Patents by Inventor Michinori Komagata

Michinori Komagata has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electronic part with external electrode
    Patent number: 7751174
    Abstract: The present invention is intended to solve the problem of a conventional thermosetting conductive paste with respect to bonding-property between an internal electrode(s) and an external electrode(s) so as to provide a multilayer ceramic electronic part suitable for its mounting on a substrate and for its plating-treatment. The present invention relates to a multilayer ceramic electronic part, characterized in that it has an external electrode(s) formed from a thermosetting conductive paste comprising conductive particles having a high melting point, metal powder having a melting point of 300° C. or less and a resin(s).
    Type: Grant
    Filed: December 9, 2003
    Date of Patent: July 6, 2010
    Assignees: Matsushita Electric Industrial Co., Ltd., Namics Corporation
    Inventors: Takeshi Kimura, Yamato Takada, Michinori Komagata, Masahiro Kitamura, Kiminori Yokoyama
  • Electronic part with external electrode
    Publication number: 20060044098
    Abstract: The present invention is intended to solve the problem of a conventional thermosetting conductive paste with respect to bonding-property between an internal electrode(s) and an external electrode(s) so as to provide a multilayer ceramic electronic part suitable for its mounting on a substrate and for its plating-treatment. The present invention relates to a multilayer ceramic electronic part, characterized in that it has an external electrode(s) formed from a thermosetting conductive paste comprising conductive particles having a high melting point, metal powder having a melting point of 300° C. or less and a resin(s).
    Type: Application
    Filed: December 9, 2003
    Publication date: March 2, 2006
    Applicants: Matsushita Electric Industrial Co., LTD., Namics Corporation
    Inventors: Takeshi Kimura, Yamato Takada, Michinori Komagata, Masahiro Kitamura, Kimnori Yokoyama
  • Conductive adhesive and circuit using the same
    Publication number: 20050230667
    Abstract: The present invention provides a conductive adhesive comprising conductive particles and a resin wherein 30% by weight or more of the conductive particles substantially comprise silver and tin, and a molar ratio of silver and tin in the metal components of the conductive adhesive is in the range of 77.5:22.5 to 0:100; and a circuit connected by using the conductive adhesive.
    Type: Application
    Filed: March 3, 2005
    Publication date: October 20, 2005
    Inventors: Michinori Komagata, Yukio Shirai, Kenichi Suzuki, Katsuaki Suganuma
  • Conductive adhesive and circuit using the same
    Patent number: 5714238
    Abstract: There is disclosed a conductive adhesive comprising(A) conductive particles having a surface of at least one of nickel and nickel-boron alloy, and the surface of which has been subjected to surface treatment with a mixture of a polyoxyalkylene phosphate compound and a polyoxyalkylenealkyl or polyoxyalkylenealkenyl amine or a derivative thereof;(B) an epoxy compound which contains a diglycidyl epoxy compound used as a reactive diluent in an amount of 20 to 70 weight % based on the total amount of the epoxy compound; and(C) a phenolic resin hardener which contains at least one of an alkyl resol phenolic resin and alkyl novolak phenolic resin in an amount of 50% by weight or more based on the total amount of the phenolic resin hardener.
    Type: Grant
    Filed: November 27, 1996
    Date of Patent: February 3, 1998
    Assignee: Namics Corporation
    Inventors: Michinori Komagata, Kiminori Yokoyama, Yoshinobu Tanaka, Kenichi Suzuki