Abstract: An injection molding device includes an injection machine, a molding die, and a high frequency oscillation device. The injection machine injects a resin material containing a dielectric heat generating material while keeping fluidity by temperature control. The molding die includes a cavity being a channel of flow of the resin material, and a pair of electrodes, each of which faces the cavity, the pair of electrodes being disposed to sandwich the resin material therebetween in a direction crossing a direction of the flow. The high frequency oscillation device applies a high frequency alternate-current voltage to the pair of electrodes.

Abstract: An injection molding device includes an injection machine, a molding die, and a high frequency oscillation device. The injection machine injects a resin material containing a dielectric heat generating material while keeping fluidity by temperature control. The molding die includes a cavity being a channel of flow of the resin material, and a pair of electrodes, each of which faces the cavity, the pair of electrodes being disposed to sandwich the resin material therebetween in a direction crossing a direction of the flow. The high frequency oscillation device applies a high frequency alternate-current voltage to the pair of electrodes.

Abstract: The present application discloses an injection molding apparatus including a heating injector which heats and melts a conductive material to a molten temperature. The heating injector injects the conductive material into a mold with a cavity formation surface which forms a cavity. The injection molding apparatus includes an electrifying portion configured to apply a voltage; and a controller including an electrification controller configured to control the voltage which is applied by the electrifying portion. The mold includes conductive portions at least on a part of the cavity formation surface. The conductive portions are insulated from each other. The electrifying portion applies the voltage between the conductive portions. The conductive material injected from the heating injector is electrically heated by the voltage, which is applied from the electrifying portion under control of the electrification controller, when the conductive material comes in contact with the conductive portions.

Abstract: In injection-molding a conductive material, prolongation of an injection molding cycle and occurrence of defective appearance of a molded article are reduced, and the molded article is given uniform conductivity. An injection molding apparatus has a heating injection means which heats a conductive material to a temperature that allows the conductive material to melt and flow, and which injects the conductive material to a mold. The mold has a plurality of conductive portions at least at a portion of a surface defining a cavity, the conductive portions being insulated from each other. A predetermined voltage is applied to the conductive portions. A static mixer is provided in an area including a tip portion of the heating injection means and a flow path of the conductive material.

Abstract: The present application discloses an injection molding apparatus including a heating injector which heats and melts a conductive material to a molten temperature. The heating injector injects the conductive material into a mold with a cavity formation surface which forms a cavity. The injection molding apparatus includes an electrifying portion configured to apply a voltage; and a controller including an electrification controller configured to control the voltage which is applied by the electrifying portion. The mold includes conductive portions at least on a part of the cavity formation surface. The conductive portions are insulated from each other. The electrifying portion applies the voltage between the conductive portions. The conductive material injected from the heating injector is electrically heated by the voltage, which is applied from the electrifying portion under control of the electrification controller, when the conductive material comes in contact with the conductive portions.

Abstract: Disclosed is a bumper structure adapted to be attached to a front end of a vehicle, which is capable of preventing a fine member from being bent downward by its own weight after integrally forming a bumper body and a grill portion together, and avoiding a problem about deterioration in appearance of the grill portion which would otherwise be caused by the fin support remaining within the grill portion, so as to provide drastically enhanced appearance of the grill portion. A fin support (5, 5, 6, 6) is formed to allow an distal end thereof to extend toward an open zone on the upper side of an opening (X), and folded about a thin-wall portion (5a, 6a) in such a manner as to be engaged with an engagement pin (3a, - - - , 3a) at an edge of the opening (X) to support the fin member (4). After resin is cooled, thin-wall portion (5a, 6a) is cut off to remove the fin support (5, 5, 6, 6) from the inside of the opening (X).

Abstract: Disclosed is a bumper structure adapted to be attached to a front end of a vehicle, which is capable of preventing a fine member from being bent downward by its own weight after integrally forming a bumper body and a grill portion together, and avoiding a problem about deterioration in appearance of the grill portion which would otherwise be caused by the fin support remaining within the grill portion, so as to provide drastically enhanced appearance of the grill portion. A fin support (5, 5, 6, 6) is formed to allow an distal end thereof to extend toward an open zone on the upper side of an opening (X), and folded about a thin-wall portion (5a, 6a) in such a manner as to be engaged with an engagement pin (3a, - - - , 3a) at an edge of the opening (X) to support the fin member (4). After resin is cooled, thin-wall portion (5a, 6a) is cut off to remove the fin support (5, 5, 6, 6) from the inside of the opening (X).