Abstract: An electronic component lead manufacturing method includes irradiating a first laser beam to a second layer with a solder wettability higher than a first layer, the second layer being laminated on the outside of the first layer of the lead used by the electronic component, and exposing the first layer from the second layer based on the irradiating of the first laser beam, and forming a projecting part near a region irradiated by a second laser beam by irradiating the second laser beam to the exposed first layer.

Abstract: An electronic component includes: an electronic component body; and a lead secured to the electric component and including a projection portion defined by first and second inclined portions facing each other. The solder wettability of the first inclined portion is smaller than the solder wettability of the second inclined portion.

Abstract: A cleaning apparatus includes: a supply unit to supply at least an initial amount of cleaning solution to a specific portion of an object to be cleaned; an agitator to induce agitation in the cleaning solution supplied to the object; a monitoring unit to monitor an amount of the cleaning solution and to provide a signal indicative thereof; and a control unit to detect a threshold amount of reduction in the cleaning solution based on the signal from the monitoring unit and accordingly to control the supply unit to supply an additional amount of cleaning solution to the specific portion of the object.

Abstract: A light source emits a laser beam to the object through an output end. An optical system is placed between the output end and the object. The optical system adjusts the energy of the laser beam emitted, through the output end, onto a unit area for a unit time. The energy of the beam spot on the object enables cutting or bending of the object. The optical system serves to adjust the energy of the laser beam irradiated to the object. The energy of the laser beam instantly changes as compared with the case where the energy of the laser beam is adjusted based on a driving voltage applied to a laser oscillator. The object is thus processed by using the laser beam with high accuracy.

Abstract: A cleaning apparatus includes a supply unit to supply at least an initial amount of cleaning solution to a specific portion of an object to be cleaned, an agitator to induce agitation in the cleaning solution supplied to the object, an oscillating unit to oscillate the agitator, a drive unit to move any one of the object and the agitator so as to change a clearance between the object and the agitator, a detection unit to detect impedance of the oscillator, and a control unit to control the clearance by controlling the drive unit based on the impedance.

Abstract: An electronic component lead manufacturing method includes irradiating a first laser beam to a second layer with a solder wettability higher than a first layer, the second layer being laminated on the outside of the first layer of the lead used by the electronic component, and exposing the first layer from the second layer based on the irradiating of the first laser beam, and forming a projecting part near a region irradiated by a second laser beam by irradiating the second laser beam to the exposed first layer.

Abstract: An electronic component includes: an electronic component body; and a lead secured to the electric component and including a projection portion defined by first and second inclined portions facing each other. The solder wettability of the first inclined portion is smaller than the solder wettability of the second inclined portion.

Abstract: A cleaning apparatus includes: a supply unit to supply at least an initial amount of cleaning solution to a specific portion of an object to be cleaned; an agitator to induce agitation in the cleaning solution supplied to the object; a monitoring unit to monitor an amount of the cleaning solution and to provide a signal indicative thereof; and a control unit to detect a threshold amount of reduction in the cleaning solution based on the signal from the monitoring unit and accordingly to control the supply unit to supply an additional amount of cleaning solution to the specific portion of the object.

Abstract: A cleaning/drying apparatus including a vapor area where vapor of an organic solvent inside the cleaning/drying apparatus is generated, an ejecting part configured to eject the organic solvent onto a cleaning/drying target, a first detecting part configured to determine whether the temperature of the cleaning/drying target is a first temperature equivalent to a temperature of the vapor in the vapor area, a second detecting part configured to determine whether the temperature of the cleaning/drying target is a second temperature enabling the organic solvent to condense on a surface of the cleaning/drying target, and a cleaning/drying control part configured to drive the ejecting part to eject the organic solvent when the first detecting part detects that the temperature of the cleaning/drying target is the first temperature and stop the ejection when the second detecting part detects that the temperature of the cleaning/drying target is the second temperature.

Abstract: Ultrasonic generating unit of a cleaning tank in a cleaning apparatus applies ultrasonic waves to cleaning fluid supplied into the cleaning tank from a supply port and fluid jetting unit having openings at locations corresponding to areas to be cleaned of an article to be cleaned jets the ultrasonic-applied cleaning fluid from the openings to the areas to be cleaned of the article to be cleaned.

Abstract: A bar is cut from a wafer having head elements arrayed thereon along sectional surfaces parallel to each other and orthogonal to a wafer surface. One sectional surface is set as a medium opposing surface of a head slider. Polishing processing is performed on the bar, starting from a “surface corresponding to rear side” corresponding to a wafer rear surface, with a grinding surface rubbed in a transverse direction of the bar. The roughness of the “surface corresponding to rear side” of the bar is reduced. By suppressing the surface roughness in this way, a read element and write element among head elements can be obtained with high dimensional accuracy. Such a manufacturing method considerably contributes to reduction of a dimension error of a head element, in particular, a write element.

