Abstract: Provided is an interconnector material which is chemically stable in both oxidation atmospheres and reduction atmospheres, has a high electron conductivity (electric conductivity), a low ionic conductivity, does not contain Cr, and enables a reduction in sintering temperature. The interconnector material is arranged between a plurality of cells each composed of an anode layer, a solid electrolyte layer, and a cathode layer stacked sequentially, and electrically connects the plurality of cells to each other in series in a solid electrolyte fuel cell. The interconnector is formed of a ceramic composition represented by the composition formula La(Fe1-xAlx)O3 in which 0<x<0.5.

Abstract: A solid oxide fuel cell that includes a power generation film including first and second electrode layers and a solid oxide electrolyte layer; first and second bases that define first and second gas flow channels; and a via-hole conductor unit connected to the first electrode layer. The via-hole conductor unit has a first via-hole conductor with a first end surface and a second via-hole conductor with a second end surface. The first end surface of the first via-hole conductor is in contact with the second end surface of the second via-hole conductor. A boundary part is between an outer peripheral edge of the first end surface of the first via-hole conductor and a part of the first base adjacent the outer peripheral edge are in contact with the second end surface 9a of the second via-hole conductor 9.

Abstract: Provided is an interconnector material which is chemically stable in both oxidation atmospheres and reduction atmospheres, has a high electron conductivity (electric conductivity), a low ionic conductivity, does not contain Cr, and enables a reduction in sintering temperature. The interconnector material is arranged between a plurality of cells each composed of an anode layer, a solid electrolyte layer, and a cathode layer stacked sequentially, and electrically connects the plurality of cells to each other in series in a solid electrolyte fuel cell. The interconnector is formed of a ceramic composition represented by the composition formula La(Fe1-xAlx)O3 in which 0<x<0.5.

Abstract: Provided is an interconnector material which is chemically stable in both oxidation atmospheres and reduction atmospheres, has a high electron conductivity (electric conductivity), a low ionic conductivity, does not contain Cr, and enables a reduction in sintering temperature. The interconnector material is arranged between a plurality of cells each composed of an anode layer, a solid electrolyte layer, and a cathode layer stacked sequentially, and electrically connects the plurality of cells to each other in series in a solid electrolyte fuel cell. The interconnector is formed of a ceramic composition represented by the composition formula La(Fe1-xAlx)O3 in which 0<x<0.5.

Abstract: A method for forming a thick film pattern forms a thick film pattern having a large thickness, a high hardness, and a high aspect ratio and exhibiting high dimension precision and high shape precision. In the method, a photosensitive paste including an inorganic powder, a photosensitive monomer, and a photopolymerization initiator and containing substantially no polymer is applied to a support so as to form a photosensitive paste film. The resulting photosensitive paste film is subjected to an exposure treatment and, thereafter, development is conducted so as to form a predetermined thick film pattern. Alternatively, a photolithography photosensitive paste including an inorganic powder, a photosensitive monomer, a photopolymerization initiator, and a polymer is used, wherein a ratio (weight ratio) of the photosensitive monomer to a total amount of the photosensitive monomer and the polymer is about 0.86 or more.

Abstract: Provided is an interconnector material which is chemically stable in both oxidation atmospheres and reduction atmospheres, has a high electron conductivity (electric conductivity), a low ionic conductivity, does not contain Cr, and enables a reduction in sintering temperature. The interconnector material is arranged between a plurality of cells each composed of an anode layer, a solid electrolyte layer, and a cathode layer stacked sequentially, and electrically connects the plurality of cells to each other in series in a solid electrolyte fuel cell. The interconnector is formed of a ceramic composition represented by the composition formula La(Fe1-xAlx)O3 in which 0<x<0.5.

