link protocol upper layer mode, the PCIe upper layer mode or the accelerator link protocol upper layer mode to communicate over the link, and physical layer logic to determine one or more low latency features associated with one or both of the PCIe upper layer mode or the accelerator link protocol upper layer mode.
    Type: Grant
    Filed: September 25, 2021
    Date of Patent: August 15, 2023
    Assignee: Intel Corporation
    Inventors: Debendra Das Sharma, Michelle C. Jen, Prahladachar Jayaprakash Bharadwaj, Bruce Tennant, Mahesh Wagh
  • Publication number: 20220269641
    Abstract: An interface couples a controller to a physical layer (PHY) block, where the interface includes a set of data pins comprising transmit data pins to send data to the PHY block and receive data pins to receive data from the PHY block. The interface further includes a particular set of pins to implement a message bus interface, where the controller is to send a write command to the PHY block over the message bus interface to write a value to at least one particular bit of a PHY message bus register, bits of the PHY message bus register are mapped to a set of control and status signals, and the particular bit is mapped to a recalibration request signal to request that the PHY block perform a recalibration.
    Type: Application
    Filed: May 6, 2022
    Publication date: August 25, 2022
    Applicant: Intel Corporation
    Inventors: Michelle C. Jen, Minxi Gao, Debendra Das Sharma, Fulvio Spagna, Bruce A. Tennant, Noam Dolev Geldbard
  • Patent number: 11327920
    Abstract: An interface couples a controller to a physical layer (PHY) block, where the interface includes a set of data pins comprising transmit data pins to send data to the PHY block and receive data pins to receive data from the PHY block. The interface further includes a particular set of pins to implement a message bus interface, where the controller is to send a write command to the PHY block over the message bus interface to write a value to at least one particular bit of a PHY message bus register, bits of the PHY message bus register are mapped to a set of control and status signals, and the particular bit is mapped to a recalibration request signal to request that the PHY block perform a recalibration.
    Type: Grant
    Filed: July 10, 2020
    Date of Patent: May 10, 2022
    Assignee: Intel Corporation
    Inventors: Michelle C. Jen, Minxi Gao, Debendra Das Sharma, Fulvio Spagna, Bruce A. Tennant, Noam Dolev Geldbard
  • Publication number: 20220012203
    Abstract: Systems, methods, and devices can involve a host device that includes a root complex, a link, and an interconnect protocol stack coupled to a bus link. The interconnect protocol stack can include multiplexing logic to select one of a Peripheral Component Interconnect Express (PCIe) upper layer mode, or an accelerator link protocol upper layer mode, the PCIe upper layer mode or the accelerator link protocol upper layer mode to communicate over the link, and physical layer logic to determine one or more low latency features associated with one or both of the PCIe upper layer mode or the accelerator link protocol upper layer mode.
    Type: Application
    Filed: September 25, 2021
    Publication date: January 13, 2022
    Applicant: Intel Corporation
    Inventors: Debendra Das Sharma, Michelle C. Jen, Prahladachar Jayaprakash Bharadwaj, Bruce A. Tennant, Mahesh Wagh
  • Publication number: 20220012189
    Abstract: A shared memory controller is to service load and store operations received, over data links, from a plurality of independent nodes to provide access to a shared memory resource. Each of the plurality of independent nodes is to be permitted to access a respective portion of the shared memory resource. Interconnect protocol data and memory access protocol data are sent on the data links and transitions between the interconnect protocol data and memory access protocol data can be defined and identified.
    Type: Application
    Filed: September 25, 2021
    Publication date: January 13, 2022
    Applicant: Intel Corporation
    Inventors: Debendra Das Sharma, Robert G. Blankenship, Suresh S. Chittor, Kenneth C. Creta, Balint Fleischer, Michelle C. Jen, Mohan J. Kumar, Brian S. Morris
  • Publication number: 20220012140
    Abstract: A device includes a port with a replay buffer and protocol logic to receive a flit in a sequence of flits to be sent on a point-to-point link and determine an error in the flit. Based on the error, a copy of the flit is stored in a first position within the replay buffer as well as a copy of a next flit received in the sequence of flits, which is stored in a second position within the replay buffer. The copies of the flits are then written to a register for access by software.
