Patents by Inventor Michikazu Tomita
Michikazu Tomita has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11864308Abstract: A substrate includes, two first through-holes to which high-frequency signals are transmitted and which are arranged side by side so as to have a predetermined distance, and at least three reference potential second through-holes arranged side by side so as to have an distance smaller than the predetermined distance with respect to the two first through-holes. Among three of the second through-holes, one of the second through-holes is arranged in a region between the two first through-holes, and other two of the second through-holes are arranged in a region other than the region between the first through-holes such that one of the other two second through-holes is arranged side by side with respect to one of the two first through-holes, and the other of other two second through-holes is arranged side by side with respect to the other of the two first through-holes.Type: GrantFiled: August 24, 2020Date of Patent: January 2, 2024Assignee: FUJIKURA LTD.Inventor: Michikazu Tomita
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Patent number: 11431080Abstract: A radio communication module of the invention includes: a mounting substrate having a first surface and a second surface; an antenna substrate mounted on the first surface; and an IC package that is mounted on the second surface and includes an RFIC. The mounting substrate includes a heat-dissipation via hole penetrating through the mounting substrate and extending between the first surface and the second surface, a heat dissipation pattern formed on the first surface and is connected to the heat-dissipation via hole, and a non-heat-dissipation via hole transmitting an electrical signal or electrical current, which are formed on thereon. In a plan view when viewed from the thickness direction of the mounting substrate, the heat-dissipation via hole is connected to the RFIC at a position at which the heat-dissipation via hole overlaps with the RFIC, and the heat dissipation pattern extends to an outside of the antenna substrate.Type: GrantFiled: January 8, 2021Date of Patent: August 30, 2022Assignee: FUJIKURA LTD.Inventor: Michikazu Tomita
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Publication number: 20220190463Abstract: A radio communication module of the invention includes: a mounting substrate having a first surface and a second surface; an antenna substrate mounted on the first surface; and an IC package that is mounted on the second surface and includes an RFIC. The mounting substrate includes a heat-dissipation via hole penetrating through the mounting substrate and extending between the first surface and the second surface, a heat dissipation pattern formed on the first surface and is connected to the heat-dissipation via hole, and a non-heat-dissipation via hole transmitting an electrical signal or electrical current, which are formed on thereon. In a plan view when viewed from the thickness direction of the mounting substrate, the heat-dissipation via hole is connected to the RFIC at a position at which the heat-dissipation via hole overlaps with the RFIC, and the heat dissipation pattern extends to an outside of the antenna substrate.Type: ApplicationFiled: January 8, 2021Publication date: June 16, 2022Applicant: Fujikura Ltd.Inventor: Michikazu Tomita
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Publication number: 20220117078Abstract: A substrate includes, two first through-holes to which high-frequency signals are transmitted and which are arranged side by side so as to have a predetermined distance, and at least three reference potential second through-holes arranged side by side so as to have an distance smaller than the predetermined distance with respect to the two first through-holes. Among three of the second through-holes, one of the second through-holes is arranged in a region between the two first through-holes, and other two of the second through-holes are arranged in a region other than the region between the first through-holes such that one of the other two second through-holes is arranged side by side with respect to one of the two first through-holes, and the other of other two second through-holes is arranged side by side with respect to the other of the two first through-holes.Type: ApplicationFiled: August 24, 2020Publication date: April 14, 2022Applicant: Fujikura Ltd.Inventor: Michikazu Tomita
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Patent number: 10720534Abstract: A pressure sensor includes a base including an accommodation portion, a pressure sensor element disposed in the accommodation portion, and a lead portion electrically-connected to the pressure sensor element, including a terminal portion provided along a lower surface of the base, and being exposed to an outside of the base, where the terminal portion includes a recessed groove portion provided on a second surface which is an opposite surface of a first surface facing the body, and where the recessed groove portion divides at the second surface, a first region including a tip of the terminal portion and a second region next to the first region and away from the tip of the terminal portion.Type: GrantFiled: October 29, 2015Date of Patent: July 21, 2020Assignee: FUJIKURA LTD.Inventor: Michikazu Tomita
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Patent number: 10254184Abstract: A semiconductor pressure sensor of the invention, includes: a base body (1) including: a lead frame (4) having a first surface and a second surface; and a support (5) that supports the lead frame (4) and is made of a resin; a pressure sensor chip (2) provided on the first surface of the lead frame (4); and a controller (3) that is provided on the second surface of the lead frame (4), is implanted in the support (5), is formed in the shape having a plurality of surfaces, includes a stress relief layer (32, 33, 34, 35, 36) that is formed on at least one of the plurality of surfaces and has a Young's modulus lower than that of the support (5), and receives a sensor signal output from the pressure sensor chip (2) aid thereby outputs a pressure detection, the pressure sensor chip (2) at least partially overlapping the controller (3) in plan view.Type: GrantFiled: October 3, 2014Date of Patent: April 9, 2019Assignee: FUJIKURA LTD.Inventors: Naoki Takayama, Michikazu Tomita, Yuki Suto, Satoshi Okude
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Publication number: 20170345949Abstract: A pressure sensor includes a base including an accommodation portion, a pressure sensor element disposed in the accommodation portion, and a lead portion electrically-connected to the pressure sensor element, including a terminal portion provided along a lower surface of the base, and being exposed to an outside of the base, where the terminal portion includes a recessed groove portion provided on a second surface which is an opposite surface of a first surface facing the body, and where the recessed groove portion divides at the second surface, a first region including a tip of the terminal portion and a second region next to the first region and away from the tip of the terminal portion.Type: ApplicationFiled: October 29, 2015Publication date: November 30, 2017Applicant: Fujikura Ltd.Inventor: Michikazu Tomita