Abstract: A method for forming a thick film pattern forms a thick film pattern having a large thickness, a high hardness, and a high aspect ratio and exhibiting high dimension precision and high shape precision. In the method, a photosensitive paste including an inorganic powder, a photosensitive monomer, and a photopolymerization initiator and containing substantially no polymer is applied to a support so as to form a photosensitive paste film. The resulting photosensitive paste film is subjected to an exposure treatment and, thereafter, development is conducted so as to form a predetermined thick film pattern. Alternatively, a photolithography photosensitive paste including an inorganic powder, a photosensitive monomer, a photopolymerization initiator, and a polymer is used, wherein a ratio (weight ratio) of the photosensitive monomer to a total amount of the photosensitive monomer and the polymer is about 0.86 or more.

Abstract: A multilayer circuit component and a method for manufacturing the same, in which the difference of the amounts of baking shrinkages between each of the glass-containing layers is small, and the enlargement rate of the diameter of the via hole formed in each of the glass-containing layers is close to those in the other layers, so that it is possible to prevent a short circuit defect due to the mutual short circuit of the conductors in the via hole from occurring, and the warp of the substrate is reduced. The multilayer circuit component is provided with at least two glass-containing layers on a substrate, differentiating the softening temperature of glass compounded in the first glass-containing layer formed on the substrate from the softening temperature of glass compounded in the second glass-containing layer formed on the first glass-containing layer.

Abstract: A multilayer composite includes an insulating substrate and patterned conductive layers and insulating layers alternately laminated on the insulating substrate. In a laminating process, a correcting insulating layer is formed on a laminate when a predetermined number of layers are laminated or when a predetermined degree of warpage of the laminate is detected by monitoring. The correcting insulating layer has a different composition from that of the other insulating layers to correct the warpage of the laminate.

Abstract: A photosensitive thick film composition is provided which has superior storage stabilities and can be reliably processed by developing. The photosensitive thick film composition is composed of a photosensitive organic component containing an organic binder having an acidic functional group, such as a carboxyl group, an inorganic component containing a polyvalent metal oxide, such as borosilicate glass, and an alcohol having a plurality of hydroxyl group, such as glucitol.

Abstract: A multilayer composite includes an insulating substrate and patterned conductive layers and insulating layers alternately laminated on the insulating substrate. In a laminating process, a correcting insulating layer is formed on a laminate when a predetermined number of layers are laminated or when a predetermined degree of warpage of the laminate is detected by monitoring. The correcting insulating layer has a different composition from that of the other insulating layers to correct the warpage of the laminate.

Abstract: A multilayer circuit component and a method for manufacturing the same, in which the difference of the amounts of baking shrinkages between each of the glass-containing layers is small, and the enlargement rate of the diameter of the via hole formed in each of the glass-containing layers is close to those in the other layers, so that it is possible to prevent a short circuit defect due to the mutual short circuit of the conductors in the via hole from occurring, and the warp of the substrate is reduced. The multilayer circuit component is provided with at least two glass-containing layers on a substrate, differentiating the softening temperature of glass compounded in the first glass-containing layer formed on the substrate from the softening temperature of glass compounded in the second glass-containing layer formed on the first glass-containing layer.

Abstract: A photoreactive resin composition having high sensitivity and causing less gelation, and methods of manufacturing a circuit board and a ceramic multilayer substrate having a high-resolution wiring pattern and via holes by a photolithography process using the photoreactive resin composition are described. The photoreactive resin composition contains an inorganic powder containing a polyvalent metal powder and/or a polyvalent metal oxide powder, an alkali-soluble first polymer having an ethylenically unsaturated double bond, a monomer having an ethylenically unsaturated double bond, a photoreaction initiator, an organic solvent, and a second polymer having a pyrrolidone ring in a side chain.

Abstract: A photosensitive glass paste containing: an inorganic component containing a glass powder and a photosensitive organic component is provided. The glass powder contains about 1 to 30 percent by weight of a low melting point glass powder having a glass softening point in a range of about 400° C. to 600° C. and about 70 to 99 percent by weight of a high melting point glass powder having a glass softening point about 300° C. or more higher than the glass softening point of the low melting point glass. As the high melting point glass, a borosilicate glass which inhibits diffusion of a conductive component such as Ag is employed. The content of the inorganic component in the photosensitive glass paste is in a range of about 40 to 70 percent by weight. A method of manufacturing a multilayered interconnected circuit board using the above-described photosensitive glass paste is also provided.

