Abstract: Disclosed is an electronic document, a body of which includes an inlay, a part of which forms a spotface of a cavity, and which includes a connection land formed on the part forming the spotface, and a module of which includes an electrical circuit that includes both a first subcircuit configured to electrically connect a port of a chip to the connection land and a second subcircuit configured to electrically connect the connection land to an external electrical contact land of a carrier of the module.

Abstract: Disclosed is an electronic document, a body of which includes an inlay, a part of which forms a spotface of a cavity, and which includes a connection land formed on the part forming the spotface, and a module of which includes an electrical circuit that includes both a first subcircuit configured to electrically connect a port of a chip to the connection land and a second subcircuit configured to electrically connect the connection land to an external electrical contact land of a carrier of the module.

Abstract: A method and tooling for fabricating a thin plastic plate of large format and of large thickness and including a card of small format and of small thickness that is detachable from the plate. The method, which may be implemented using the tooling, includes operations for making a spotface in a face of the plate to a depth equal to the difference between the large thickness and the small thickness; punching in the spotface zone along a leveling direction facing another face of the plate opposite from the first face, to a leveling stroke (en) equal to the depth of the spotface, in order to bring the bottom of the spotface level with the first face of the plate; and pre-cutting an outline of the card within the leveled zone, in order to make the card detachable.

Abstract: A dual module for a dual chip card includes a supporting film supporting on an outer surface, a plurality of connecting pads including two series of connecting pads extending in a given direction and, on an inner surface, two inner connection areas for connection to an antenna of the dual card and a chip, the chip including contact terminals connected by wires to the inner connection areas or electric connecting pads by holes passing through the supporting film while being coated, together with the wires, by coating resin. The electric connecting pads of the outer surface include only three pads. Each of the two inner connection areas forms a comb including a body extending under each of the pads of one of the two series of connecting pads separated from the coating mass, respectively. Blades extend separately from one another from the body until ends covered by the coating mass.

Abstract: A dual module for a dual chip card includes a supporting film supporting on an outer surface, a plurality of connecting pads including two series of connecting pads extending in a given direction and, on an inner surface, two inner connection areas for connection to an antenna of the dual card and a chip, the chip including contact terminals connected by wires to the inner connection areas or electric connecting pads by holes passing through the supporting film while being coated, together with the wires, by coating resin. The electric connecting pads of the outer surface include only three pads. Each of the two inner connection areas forms a comb including a body extending under each of the pads of one of the two series of connecting pads separated from the coating mass, respectively. Blades extend separately from one another from the body until ends covered by the coating mass.

Abstract: A method and tooling for fabricating a thin plastic plate of large format and of large thickness and including a card of small format and of small thickness that is detachable from the plate. The method, which may be implemented using the tooling, includes operations for making a spotface in a face of the plate to a depth equal to the difference between the large thickness and the small thickness; punching in the spotface zone along a leveling direction facing another face of the plate opposite from the first face, to a leveling stroke (en) equal to the depth of the spotface, in order to bring the bottom of the spotface level with the first face of the plate; and pre-cutting an outline of the card within the leveled zone, in order to make the card detachable.

Abstract: A microcircuit card (2) and held within a carrier card (3) is generally shown as 1 in FIG. 1. The microcircuit card (2) is bounded on all edges except one edge (10a) which is free. The free edge (10a) is substantially in alignment with an edge (7) of a carrier card (3). The microcircuit card and carrier card are held together by connections (12), which can be broken to release the microcircuit card (20) so it can be used independently of the carrier card. The position of the microcircuit card allows it to be easily and cleanly removed from the carrier card.

Abstract: A microcircuit card (2) and held within a carrier card (3) is generally shown as 1 in FIG. 1. The microcircuit card (2) is bounded on all edges except one edge (10a) which is free. The free edge (10a) is substantially in alignment with an edge (7) of a carrier card (3). The microcircuit card and carrier card are held together by connections (12), which can be broken to release the microcircuit card (20) so it can be used independently of the carrier card. The position of the microcircuit card allows it to be easily and cleanly removed from the carrier card.