Patents by Inventor Michio Okamoto

Michio Okamoto has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7663209
    Abstract: Provided are an inlet for an electronic tag comprising an insulating film, antennas each made of a conductor layer and formed over one surface of the insulating film, a slit formed in a portion of each of the antennas and having one end extending toward the outer edge of the antenna, a semiconductor chip electrically connected with each of the antennas via a plurality of bump electrodes, and a resin for sealing the semiconductor chip therewith; and a manufacturing process of the inlet. By the present invention, formation of a thin and highly-reliable inlet for a non-contact type electronic tag can be actualized.
    Type: Grant
    Filed: June 16, 2006
    Date of Patent: February 16, 2010
    Assignee: Renesas Technology Corp.
    Inventors: Michio Okamoto, Yuichi Morinaga, Yuji Ikeda, Takeshi Saito
  • Publication number: 20090283599
    Abstract: A method accurately inspects whether an IC inlet to be inspected is non-defective or defective in a state in which a large number of IC inlets are formed over an insulating film. The inspection of IC inlets formed over an insulating film is performed by transmitting microwaves to the IC inlets from antennas. To selectively irradiate the microwaves to only one IC inlet to be inspected out of a large number of IC inlets that are formed over the insulating film, a radio-wave absorbing plate is inserted between the insulating film and the antennas, and the microwaves are irradiated to the IC inlet through a slit formed in the radio-wave absorbing plate. The radio-wave absorbing plate is configured such that the slit, which is substantially equal to the IC inlet in size, is formed in a portion of a planar plate that is formed of a radio-wave absorber.
    Type: Application
    Filed: July 30, 2009
    Publication date: November 19, 2009
    Inventors: Michio OKAMOTO, Hisao Yamagata, Nobuo Murakami, Keizo Kakitani, Hidehiro Fujiwara, Takeshi Saitou
  • Patent number: 7531232
    Abstract: A component for a vacuum apparatus for use in a plasma processing apparatus or a film forming apparatus for a semiconductor or the like, in which a surface is covered with a ceramic and/or metallic thermal spray film and projection-shaped particles of a width of 10-300 ?m, a height of 4-600 ?m and an average height/width ratio of 0.4 or higher are present within a range of 20-20,000 particle/mm2 on the surface of the thermal spray film. The thermal spray film has a porosity of 10-40%, shows a high adhering property to a film-shaped substance, is free from a product contamination by particles generated by a peeling of the film-shaped substance and can be continuously used over a prolonged period.
    Type: Grant
    Filed: October 15, 2004
    Date of Patent: May 12, 2009
    Assignee: Tosoh Corporation
    Inventors: Koyata Takahashi, Osamu Matsunaga, Michio Okamoto
  • Publication number: 20060258025
    Abstract: A method accurately inspects whether an IC inlet to be inspected is non-defective or defective in a state in which a large number of IC inlets are formed over an insulating film. The inspection of IC inlets formed over an insulating film is performed by transmitting microwaves to the IC inlets from antennas. To selectively irradiate the microwaves to only one IC inlet to be inspected out of a large number of IC inlets that are formed over the insulating film, a radio-wave absorbing plate is inserted between the insulating film and the antennas, and the microwaves are irradiated to the IC inlet through a slit formed in the radio-wave absorbing plate. The radio-wave absorbing plate is configured such that the slit, which is substantially equal to the IC inlet in size, is formed in a portion of a planar plate that is formed of a radio-wave absorber.
    Type: Application
    Filed: July 24, 2006
    Publication date: November 16, 2006
    Inventors: Michio Okamoto, Hisao Yamagata, Nobuo Murakami, Keizo Kakitani, Hidehiro Fujiwara, Takeshi Saitou
  • Publication number: 20060232415
    Abstract: Provided are an inlet for an electronic tag comprising an insulating film, antennas each made of a conductor layer and formed over one surface of the insulating film, a slit formed in a portion of each of the antennas and having one end extending toward the outer edge of the antenna, a semiconductor chip electrically connected with each of the antennas via a plurality of bump electrodes, and a resin for sealing the semiconductor chip therewith; and a manufacturing process of the inlet. By the present invention, formation of a thin and highly-reliable inlet for a non-contact type electronic tag can be actualized.