Abstract: A cleaning and drying apparatus includes a cleaning and drying tank where an organic solvent is stored, a resupplying part configured to resupply the organic solvent in the cleaning and drying tank when a storage amount of the organic solvent in the cleaning and drying tank is equal to or less than a designated value, and a installing and uninstalling apparatus configured to install and uninstall a cleaning and drying subject in a vapor area where vapor of the organic solvent is generated.

Abstract: A processing method includes the steps of elastically deforming a jig together with a work, the jig having been mounted on a work, compressing the work against a polishing surface, and moving the work and the polishing surface relative to each other.

Abstract: A light source emits a laser beam to the object through an output end. An optical system is placed between the output end and the object. The optical system adjusts the energy of the laser beam emitted, through the output end, onto a unit area for a unit time. The energy of the beam spot on the object enables cutting or bending of the object. The optical system serves to adjust the energy of the laser beam irradiated to the object. The energy of the laser beam instantly changes as compared with the case where the energy of the laser beam is adjusted based on a driving voltage applied to a laser oscillator. The object is thus processed by using the laser beam with high accuracy.

Abstract: A cleaning/drying apparatus including a vapor area where vapor of an organic solvent inside the cleaning/drying apparatus is generated, an ejecting part configured to eject the organic solvent onto a cleaning/drying target, a first detecting part configured to determine whether the temperature of the cleaning/drying target is a first temperature equivalent to a temperature of the vapor in the vapor area, a second detecting part configured to determine whether the temperature of the cleaning/drying target is a second temperature enabling the organic solvent to condense on a surface of the cleaning/drying target, and a cleaning/drying control part configured to drive the ejecting part to eject the organic solvent when the first detecting part detects that the temperature of the cleaning/drying target is the first temperature and stop the ejection when the second detecting part detects that the temperature of the cleaning/drying target is the second temperature.

Abstract: The cleaning apparatus for cleaning a cleaning target set in a cleaning tank filled with a washing fluid includes a flow-control unit for generating a predetermined flow of the washing fluid in the cleaning tank; and an ejection unit for ejecting the washing fluid disposed on a flow path of the predetermined flow of the washing fluid. The cleaning apparatus ejects the washing fluid to outside the cleaning tank by using the ejection unit in removing contaminants on a surface of the cleaning target by washing the cleaning target with the washing fluid. Also, a cleaning tank having substantially the same structure as that of the cleaning apparatus is provided. Moreover, a cleaning method implemented using the cleaning apparatus as described above or the like is provided.

Abstract: A bonding method includes a pasting process of pasting a face which is a face except the element formation surface of a rod, with a predetermined face of an adherend using a bonding material to be heat-cured, an absorption process of fixing angular relation between a direction of the adherend and a direction of the rod into predetermined angular relation by absorbing the adherend and rod on a surface of the stage on the surface of which the adherend and rod, which are pasted in the pasting process, are placed, and a heat cure process of heating and curing the bonding material in a state that the direction of the adherend and the direction of the rod are fixed to the predetermined angular relation by the absorption process.

Abstract: A device manufacturing method is disclosed that includes the steps of moving a device at a constant speed while irradiating a laser beam on the device, and processing a part of the device with the laser beam.

Abstract: An elongated work is attached to an elongated holding surface opposed to a flat abrasive surface in a grinding device. The holding member is supported on a spherical receiving body so that the holding member changes its attitude around the spherical receiving body. The change of the attitude of the holding member reliably enables the work to uniformly contact with the flat abrasive surface. When relative movement is induced between the work and the flat abrasive surface, a chamfer is formed on the work with a high accuracy. The work is prevented from suffering from generation of microcracks and chipping. In addition, if the work moves on the flat abrasive surface only in one direction, the probability of generation of microcracks and chipping is considerably reduced.

Abstract: A cleaning apparatus is provided with a plurality of cleaning mechanisms such as a blast unit, a vibration brush unit and a pulse spraying unit. Cleaning of objects with the blast unit and vibration brush unit is conducted within cleaning liquid reserved in a cleaning vessel in order to prevent electrostatic discharge (ESD) breakdown. Cleaning the objects with the pulse spraying unit is conducted after taking out the objects from the cleaning liquid and thereby re-adhesion of contamination remaining in the cleaning liquid to the objects is prevented.