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Publication number: 20160209284Abstract: A semiconductor pressure sensor of the invention, includes: a base body (1) including: a lead frame (4) having a first surface and a second surface; and a support (5) that supports the lead frame (4) and is made of a resin; a pressure sensor chip (2) provided on the first surface of the lead frame (4); and a controller (3) that is provided on the second surface of the lead frame (4), is implanted in the support (5), is formed in the shape having a plurality of surfaces, includes a stress relief layer (32, 33, 34, 35, 36) that is formed on at least one of the plurality of surfaces and has a Young's modulus lower than that of the support (5), and receives a sensor signal output from the pressure sensor chip (2) aid thereby outputs a pressure detection, the pressure sensor chip (2) at least partially overlapping the controller (3) in plan view.Type: ApplicationFiled: October 3, 2014Publication date: July 21, 2016Applicant: FUJIKURA LTD.Inventors: Naoki TAKAYAMA, Michikazu TOMITA, Yuki SUTO, Satoshi OKUDE
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Publication number: 20140331777Abstract: A pressure sensor module of the invention includes: a substrate; a lid connected to the substrate; a semiconductor pressure sensing device and an integrated circuit device functionally connected to the semiconductor pressure sensing device, which are accommodated in an internal space surrounded by the substrate and the lid; a pressure introducing hole that communicates the internal space to an external space; and a light shield that is provided between the external space and the internal space and is formed so that a hole axis of the pressure introducing hole is bent.Type: ApplicationFiled: July 28, 2014Publication date: November 13, 2014Applicant: FUJIKURA LTD.Inventor: Michikazu TOMITA
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Patent number: 7368321Abstract: A semiconductor package includes: a first substrate including: a semiconductor base material having a first side and a second side; a functional element that is provided at the first side of the semiconductor base material; a first wiring; a pad that is electrically connected to the functional element via the first wiring; a through-hole interconnection that is electrically connected to the pad and is provided in a hole that is defined penetrating the semiconductor base material from the first side thereof to the second side thereof, the through-hole interconnection including a first insulating film and a first conductive material formed on the first insulating film; and a sealing material provided surrounding the functional element; a second substrate that is bonded to a first side of the first substrate via the sealing material.Type: GrantFiled: July 26, 2007Date of Patent: May 6, 2008Assignee: Fujikura Ltd.Inventors: Michikazu Tomita, Tatsuo Suemasu, Sayaka Hirafune
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Publication number: 20070264753Abstract: A semiconductor package includes: a first substrate including: a semiconductor base material having a first side and a second side; a functional element that is provided at the first side of the semiconductor base material; a first wiring; a pad that is electrically connected to the functional element via the first wiring; a through-hole interconnection that is electrically connected to the pad and is provided in a hole that is defined penetrating the semiconductor base material from the first side thereof to the second side thereof, the through-hole interconnection including a first insulating film and a first conductive material formed on the first insulating film; and a sealing material provided surrounding the functional element; a second substrate that is bonded to a first side of the first substrate via the sealing material.Type: ApplicationFiled: July 26, 2007Publication date: November 15, 2007Applicant: FUJIKURA LTD.Inventors: Michikazu Tomita, Tatsuo Suemasu, Sayaka Hirafune
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Patent number: 7274101Abstract: A semiconductor package includes: a first substrate including: a semiconductor base material having a first side and a second side; a functional element that is provided at the first side of the semiconductor base material; a first wiring; a pad that is electrically connected to the functional element via the first wiring; a through-hole interconnection that is electrically connected to the pad and is provided in a hole that is defined penetrating the semiconductor base material from the first side thereof to the second side thereof, the through-hole interconnection including a first insulating film and a first conductive material formed on the first insulating film; and a sealing material provided surrounding the functional element; a second substrate that is bonded to a first side of the first substrate via the sealing material.Type: GrantFiled: June 27, 2005Date of Patent: September 25, 2007Assignee: Fujikura Ltd.Inventors: Michikazu Tomita, Tatsuo Suemasu, Sayaka Hirafune
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Publication number: 20060001147Abstract: A semiconductor package includes: a first substrate including: a semiconductor base material having a first side and a second side; a functional element that is provided at the first side of the semiconductor base material; a first wiring; a pad that is electrically connected to the functional element via the first wiring; a through-hole interconnection that is electrically connected to the pad and is provided in a hole that is defined penetrating the semiconductor base material from the first side thereof to the second side thereof, the through-hole interconnection including a first insulating film and a first conductive material formed on the first insulating film; and a sealing material provided surrounding the functional element; a second substrate that is bonded to a first side of the first substrate via the sealing material.Type: ApplicationFiled: June 27, 2005Publication date: January 5, 2006Inventors: Michikazu Tomita, Tatsuo Suemasu, Sayaka Hirafune
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Patent number: D729084Type: GrantFiled: August 21, 2014Date of Patent: May 12, 2015Assignee: Fujikura Ltd.Inventors: Michikazu Tomita, Yuki Suto
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Patent number: D731342Type: GrantFiled: August 21, 2014Date of Patent: June 9, 2015Assignee: FUJIKURA LTD.Inventors: Michikazu Tomita, Yuki Suto
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Patent number: D741734Type: GrantFiled: August 21, 2014Date of Patent: October 27, 2015Assignee: FUJIKURA LTD.Inventors: Michikazu Tomita, Yuki Suto