Abstract: An inductance component is disclosed. This inductance component includes base made of insulating material, coil section buried in base, and external electrode terminals electrically coupled to the ends of coil section. Stress buffering section is provided on the exposed interface between base and external electrode terminals, and this stress buffering section can ease the stress produced by the difference in thermal coefficients due to temperature changes. The foregoing structure thus allows improving the reliability of the inductance component with respect to a thermal shock.

Abstract: In an inductance component, a stress is not locally applied even in the condition where heat is applied to entire component, such as when implementing soldering, so that high reliability is realized. For realizing this, the component includes an element, a coil formed in the element, terminals electrically connected to the coil, and magnetic layers arranged so as to be substantially parallel to a winding surface of the coil are formed in the element and the entirety of the magnetic layers is covered with a material of which thermal expansion and contraction rate is uniform.

Abstract: An inductance component is disclosed. This inductance component includes base made of insulating material, coil section buried in base, and external electrode terminals electrically coupled to the ends of coil section. Stress buffering section is provided on the exposed interface between base and external electrode terminals, and this stress buffering section can ease the stress produced by the difference in thermal coefficients due to temperature changes. The foregoing structure thus allows improving the reliability of the inductance component with respect to a thermal shock.

Abstract: In an inductance component, a stress is not locally applied even in the condition where heat is applied to entire component, such as when implementing soldering, so that high reliability is realized. For realizing this, the component includes element (5), coil (6) formed in element (5), terminals (7, 8) electrically connected to coil (6), and magnetic layers (9A, 9B) arranged so as to be substantially parallel to a winding surface of coil (6) are formed in element (5) and entire magnetic layers (9A, 9B) is covered with a material of which thermal expansion and contraction rates are constant.

Abstract: In conventional electronic components, having a substrate as a component of the structure has been an obstacle to an ultra-low profile design. To address the problem, the present invention provides an improved structure without a substrate. Internal electrode 15 is formed into a predetermined coil pattern. Bumps 16 and irregularities 17 are formed on confronting surfaces of the component, by which each component is hard-to-cling with one another. On the other hand, the confronting side-surfaces with no bumps 16 or irregularities 17 allow a mounting device to have an improved vacuum suction force. Such structured electronic component maintains easy handling even when it is extremely downsized.

Abstract: The inductance component has a base material, a coil formed in the base material and an electrode electrically connected to the coil. In addition, an impact-absorption layer is disposed between the electrode and the base material. Forming impact-absorption layer between the base material and the electrode allows the base material to have flexibility even if an impact is given on the base material, providing the component with high impact-resistance.

Abstract: A three-dimensional coil pattern, whose internal electrode is connected to external electrodes through a via, is formed within photosensitive resin colored by colorant. This structure allows this electronic component to be lower profile. Cured and colored resin that works as a protecting section of the coil pattern prevents irregular reflection on the internal electrode or the via due to illuminating the component when the component is mounted, so that the component can be handled with more ease.

Abstract: In conventional electronic components, having a substrate as a component of the structure has been an obstacle to an ultra-low profile design. To address the problem, the present invention provides an improved structure without a substrate. Internal electrode 15 is formed into a predetermined coil pattern. Bumps 16 and irregularities 17 are formed on confronting surfaces of the component, by which each component is hard-to-cling with one another. On the other hand, the confronting side-surfaces with no bumps 16 or irregularities 17 allow a mounting device to have an improved vacuum suction force. Such structured electronic component maintains easy handling even when it is extremely downsized.

Abstract: The inductance component has a base material, a coil formed in the base material and an electrode electrically connected to the coil. In addition, an impact-absorption layer is disposed between the electrode and the base material. Forming impact-absorption layer between the base material and the electrode allows the base material to have flexibility even if an impact is given on the base material, providing the component with high impact-resistance.

Abstract: A coil electric conductor has an insulating substrate, a first conductive layer, and a second conductive layer. The first conductive layer is formed at a depression provided on a face of the insulating substrate. The second conductive layer is formed on the first conductive layer with the first conductive layer interposed between the second conductive layer and the insulating substrate. This construction realizes a coil electric conductor having a highly precisely uniformized cross-sectional shape.

Abstract: A coil electric conductor has an insulating substrate, a first conductive layer, and a second conductive layer. The first conductive layer is formed at a depression provided on a face of the insulating substrate. The second conductive layer is formed on the first conductive layer with the first conductive layer interposed between the second conductive layer and the insulating substrate. This construction realizes a coil electric conductor having a highly precisely uniformized cross-sectional shape.

