Abstract: A multi-chip packaging arrangement that contemplates stacking discrete components over film based components is disclosed. The multi-chip package includes a substrate having one or more film based components formed thereon. A discrete component is mounted on the substrate over the film based component such that it is electrically isolated from the film based component. One or more die components are also mounted on the substrate and a plurality of leads are provided for electrically connecting the multi-chip package to external circuitry. Wiring traces formed on the substrate are provided to electrically connect various ones of the components and the leads. A packaging material is provided to encapsulate the components and the wiring traces and leaves a portion of the leads exposed to facilitate electrically connecting the multi-chip package to external circuitry. Methods of making such multi-chip packages are also disclosed.