Patents by Inventor Michio Nashiwa

Michio Nashiwa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Resin-sandwiched metal laminate, process and apparatus for producing the same and process for producing resin film for the resin-sandwiched metal laminate
    Patent number: 5236533
    Abstract: A resin-sandwiched metal laminate, a process and apparatus for producing the same and a process for producing a resin film for the resin-sandwiched metal laminate are disclosed. The laminate comprises a pair of face and back metal sheets and a resin layer and is capable of passing electricity between the face and back metal sheets, the resin layer being composed of electroconductive filler-containing resin regions at the side edges of the resin layer in the width direction of the metal sheets and an electroconductive filler-free resin center region provided between the electroconductive filler-containing resin regions at the side edges.
    Type: Grant
    Filed: October 16, 1991
    Date of Patent: August 17, 1993
    Assignee: Nippon Steel Corporation
    Inventors: Ryuusuke Imai, Michio Nashiwa, Yasuhiro Oomura, Ryouichi Matsuda, Michio Satou, Tamayuki Takeuchi
  • Resin-sandwiched metal laminate, process and apparatus for producing the same and process for the producing resin film for the resin-sandwiched metal laminate
    Patent number: 5188698
    Abstract: A resin-sandwiched metal laminate, a process and apparatus for producing the same and a process for producing a resin film for the resin-sandwiched metal laminate are disclosed. The laminate comprises a pair of face and back metal sheets and a resin layer and is capable of passing electricity between the face and back metal sheets, the resin layer being composed of electroconductive filler-containing resin regions at the side edges of the resin layer in the width direction of the metal sheets and an electroconductive filler-free resin center region provided between the electroconductive filler-containing resin regions at the side edges.
    Type: Grant
    Filed: March 27, 1992
    Date of Patent: February 23, 1993
    Assignee: Nippon Steel Corporation
    Inventors: Ryuusuke Imai, Michio Nashiwa, Yasuhiro Oomura, Ryouichi Matsuda, Michio Satou, Tamayuki Takeuchi
  • Resin-sandwiched metal laminate, process and apparatus for producing the same and process for producing resin film for the resin-sandwiched metal laminate
    Patent number: 5084357
    Abstract: A resin-sandwiched metal laminate, a process and apparatus for producing the same and a process for producing a resin film for the resin-sandwiched metal laminate are disclosed. The laminate comprises a pair of face and back metal sheets and a resin layer and is capable of passing electricity between the face and back metal sheets, the resin layer being composed of electroconductive filler-containing resin regions at the side edges of the resin layer in the width direction of the metal sheets and an electroconductive filler-free resin center region provided between the electroconductive filler-containing resin regions at the side edges.
    Type: Grant
    Filed: January 4, 1990
    Date of Patent: January 28, 1992
    Assignee: Nippon Steel Corporation
    Inventors: Ryuusuke Imai, Michio Nashiwa, Yasuhiro Oomura, Ryouichi Matsuda, Michio Satou, Tamayuki Takeuchi