Abstract: The present invention provides a protein consisting of the amino acid sequence represented by SEQ ID NO: 2, as well as proteins comprising an amino acid sequence wherein one or more amino acids are deleted, substituted, added or inserted in the amino acid sequence represented by SEQ ID NO: 2, whose activated form has a cell-recognizing activity and/or a cytopathic activity. The present invention also provides a nucleic acid molecule consisting of the nucletide sequence represented by SEQ ID NO: 1, as well as nucleic acid molecules which hybridize under stringent conditions to a nucleic acid molecule having a nucleotide sequence complementary to the nucleotide sequence represented by SEQ ID NO: 1, and which encode a protein having a cell-recognizing activity and/or a cytopathic activity in an activated form.

Abstract: A flexible polymer optical waveguide device which is excellent in mechanical strength and durability against environments, particularly excellent in heat and chemical resistance, with maintaining characteristics of an optical waveguide and which can be easily produced, and a process for the production thereof, the flexible optical waveguide device having a structure in which a cured resin layer is formed on at least one surface of an optical waveguide film obtained by forming a refractive index distribution in a light-permeable polymer film, the cured resin layer(s) comprising a polyamide resin and at least one of an epoxy resin and a phenolic resin as main components.

Abstract: An optical device which can be fabricated without any axial alignment by optical measurement and can therefore be produced at a remarkably decreased cost, and which is composed of an optical waveguide part (1) obtained by perpendicularly cutting an optically-transparent polymer film having a glass substrate attached thereto and having a refractive index distribution formed, in a predetermined position measured from the position of the refractive index distribution as a reference, and a holder part (2) for holding the optical waveguide part (1) in a predetermined position, the holder part (2) having a horizontal guide surface (2H) and a vertical guide surface (2V), the optical waveguide part (1) having a glass substrate surface or a polymer film surface coherently attached to the horizontal guide surface (2H) of the holder part (2), and the optical waveguide part (1) having a perpendicularly cut surface coherently attached to the vertical guide surface (2V) of the holder part (2).

Abstract: An optical waveguide module having a main-line waveguide, which is excellent in optical branching properties, important properties of a bus communication network, and the reproducibility of the above branching properties and is easy to produce, and an optical transmission equipment having the above optical waveguide module. The optical waveguide module having a main-line waveguide which is connected to the optical transmission path and works as part of the optical transmission path and a pair of branch waveguides (21,22) which are unidirectionally branched from the main-line waveguide, the main-line waveguide and the branch waveguides being formed by providing an optically transparent polymer film with a refractive index distribution, a light-receiving device (25) being connected to one (21) of a pair of the branch waveguides, a light-emitting device (26) being connected to the other (22).

Abstract: An object of the present invention is to allow an optical element to be obtained with good precision using a polymer film and a glass substrate as a reinforcer. The present invention is characterized by the fact that a polymer film is formed on a glass substrate which has been treated to prevent the glass substrate and polymer from separation. This allows an optical circuit pattern to be formed without producing separation between the glass substrate and polymer film when the film is formed. The dimensional precision of the configuration of the distributed index in the polymer film can be maintained generally to the same extent as the expansion and shrinkage of the glass substrate. In addition, a vessel obtained with a glass substrate as the bottom surface can be used as the casting vessel.

Abstract: The present invention provides a curved optical waveguide with reduced loss. Particularly, it relates to a waveguide with rectangular cross-section which has a curved portion, wherein the relation between the width D of the waveguide at the curved portion and the radius R of the curvature is R/D.ltoreq.500. This waveguide is provided with at least one cladding inside the core of said curved portion, thereby dividing the waveguide at the curved portion in a plurality of narrow optical waveguides. This enables a large reduction of the loss even in curved optical waveguides with sharp curves, and realizes inexpensive optical waveguides.

Abstract: Bacillus thuringiensis serovar japonensis strain Buibui (FERM BP-3465) belonging to Bacillus thuringiensis serovar japonensis and capable of producing insecticidal toxin proteins to kill coleopterous larvae, and an insecticide containing, as an effective ingredient, the toxin proteins produced.

Abstract: An optical fiber array, wherein a plurality of optical fibers are inserted between a pair of substrates consisting of a first substrate, wherein a parallel groove is formed at one end thereof for accommodating the ends of portions of a plurality of optical fibers where no covering portions are formed, an approximately rectangular groove is formed at the other end thereof for accommodating the portions of said optical fibers where covering portions are formed, and a tapered groove is formed which connects from said parallel groove towards the approximately rectangular groove whilst rectangular groove is formed at said other end thereof for accommodating the portions of said optical fibers where covering portions are formed.

Abstract: Bacillus thuringiensis serovar japonensis strain Buibui (FERM BP-3465) belonging to Bacillus thuringiensis serovar japonensis and capable of producing insecticidal toxin proteins to kill coleopterous larvae, and an insecticide containing, as an effective ingredient, the toxin proteins produced.