Patents by Inventor MicroLink Devices, Inc.

MicroLink Devices, Inc. has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • THIN FILM INP-BASED SOLAR CELLS USING EPITAXIAL LIFT-OFF
    Publication number: 20150255668
    Abstract: Methods of producing single-junction or multi-junction InP-based solar cells grown latticed-matched on a InP substrate or grown on metamorphic layers on a GaAs substrate, with the substrate subsequently removed in a nondestructive manner via the epitaxial lift-off (ELO) technique, and devices produced using the methods are described herein.
    Type: Application
    Filed: September 28, 2012
    Publication date: September 10, 2015
    Applicant: MICROLINK DEVICES, INC.
    Inventor: Microlink Devices, Inc.
  • THIN FILM INP-BASED SOLAR CELLS USING EPITAXIAL LIFT-OFF
    Publication number: 20130133730
    Abstract: Methods of producing single-junction or multi-junction InP-based solar cells grown latticed-matched on a InP substrate or grown on metamorphic layers on a GaAs substrate, with the substrate subsequently removed in a nondestructive manner via the epitaxial lift-off (ELO) technique, and devices produced using the methods are described herein.
    Type: Application
    Filed: January 28, 2013
    Publication date: May 30, 2013
    Applicant: MICROLINK DEVICES, INC.
    Inventor: Microlink Devices, Inc.
  • LIGHT EMITTING DIODE FABRICATED BY EPITAXIAL LIFT-OFF
    Publication number: 20130082239
    Abstract: A method of fabricating a light emitting diode using an epitaxial lift-off process includes forming a sacrificial layer on a substrate, forming a light emitting diode structure on the sacrificial layer with an epitaxial material, forming a light reflecting layer on the light emitting diode structure, and removing the sacrificial layer using an etching process to separate the substrate from the light emitting diode structure.
    Type: Application
    Filed: September 28, 2012
    Publication date: April 4, 2013
    Applicant: MICROLINK DEVICES, INC.
    Inventor: MICROLINK DEVICES, INC.
  • ASSEMBLY TECHNIQUES FOR SOLAR CELL ARRAYS AND SOLAR CELLS FORMED THEREFROM
    Publication number: 20130037078
    Abstract: An assembly technique for assembling solar cell arrays is provided. During the fabrication of a solar cell, openings through the semiconductor layer are etched through to a top surface of the backmetal layer. The solar cells include an exposed top surface of the backmetal layer. A plurality of solar cells are assembled into a solar cell array where adjacent cells are interconnected in an electrically serial or parallel fashion solely from the top surface of the solar cells.
    Type: Application
    Filed: October 11, 2012
    Publication date: February 14, 2013
    Applicant: MICROLINK DEVICES, INC.
    Inventor: MICROLINK DEVICES, INC.
  • ASSEMBLY TECHNIQUES FOR SOLAR CELL ARRAYS AND SOLAR CELLS FORMED THEREFROM
    Publication number: 20130034926
    Abstract: An assembly technique for assembling solar cell arrays is provided. During the fabrication of a solar cell, openings through the semiconductor layer are etched through to a top surface of the backmetal layer. The solar cells include an exposed top surface of the backmetal layer. A plurality of solar cells are assembled into a solar cell array where adjacent cells are interconnected in an electrically serial or parallel fashion solely from the top surface of the solar cells.
    Type: Application
    Filed: October 11, 2012
    Publication date: February 7, 2013
    Applicant: MICROLINK DEVICES, INC.
    Inventor: MicroLink Devices, Inc.