Abstract: A inhaler includes a piezoelectric element substrate having an IDT constructed by use of a pair of interlocking comb-shaped metallic electrodes, a liquid supplier for supplying liquid, which is to be atomized, to a front surface of the piezoelectric element substrate on which the pair of interlocking comb-shaped metallic electrodes is positioned, a sensor, which includes at least a pair of detection parts which are opposite to each other, for detecting liquid supplied to the front surface of the piezoelectric element substrate, and a controller for controlling, based on result of detection by the sensor, the liquid supplier in such a manner that the liquid supplier supplies a certain quantity of the liquid to the front surface of the piezoelectric element substrate.

Abstract: A semiconductor manufacturing system has a series of steps, from manufacturing of a semiconductor on a wafer until packaging, that can be easily linked. A semiconductor chip manufacturing device manufactures a semiconductor chip, and a semiconductor packaging device packages the semiconductor chip by attaching the semiconductor chip to a package substrate which is larger than the wafer. The semiconductor chip manufacturing device includes a PLAD system for loading the wafer into and out of the semiconductor chip manufacturing device through a shuttle which is capable of housing the wafer. The semiconductor packaging device includes a PLAD system capable of loading the package substrate into and out of the semiconductor packaging device through a shuttle which is capable of housing the package substrate. The shuttles have container bodies of a same shape.

Abstract: An object of the present invention is to provide a circular support substrate that allows for positioning based solely on its outer periphery shape. As a means for solving the problems, a circular support substrate is provided that has at least three chords along its circumference, wherein the chords are provided at positions where they do not run linearly symmetrical to the straight line passing through the center axis of the circular support substrate.

Abstract: A method for manufacturing a surface-mount type package whose face parallel with the semiconductor chip surface has a circular cross-section, is characterized by including at least the following steps in this order: a first step in which a semiconductor chip is bonded onto a circular support substrate; a second step in which the semiconductor chip is sealed with resin; a third step in which the resin covering the pads of the semiconductor chip is removed; a fourth step in which a rewiring layer is formed; and a fifth step in which bumps are formed. The method can provide a surface-mount type package for semiconductor chips which is resistant to failures caused by thermal stress.

Abstract: An object of the present invention is to provide a surface-mount type package for semiconductor chips which is resistant to failures caused by thermal stress. As a means for achieving the object, a method for manufacturing a surface-mount type package whose face parallel with the semiconductor chip surface has a circular cross-section, is provided, wherein such method is characterized in that it comprises at least the following steps in this order. A first step in which a semiconductor chip is bonded onto a circular support substrate. A second step in which the semiconductor chip is sealed with resin. A third step in which the resin covering the pads of the semiconductor chip is removed. A fourth step in which a rewiring layer is formed. A fifth step in which bumps are formed.

Abstract: An object of the present invention is to provide a circular support substrate that allows for positioning based solely on its outer periphery shape. As a means for solving the problems, a circular support substrate is provided that has at least three chords along its circumference, wherein the chords are provided at positions where they do not run linearly symmetrical to the straight line passing through the center axis of the circular support substrate.

Abstract: A semiconductor manufacturing system has a series of steps, from manufacturing of a semiconductor on a wafer until packaging, that can be easily linked. A semiconductor chip manufacturing device manufactures a semiconductor chip, and a semiconductor packaging device packages the semiconductor chip by attaching the semiconductor chip to a package substrate which is larger than the wafer. The semiconductor chip manufacturing device includes a PLAD system for loading the wafer into and out of the semiconductor chip manufacturing device through a shuttle which is capable of housing the wafer. The semiconductor packaging device includes a PLAD system capable of loading the package substrate into and out of the semiconductor packaging device through a shuttle which is capable of housing the package substrate. The shuttles have container bodies of a same shape.

Abstract: A light emitting device includes light emitting chips, a mount board on which the light emitting chips are mounted, and a buffer amplifier. Each of the light emitting chips includes light emitting elements and transfer elements. The transfer element sequentially specify, by sequentially entering an on-state, the light emitting elements as targets for control of illumination or non-illumination. Each of the transfer elements is provided for a corresponding one of the light emitting elements. The buffer amplifier is provided on the mount board, and outputs a transfer signal on the basis of an input transfer signal. The transfer signal is used to sequentially set the transfer elements, which are included in each of the light emitting chips, to be in the on-state.

Abstract: An image forming apparatus includes a light emission element, a lighting signal generation section, a storage section, a communication line, a control section and an electromagnetic noise generation source. The storage section stores data used when the lighting signal generation section generates a lighting signal. The lighting signal generation section and the storage section transmit and receive the data therebetween through the communication line. The control section that controls the transmitting and receiving of the data between the lighting signal generation section and the storage section. The control section controls so as to start the transmitting and receiving of the data between the storage section and the lighting signal generation section in a state where a magnitude of the electromagnetic noise, at a position where the lighting signal generation section is disposed, generated by the electromagnetic noise generation source is smaller than a predetermined value.

Abstract: An exposure device includes a plurality of light-emitting elements, a lighting driver, a first storage, a reader, a shading correction unit and a second storage. The lighting driver drives and lights up the light-emitting elements based on image data. The first storage stores light amount unevenness correction values of the respective light-emitting elements. The reader reads the light amount unevenness correction values stored in the first storage. The shading correction unit executes shading correction for the light amount unevenness correction values read by the reader. The second storage stores correction values obtained by having the shading correction unit to execute the shading correction for the light amount unevenness correction values. The lighting driver controls light power of the respective light-emitting elements based on the correction values stored in the second storage.