    Type: Application
    Filed: September 24, 2021
    Publication date: January 13, 2022
    Inventors: Debendra Das Sharma, Michelle C. Jen, Swadesh Choudhary, Raghucharan Boddupalli
  • Publication number: 20220011849
    Abstract: A device includes physical layer (PHY) circuitry including a physical coding sublayer, where the PHY circuitry is configured to alternatively support at least two different power control settings. The device further includes an interface to couple the PHY circuitry to a media access control (MAC) layer, where the interface comprises a set of data pins, a set of command pins, a set of status pins, one or more clock pins, and a plurality of power control pins to receive an indication of a particular one of the at least two power control settings. The PHY circuitry is to apply parameters corresponding to the particular control setting during operation based on the indication.
    Type: Application
    Filed: September 25, 2021
    Publication date: January 13, 2022
    Applicant: Intel Corporation
    Inventors: Michelle C. Jen, David J. Harriman, Zuoguo Wu, Debendra Das Sharma, Noam Dolev Geldbard
  • Publication number: 20210399982
    Abstract: Embodiments may be generally direct to apparatuses, systems, method, and techniques to provide multi-interconnect protocol communication. In an embodiment, an apparatus for providing multi-interconnect protocol communication may include a component comprising at least one connector operative to connect the component to at least one off-package device via a standard interconnect protocol, and logic, at least a portion of the logic comprised in hardware, the logic to determine data to be communicated via a multi-interconnect protocol, provide the data to a multi-protocol multiplexer to determine a route for the data, route the data on-package responsive to the multi-protocol multiplexer indicating a multi-interconnect on-package mode, and route the data off-package via the at least one connector responsive to the multi-protocol multiplexer indicating a multi-interconnect off-package mode. Other embodiments are described.
    Type: Application
    Filed: August 2, 2021
    Publication date: December 23, 2021
    Inventors: Debendra Das Sharma, Michelle C. Jen, Mark S. Myers, Don Soltis, Ramacharan Sundararaman, Stephen R. Van Doren, Mahesh Wagh
  • Patent number: 11144492
    Abstract: Systems, methods, and devices can involve a host device that includes a root complex, a link, and an interconnect protocol stack coupled to a bus link. The interconnect protocol stack can include multiplexing logic to select one of a Peripheral Component Interconnect Express (PCIe) upper layer mode, or an accelerator link protocol upper layer mode, the PCIe upper layer mode or the accelerator link protocol upper layer mode to communicate over the link, and physical layer logic to determine one or more low latency features associated with one or both of the PCIe upper layer mode or the accelerator link protocol upper layer mode.
    Type: Grant
    Filed: March 6, 2020
    Date of Patent: October 12, 2021
    Assignee: Intel Corporation
    Inventors: Debendra Das Sharma, Michelle C. Jen, Prahladachar Jayaprakash Bharadwaj, Bruce A. Tennant, Mahesh Wagh
  • Publication number: 20210303482
    Abstract: A shared memory controller is to service load and store operations received, over data links, from a plurality of independent nodes to provide access to a shared memory resource. Each of the plurality of independent nodes is to be permitted to access a respective portion of the shared memory resource. Interconnect protocol data and memory access protocol data are sent on the data links and transitions between the interconnect protocol data and memory access protocol data can be defined and identified.