    Type: Application
    Filed: June 16, 2006
    Publication date: October 19, 2006
    Inventors: Michio Okamoto, Yuichi Morinaga, Yuji Ikeda, Takeshi Saito
  • Patent number: 7105916
    Abstract: Provided are an inlet for an electronic tag comprising an insulating film, antennas each made of a conductor layer and formed over one surface of the insulating film, a slit formed in a portion of each of the antennas and having one end extending toward the outer edge of the antenna, a semiconductor chip electrically connected with each of the antennas via a plurality of bump electrodes, and a resin for sealing the semiconductor chip therewith; and a manufacturing process of the inlet. By the present invention, formation of a thin and highly-reliable inlet for a non-contact type electronic tag can be actualized.
    Type: Grant
    Filed: August 6, 2003
    Date of Patent: September 12, 2006
    Assignee: Renesas Technology Corp.
    Inventors: Michio Okamoto, Yuichi Morinaga, Yuji Ikeda, Takeshi Saito
  • Patent number: 7030763
    Abstract: In the event of the shipment of electronic tags from a manufacturer to a customer, a number of the electronic tags required by the customer are adhered to a double-faced adhesive tape and then the double-faced adhesive tape is wound on a reel. Then, this reel is contained in a case and shipped to the customer. The electronic tag is adhered to an article in the following manner. That is, the double-faced adhesive tape is cut to obtain pieces of the electronic tags, and the cover tape on the rear surface of the double-faced adhesive tape is peeled, and then, the electronic tag is adhered to the article by the use of the double-faced adhesive tape.
    Type: Grant
    Filed: January 14, 2003
    Date of Patent: April 18, 2006
    Assignee: Renesas Technology Corp.
    Inventors: Michio Okamoto, Yuichi Morinaga, Yuji Ikeda, Takeshi Saito
  • Patent number: 6902814
    Abstract: In quartz glass parts and ceramic parts that are used in film-deposition devices and pre-cleaning devices in the production of semiconductors, etc., there are problems such as peeling off of the parts themselves during the use, peeling off of film-like substances adhered to the part surfaces, contamination of the products and short life time of the parts caused by corrosion of the part surfaces by plasma, and reduction in the productivity by frequent exchange of the parts. In quartz glass parts and ceramic parts that are used in film-deposition devices and pre-cleaning devices in the production of semiconductors, etc.
    Type: Grant
    Filed: November 7, 2002
    Date of Patent: June 7, 2005
    Assignee: Tosoh Corporation
    Inventors: Koyata Takahashi, Michio Okamoto, Masanori Abe
  • Publication number: 20050084654
    Abstract: A component for a vacuum apparatus for use in a plasma processing apparatus or a film forming apparatus for a semiconductor or the like, in which a surface is covered with a ceramic and/or metallic thermal spray film and projection-shaped particles of a width of 10-300 ?m, a height of 4-600 ?m and an average height/width ratio of 0.4 or higher are present within a range of 20-20,000 particle/mm2 on the surface of the thermal spray film. The thermal spray film has a porosity of 10-40%, shows a high adhering property to a film-shaped substance, is free from a product contamination by particles generated by a peeling of the film-shaped substance and can be continuously used over a prolonged period.
    Type: Application
    Filed: October 15, 2004
    Publication date: April 21, 2005
    Inventors: Koyata Takahashi, Osamu Matsunaga, Michio Okamoto
  • Publication number: 20040253818
    Abstract: A method accurately inspects whether an IC inlet to be inspected is non-defective or defective in a state in which a large number of IC inlets are formed over an insulating film. The inspection of IC inlets formed over an insulating film is performed by transmitting microwaves to the IC inlets from antennas. To selectively irradiate the microwaves to only one IC inlet to be inspected out of a large number of IC inlets that are formed over the insulating film, a radio-wave absorbing plate is inserted between the insulating film and the antennas, and the microwaves are irradiated to the IC inlet through a slit formed in the radio-wave absorbing plate. The radio-wave absorbing plate is configured such that the slit, which is substantially equal to the IC inlet in size, is formed in a portion of a planar plate that is formed of a radio-wave absorber.
