Abstract: Disclosed is a resol phenolic thermosetting resin made by preparing a composition of formaldehyde and a phenol in a molar ratio of about 1:1 to about 3:1, about 1 to about 20 wt %, based on the weight of said composition, of a phenol-formaldehyde polymerization catalyst, and about 0.5 to about 10 wt %, based on the weight of said phenol, of a polyvinyl alcoholic compound. The phenol can be benzophenol, an alkyl from C.sub.1 to C.sub.12 phenol, a bisphenol, or a mixture thereof. The bisphenol can be bisphenol A, bisphenol F, or bisphenol S. The polyvinyl alcoholic compound can be polyvinyl alcohol, polyvinyl acetate, an acetal derived from polyvinyl alcohol, or a mixture thereof. The composition is heated at about 50 to about 120.degree. C. to form the resin.