    Type: Application
    Filed: February 8, 2021
    Publication date: September 30, 2021
    Applicant: Intel Corporation
    Inventors: Debendra Das Sharma, Robert G. Blankenship, Suresh S. Chittor, Kenneth C. Creta, Balint Fleischer, Michelle C. Jen, Mohan J. Kumar, Brian S. Morris
  • Patent number: 11113196
    Abstract: A shared memory controller receives a flit from another first shared memory controller over a shared memory link, where the flit includes a node identifier (ID) field and an address of a particular line of the shared memory. The node ID field identifies that the first shared memory controller corresponds to a source of the flit. Further, a second shared memory controller is determined from at least the address field of the flit, where the second shared memory controller is connected to a memory element corresponding to the particular line. The flit is forwarded to the second shared memory controller using a shared memory link according to a routing path.
    Type: Grant
    Filed: September 24, 2018
    Date of Patent: September 7, 2021
    Assignee: Intel Corporation
    Inventors: Debendra Das Sharma, Michelle C. Jen, Brian S. Morris
  • Patent number: 11095556
    Abstract: Embodiments may be generally direct to apparatuses, systems, method, and techniques to provide multi-interconnect protocol communication. In an embodiment, an apparatus for providing multi-interconnect protocol communication may include a component comprising at least one connector operative to connect the component to at least one off-package device via a standard interconnect protocol, and logic, at least a portion of the logic comprised in hardware, the logic to determine data to be communicated via a multi-interconnect protocol, provide the data to a multi-protocol multiplexer to determine a route for the data, route the data on-package responsive to the multi-protocol multiplexer indicating a multi-interconnect on-package mode, and route the data off-package via the at least one connector responsive to the multi-protocol multiplexer indicating a multi-interconnect off-package mode. Other embodiments are described.
    Type: Grant
    Filed: June 30, 2017
    Date of Patent: August 17, 2021
    Assignee: INTEL CORPORATION
    Inventors: Debendra Das Sharma, Michelle C. Jen, Mark S. Myers, Don Soltis, Ramacharan Sundararaman, Stephen R. Van Doren, Mahesh Wagh
  • Publication number: 20210240623
    Abstract: A shared memory controller receives a flit from another first shared memory controller over a shared memory link, where the flit includes a node identifier (ID) field and an address of a particular line of the shared memory. The node ID field identifies that the first shared memory controller corresponds to a source of the flit. Further, a second shared memory controller is determined from at least the address field of the flit, where the second shared memory controller is connected to a memory element corresponding to the particular line.
    Type: Application
    Filed: April 21, 2021
    Publication date: August 5, 2021
    Applicant: Intel Corporation
    Inventors: Debendra Das Sharma, Michelle C. Jen, Brian S. Morris
  • Patent number: 10915468
    Abstract: A shared memory controller is to service load and store operations received, over data links, from a plurality of independent nodes to provide access to a shared memory resource. Each of the plurality of independent nodes is to be permitted to access a respective portion of the shared memory resource. Interconnect protocol data and memory access protocol data are sent on the data links and transitions between the interconnect protocol data and memory access protocol data can be defined and identified.
    Type: Grant
    Filed: December 26, 2013
    Date of Patent: February 9, 2021
    Assignee: Intel Corporation
    Inventors: Debendra Das Sharma, Robert G. Blankenship, Suresh S. Chittor, Kenneth C. Creta, Balint Fleischer, Michelle C. Jen, Mohan J. Kumar, Brian S. Morris
  • Publication number: 20210034565
    Abstract: An interface couples a controller to a physical layer (PHY) block, where the interface includes a set of data pins comprising transmit data pins to send data to the PHY block and receive data pins to receive data from the PHY block. The interface further includes a particular set of pins to implement a message bus interface, where the controller is to send a write command to the PHY block over the message bus interface to write a value to at least one particular bit of a PHY message bus register, bits of the PHY message bus register are mapped to a set of control and status signals, and the particular bit is mapped to a recalibration request signal to request that the PHY block perform a recalibration.
    Type: Application
    Filed: July 10, 2020
    Publication date: February 4, 2021
    Applicant: Intel Corporation
    Inventors: Michelle C. Jen, Minxi Gao, Debendra Das Sharma, Fulvio Spagna, Bruce A. Tennant, Noam Dolev Geldbard