Abstract: A light emitting device includes light emitting chips, a mount board on which the light emitting chips are mounted, and a buffer amplifier. Each of the light emitting chips includes light emitting elements and transfer elements. The transfer element sequentially specify, by sequentially entering an on-state, the light emitting elements as targets for control of illumination or non-illumination. Each of the transfer elements is provided for a corresponding one of the light emitting elements. The buffer amplifier is provided on the mount board, and outputs a transfer signal on the basis of an input transfer signal. The transfer signal is used to sequentially set the transfer elements, which are included in each of the light emitting chips, to be in the on-state.

Abstract: A recording head including: a non-electrically conductive support member; a base board provided above the support member, the base board being provided with light emitting elements for forming an image on a recording medium, a drive section for causing the light emitting elements to emit light, a first earth connection member provided at an end portion of the base board, and a second earth connection member provided at a location of a connection member, having one end connected to a control section for controlling the drive section and another end connected to drive section; a conducting member provided at a predetermined place relative to the support member and connected to an earth; a first conduction section conducting between the conducting member and the first earth connection member; and a second conduction section conducting between the conducting member and the second earth connection member.

Abstract: An exposure device includes plural light emitting elements that light in turn for exposure, plural driving elements that drive each of the light emitting elements and a time changing member that changes one time period of a switching signal to switch light emitting elements driven by the driving elements among the plurality of light emitting elements in turn from a reference time, depending on an image forming speed, wherein the time changing member changes the one time period from the reference time for some of the light emitting elements during one main scan, and maintains the one time period as the reference time for the remaining light emitting elements.

Abstract: A recording head including: a non-electrically conductive support member; a base board provided above the support member, the base board being provided with light emitting elements for forming an image on a recording medium, a drive section for causing the light emitting elements to emit light, a first earth connection member provided at an end portion of the base board, and a second earth connection member provided at a location of a connection member, having one end connected to a control section for controlling the drive section and another end connected to drive section; a conducting member provided at a predetermined place relative to the support member and connected to an earth; a first conduction section conducting between the conducting member and the first earth connection member; and a second conduction section conducting between the conducting member and the second earth connection member.

Abstract: An exposure device includes a circuit board, a light-emitting element member, a driving signal generating unit and a first voltage supply unit. The light-emitting element member is disposed on the circuit board. The light-emitting element includes plural light-emitting elements arranged in a line and plural switching elements disposed so as to correspond to the plural light-emitting elements. When the plural switching elements sequentially set the respective light-emitting elements to be in a state where the respective light-emitting elements can turn on, the respective light-emitting elements turn on sequentially. The driving signal generating unit is disposed on the circuit board. The driving signal generating unit generates driving signals for driving the respective light-emitting elements arranged in the light-emitting element member. The first voltage supply unit is disposed on the circuit board. The voltage supply unit supplies a first predetermined voltage to the light-emitting element member.

Abstract: According to an exposure device includes an exposure section, a lighting drive section, a first temperature detector and a second temperature detector. The exposure section has a plurality of light-emitting elements. The lighting drive section determines light-emitting energies of the respective light-emitting elements and drives to light the respective light-emitting elements in accordance with the determined light-emitting energies. The first temperature detector is provided in the exposure section. The second temperature detector is provided outside the exposure section. The lighting drive section determines the light-emitting energies of the respective light-emitting elements based on a temperature detected by the first temperature detector and a temperature detected by the second temperature detector.

Abstract: An exposure device includes a plurality of light-emitting elements, a lighting driver, a first storage, a reader, a shading correction unit and a second storage. The lighting driver drives and lights up the light-emitting elements based on image data. The first storage stores light amount unevenness correction values of the respective light-emitting elements. The reader reads the light amount unevenness correction values stored in the first storage. The shading correction unit executes shading correction for the light amount unevenness correction values read by the reader. The second storage stores correction values obtained by having the shading correction unit to execute the shading correction for the light amount unevenness correction values. The lighting driver controls light power of the respective light-emitting elements based on the correction values stored in the second storage.

Abstract: An exposure device includes plural light emitting elements that light in turn for exposure, plural driving elements that drive each of the light emitting elements and a time changing member that changes one time period of a switching signal to switch light emitting elements driven by the driving elements among the plurality of light emitting elements in turn from a reference time, depending on an image forming speed, wherein the time changing member changes the one time period from the reference time for some of the light emitting elements during one main scan, and maintains the one time period as the reference time for the remaining light emitting elements.

Abstract: An exposure device includes an exposure section and first and second signal output units. The exposure section has plural light emitting elements. The first signal output unit outputs to the exposure section a first signal for determining timings for starting and ending light emission of the respective light emitting elements. The second signal output unit outputs to the exposure section a second signal for determining as to whether the respective light emitting elements are caused to emit light for respective pixels. If light mission of the respective light emitting elements is stopped with respect to all pixels of one line in a main scanning direction, the first signal does not output to the exposure section for each group of one or plural light emitting elements that operate based on the common first signal.

Abstract: An image forming apparatus includes a light emission element, a lighting signal generation section, a storage section, a communication line, a control section and an electromagnetic noise generation source. The storage section stores data used when the lighting signal generation section generates a lighting signal. The lighting signal generation section and the storage section transmit and receive the data therebetween through the communication line. The control section that controls the transmitting and receiving of the data between the lighting signal generation section and the storage section. The control section controls so as to start the transmitting and receiving of the data between the storage section and the lighting signal generation section in a state where a magnitude of the electromagnetic noise, at a position where the lighting signal generation section is disposed, generated by the electromagnetic noise generation source is smaller than a predetermined value.