    Type: Application
    Filed: January 9, 2004
    Publication date: December 16, 2004
    Inventors: Michio Okamoto, Hisao Yamagata, Nobuo Murakami, Keizo Kakitani, Hidehiro Fujiwara, Takeshi Saitou
  • Patent number: 6762682
    Abstract: In the event of the shipment of electronic tags from a manufacturer to a customer, a number of the electronic tags required by the customer are adhered to a double-faced adhesive tape and then the double-faced adhesive tape is wound on a reel. Then, this reel is contained in a case and shipped to the customer. The electronic tag is adhered to an article in the following manner. That is, the double-faced adhesive tape is cut to obtain pieces of the electronic tags, and the cover tape on the rear surface of the double-faced adhesive tape is peeled, and then, the electronic tag is adhered to the article by the use of the double-faced adhesive tape.
    Type: Grant
    Filed: September 27, 2002
    Date of Patent: July 13, 2004
    Assignee: Renesas Technology Corp.
    Inventors: Michio Okamoto, Yuichi Morinaga, Yuji Ikeda, Takeshi Saito
  • Publication number: 20040041262
    Abstract: Provided are an inlet for an electronic tag comprising an insulating film, antennas each made of a conductor layer and formed over one surface of the insulating film, a slit formed in a portion of each of the antennas and having one end extending toward the outer edge of the antenna, a semiconductor chip electrically connected with each of the antennas via a plurality of bump electrodes, and a resin for sealing the semiconductor chip therewith; and a manufacturing process of the inlet. By the present invention, formation of a thin and highly-reliable inlet for a non-contact type electronic tag can be actualized.
    Type: Application
    Filed: August 6, 2003
    Publication date: March 4, 2004
    Applicant: Renesas Technology Corp.
    Inventors: Michio Okamoto, Yuichi Morinaga, Yuji Ikeda, Takeshi Saito
  • Publication number: 20030107486
    Abstract: In the event of the shipment of electronic tags from a manufacturer to a customer, a number of the electronic tags required by the customer are adhered to a double-faced adhesive tape and then the double-faced adhesive tape is wound on a reel. Then, this reel is contained in a case and shipped to the customer. The electronic tag is adhered to an article in the following manner. That is, the double-faced adhesive tape is cut to obtain pieces of the electronic tags, and the cover tape on the rear surface of the double-faced adhesive tape is peeled, and then, the electronic tag is adhered to the article by the use of the double-faced adhesive tape.
    Type: Application
    Filed: January 14, 2003
    Publication date: June 12, 2003
    Applicant: Hitachi, Ltd.
    Inventors: Michio Okamoto, Yuichi Morinaga, Yuji Ikeda, Takeshi Saito
  • Publication number: 20030091835
    Abstract: In quartz glass parts and ceramic parts that are used in film-deposition devices and pre-cleaning devices in the production of semiconductors, etc., there are problems such as peeling off of the parts themselves during the use, peeling off of film-like substances adhered to the part surfaces, contamination of the products and short life time of the parts caused by corrosion of the part surfaces by plasma, and reduction in the productivity by frequent exchange of the parts. In quartz glass parts and ceramic parts that are used in film-deposition devices and pre-cleaning devices in the production of semiconductors, etc.
    Type: Application
    Filed: November 7, 2002
    Publication date: May 15, 2003
    Applicant: TOSOH CORPORATION
    Inventors: Koyata Takahashi, Michio Okamoto, Masanori Abe
  • Publication number: 20030063002
    Abstract: In the event of the shipment of electronic tags from a manufacturer to a customer, a number of the electronic tags required by the customer are adhered to a double-faced adhesive tape and then the double-faced adhesive tape is wound on a reel. Then, this reel is contained in a case and shipped to the customer. The electronic tag is adhered to an article in the following manner. That is, the double-faced adhesive tape is cut to obtain pieces of the electronic tags, and the cover tape on the rear surface of the double-faced adhesive tape is peeled, and then, the electronic tag is adhered to the article by the use of the double-faced adhesive tape.
    Type: Application
    Filed: September 27, 2002
    Publication date: April 3, 2003
    Applicant: Hitachi, Ltd.
