Patents by Inventor Michio Ootani

Michio Ootani has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Heat-insulating panel serving as concrete form and method of manufacturing the same
    Patent number: 5700414
    Abstract: The present invention relates to a heat-insulating panel formed of curly contracted pieces of tapes, for example thermally contracted pieces of magnetic tapes, and a method of manufacturing such a panel. In particular, the present invention concerns a heat-insulating panel which also serves as a concrete form. The heat-insulating panel has excellent strength characteristics such, as bending strength and bending rigidity, and dimensional stability, as well as characteristics of sound absorption, heat-insulation, electrostatic shielding and electromagnetic wave absorption, and is usable for a concrete form when placing concrete during the construction of a building formed of reinforced concrete or steelframe reinforced concrete. The present invention relates also to a method of manufacturing the panel.
    Type: Grant
    Filed: November 3, 1995
    Date of Patent: December 23, 1997
    Assignees: Nihon Cement Co. Ltd., Fuji Kasei Kogyo Kabushiki Kaisha
    Inventors: Yuukou Ishikawa, Noboru Nishimoto, Michio Ootani, Tooru Tanibe, Kazushige Suzuki, Kanesuke Kasahara
  • Heat-insulating panel serving as concrete form
    Patent number: 5631075
    Abstract: A heat-insulating panel serving also as a concrete frame excellent in bending strength characteristics and dimensional stability and a method of manufacturing the panel. Cut or shredded pieces having lengths of 20 mm or less of magnetic tapes are heated to 100.degree. to 200.degree. C., thus forming contracted pieces of magnetic tapes in curled shapes. The curled contracted pieces of magnetic tapes in an amount of 100 parts by weight are mixed with 10 to 50 parts by weight of a thermosetting resin as a binder, and are compression-molded under a pressure ranging from 2 to 20 kgf/cm.sup.2 at a temperature from 100.degree. to 200.degree. C.
    Type: Grant
    Filed: October 31, 1994
    Date of Patent: May 20, 1997
    Assignees: Nihon Cement Co., Ltd., Fuji Kasei Kogyo Kabushiki Kaisha
    Inventors: Yuukou Ishikawa, Noboru Nishimoto, Michio Ootani, Tooru Tanibe, Kazushige Suzuki, Kanesuke Kasahara
  • Semiconductor device
    Patent number: 5196915
    Abstract: In a semiconductor device such as hybrid IC, thermal heads, etc., a thick film resistor of the semiconductor device contains a boride particle of a metal dispersed in a glass matrix, the particle having a particles size of 0.005 to 0.1 .mu.m. Generation of a thermal stress can be suppressed and the electroconductive particles themselves form isotropic electroconductive passages by such dispersion, and the semiconductor devices can have a distinguished electroconductivity. Preferable boride of a metal is LaB.sub.6, which gives distinguished resistor characteristics.
    Type: Grant
    Filed: November 17, 1989
    Date of Patent: March 23, 1993
    Assignees: Hitachi, Ltd., Hitachi Chemical Company, Ltd.
    Inventors: Osamu Ito, Tadamichi Asai, Toshio Ogawa, Mitsuru Hasegawa, Akira Ikegami, Yoshishige Endoh, Michio Ootani, Katsuo Ebisawa