Patents by Inventor Michiro Kawanishi

Michiro Kawanishi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210179893
    Abstract: A pressure-sensitive adhesive sheet including a pressure-sensitive adhesive layer having an adhesive strength reducible by an adhesive strength-reducing action. For example, the pressure-sensitive adhesive layer is a thermally releasable pressure-sensitive adhesive layer (11), and the adhesive strength-reducing action is heating of the pressure-sensitive adhesive layer (11). This pressure-sensitive adhesive sheet for build stage use is suitable for allowing an object to be formed over a build stage of an additive manufacturing apparatus to be attached to the build stage during building up, and to be readily detached from the build stage after building up. An additive manufacturing apparatus can employ the pressure-sensitive adhesive sheet for build stage use and includes a build stage, and adhesive strength-reducing means for performing an adhesive strength-reducing action to a pressure-sensitive adhesive layer of the pressure-sensitive adhesive sheet for build stage use affixed to the stage.
    Type: Application
    Filed: March 7, 2017
    Publication date: June 17, 2021
    Applicant: Nitto Denko Corporation
    Inventors: Yoshiko OGINO, Yutaka TOSAKI, Michiro KAWANISHI, Kiichiro MATSUSHITA, Akiko NONAKA, Akihisa MURATA
  • Publication number: 20190092978
    Abstract: A pressure-sensitive adhesive sheet (X1), which is a pressure-sensitive adhesive sheet for build stage use according to the present invention, has a multilayer structure typically including a substrate (11) and a pressure-sensitive adhesive layer (12). The pressure-sensitive adhesive sheet (X1) has a puncture strength of 3.3 to 12 N, where the puncture strength is determined as a maximum load during a process in which a probe having a hemispherical head with the radius of curvature of 0.5 mm pierces the pressure-sensitive adhesive sheet at a travel speed of 0.2 mm/s. The pressure-sensitive adhesive sheet for build stage use is suitable for detachment of an object, which is formed on a build stage typically of an additive manufacturing apparatus, from the build stage while less causing the significant damage to the object.
    Type: Application
    Filed: February 28, 2017
    Publication date: March 28, 2019
    Applicant: NITTO DENKO CORPORATION
    Inventors: Yoshiko OGINO, Yutaka TOSAKI, Michiro KAWANISHI
  • Patent number: 5958580
    Abstract: A masking tape or sheet comprising a substrate comprising a resin (a) comprising a polypropylene as a hard segment and an olefin copolymer as a soft segment, and an adhesive layer formed on one side of said substrate. The masking tape of the present invention can precisely follow the shape of adhesion surfaces having curves, and can provide fine parting lines. In particular, when polypropylene resin (b) is added to the resin (a), the back face of the masking tape becomes smooth and can be adhered easily with fingers, and the tape can be easily cut with a cutter knife. Hence, the use of the masking tape of the present invention leads to an improved efficiency of adhesion work, particularly when the work is manually done. In addition, since the masking tape of the present invention does not contain vinyl chloride in the substrate, the masking tape after use can be incinerated without generating a toxic gas such as chlorine gas.
    Type: Grant
    Filed: March 6, 1997
    Date of Patent: September 28, 1999
    Assignee: Nitto Denko Corporation
    Inventors: Naoki Kohno, Kazuhisa Maeda, Michiro Kawanishi, Kazuhito Okumura