    Inventors: Michio Okamoto, Yuichi Morinaga, Yuji Ikeda, Takeshi Saito
  • Patent number: 6283478
    Abstract: The present invention provides a piston ring structural body composed of an outer ring continuously formed of a resinous material, an inner ring continuously formed of a resinous material and a ring tensile force applying member for pressing the outer ring radially outwards via the inner ring. The piston ring structural body has a construction wherein the outer ring continuously formed of polyimide is pressed outwards in the radial direction of the piston by a coil expander via the inner ring continuously formed of PTFE. A sliding face of the outer ring, which slides on a cylinder wall, is divided into upper and lower sliding faces, whose respective upper edge portions are provided with chamfers. A contact portion of the inner ring that contacts the coil expander is provided with an upper inclined face extending inwards and upwards and a lower inclined face extending inwards and downwards. The angles of inclination of the upper and lower inclined faces range from 30° to 60°.
    Type: Grant
    Filed: February 4, 1999
    Date of Patent: September 4, 2001
    Assignees: Toyota Jidosha Kabushiki Kaisha, Teikoku Piston Ring Co., Ltd.
    Inventors: Teruo Kumai, Michio Okamoto
  • Patent number: 6257590
    Abstract: The present invention provides a sealing structure employing a piston ring structural body of a type wherein an outer ring continuously formed of a resinous material is pressed radially outwards by a metal coil expander via a metal inner ring provided with an abutment. The piston ring structural body has a construction wherein the outer ring continuously formed of polyimide is pressed radially outwards by the coil expander via the steel inner ring provided with the abutment. A sliding face of the outer ring, which slides on a cylinder wall, is divided by a groove into upper and lower sliding faces, whose respective upper edge portions are provided with chamfers.
    Type: Grant
    Filed: February 4, 1999
    Date of Patent: July 10, 2001
    Assignees: Toyota Jidosha Kabushiki Kaisha, Teikoku Piston Ring Co., Ltd.
    Inventors: Teruo Kumai, Yoshihiko Masuda, Michio Okamoto
  • Patent number: 6205908
    Abstract: The present invention aims at reducing the amount of oil consumption in a piston using a piston ring continuously formed of resin without being provided with an abutment. A stepped portion is formed on a third land, which is located below a second ring having a construction wherein an outer ring continuously formed of polyimide without being provided with an abutment is pressed against a cylinder wall by a coil expander via an inner ring continuously formed of PTFE without being provided with an abutment. Oil spill ports are provided so as to allow communication between the stepped portion and an inner wall of the piston.
    Type: Grant
    Filed: February 4, 1999
    Date of Patent: March 27, 2001
    Assignee: Toyota Jidosha Kabushiki Kaisha
    Inventors: Teruo Kumai, Michio Okamoto
  • Patent number: 4950866
    Abstract: A method of bonding an insulated and coated wire which has an insulated coating on the outside of an electrically conductive wire is disclosed which consists in connecting one end of said insulated and coated wire to the anode side of an arc power source and connecting a discharge torch to the cathode side of said arc power source with an arc discharge performed between the tip of said insulated and coated wire and the discharge torch to form a ball at said end, and said ball being positioned with respect to the bonding pad of an electrically conductive electrode and bonding being performed with a specified pressure applied to said ball.
    Type: Grant
    Filed: November 29, 1988
    Date of Patent: August 21, 1990
    Assignee: Hitachi, Ltd.
    Inventors: Toosaku Kojima, Tsutomu Mimata, Susumu Okikawa, Michio Okamoto, Takeshi Kawana, Satoshi Urayama
  • Patent number: 4723270
    Abstract: In each exchange (12) of a communication network, a template data memory (31) keeps "exchange" template data according to which traffic data should be monitored at the exchange. In a center (11) of the network, a template data file (33) keeps copies of the template data of the respective exchanges of the network as "center" template data. When a change in the exchange template data is transmitted from a "change" originating exchange to the center, a central processor (13) updates the center template data accordingly for the originating exchange. Traffic data are transmitted from the respective exchanges to the center without the exchange template data. When such a traffic datum is transmitted from a "data" originating exchange to the center, the central processor stores the traffic datum in a traffic data log file (17) according to the template data kept in the template data file for the data originating exchange.
    Type: Grant
    Filed: November 12, 1986
    Date of Patent: February 2, 1988
    Assignee: NEC Corporation
    Inventors: Michio Okamoto, Atsushi Tsuchihashi, Yasuo Kobayashi