Abstract: A multilayer circuit component and a method for manufacturing the same, in which the difference of the amounts of baking shrinkages between each of the glass-containing layers is small, and the enlargement rate of the diameter of the via hole formed in each of the glass-containing layers is close to those in the other layers, so that it is possible to prevent a short circuit defect due to the mutual short circuit of the conductors in the via hole from occurring, and the warp of the substrate is reduced. The multilayer circuit component is provided with at least two glass-containing layers on a substrate, differentiating the softening temperature of glass compounded in the first glass-containing layer formed on the substrate from the softening temperature of glass compounded in the second glass-containing layer formed on the first glass-containing layer.

Abstract: A photosensitive glass paste containing: an inorganic component containing a glass powder and a photosensitive organic component is provided. The glass powder contains about 1 to 30 percent by weight of a low melting point glass powder having a glass softening point in a range of about 400° C. to 600° C. and about 70 to 99 percent by weight of a high melting point glass powder having a glass softening point about 300° C. or more higher than the glass softening point of the low melting point glass. As the high melting point glass, a borosilicate glass which inhibits diffusion of a conductive component such as Ag is employed. The content of the inorganic component in the photosensitive glass paste is in a range of about 40 to 70 percent by weight. A method of manufacturing a multilayered interconnected circuit board using the above-described photosensitive glass paste is also provided.

Abstract: A photosensitive glass paste containing: an inorganic component containing a glass powder and a photosensitive organic component is provided. The glass powder contains about 1 to 30 percent by weight of a low melting point glass powder having a glass softening point in a range of about 400° C. to 600° C. and about 70 to 99 percent by weight of a high melting point glass powder having a glass softening point about 300° C. or more higher than the glass softening point of the low melting point glass. As the high melting point glass, a borosilicate glass which inhibits diffusion of a conductive component such as Ag is employed. The content of the inorganic component in the photosensitive glass paste is in a range of about 40 to 70 percent by weight. A method of manufacturing a multilayered interconnected circuit board using the above-described photosensitive glass paste is also provided.

Abstract: A photoreactive resin composition having high sensitivity and causing less gelation, and methods of manufacturing a circuit board and a ceramic multilayer substrate having a high-resolution wiring pattern and via holes by a photolithography process using the photoreactive resin composition are described. The photoreactive resin composition contains an inorganic powder containing a polyvalent metal powder and/or a polyvalent metal oxide powder, an alkali-soluble first polymer having an ethylenically unsaturated double bond, a monomer having an ethylenically unsaturated double bond, a photoreaction initiator, an organic solvent, and a second polymer having a pyrrolidone ring in a side chain.

Abstract: A method for forming a conductive pattern includes: applying a photosensitive conductive paste to a support 1 to thereby form a film 2, which paste contains an organic binder having an acidic functional group, a photosensitive organic component, a multivalent metallic powder, and a mono-ol compound having a boiling point of about 178° C. or more, an anion-adsorbing material and/or a thixotropic agent; exposing and developing the film 2 to thereby form conductive patterns 3a and 3b; and transferring the conductive patterns 3a and 3b, which are formed on the support 1, onto a ceramic green sheet 6. The invention also discloses a method for producing a ceramic multi-layer substrate.

Abstract: A photosensitive insulating paste including an insulating material containing a borosilicate glass powder. The insulating material is dispersed in a photosensitive organic vehicle, and the borosilicate glass powder contains SiO2, B2O3 and K2O such that the compositional proportions by weight of the three components represented by (SiO2, B2O3, K2O) fall within a region formed by connecting points A (65, 35, 0), B (65, 25, 10), C (85, 5, 10) and D (85, 15, 0) in a ternary diagram thereof. A thick-film multi-layer circuit substrate including the paste is also disclosed.