Patents by Inventor Michiaki Kiryu

Michiaki Kiryu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Overcurrent protection device
    Patent number: 5858454
    Abstract: An overcurrent protection device and a method for the production thereof is provided wherein a fusible link is bonded across a pair of electrodes. A composite layer envelops the fusible link and is formed from a gelatinous composition. The composite layer and the fusible link are further encased within a molded housing. The gelatinous composition includes a nonconductive inorganic powder and a synthetic resin. The inorganic powder has a melting temperature below a fusion temperature of the fusible link. In an embodiment, the inorganic powder includes lead glass powder and alumina powder, and the synthetic resin is a low viscosity silicone resin. The inorganic powder is mixed with the silicone resin in a three to one ratio. Heat treatment dries the composite layer. The composite layer includes air pockets between particles of the inorganic powder elastically bound together by the synthetic resin.
    Type: Grant
    Filed: December 27, 1996
    Date of Patent: January 12, 1999
    Assignee: KOA Kabushiki Kaisha
    Inventors: Michiaki Kiryu, Satoru Kobayashi
  • Overcurrent protection device
    Patent number: 5572181
    Abstract: An overcurrent protection device and a method for the production thereof is provided wherein a fusible link is bonded across a pair of electrodes. A composite layer envelops the fusible link and is formed from a gelatinous composition. The composite layer and the fusible link are further encased within a molded housing. The gelatinous composition includes a nonconductive inorganic powder and a synthetic resin. The inorganic powder has a melting temperature below a fusion temperature of the fusible link. In an embodiment, the inorganic powder includes lead glass powder and alumina powder, and the synthetic resin is a low viscosity silicone resin. The inorganic powder is mixed with the silicone resin in a three to one ratio. Heat treatment dries the composite layer. The composite layer includes air pockets between particles of the inorganic powder elastically bound together by the synthetic resin.
    Type: Grant
    Filed: April 29, 1994
    Date of Patent: November 5, 1996
    Assignee: KOA Kabushiki Kaisha
    Inventors: Michiaki Kiryu, Satoru Kobayashi