Abstract: A housing for a personal electronic device is described herein. The housing may include at least structural member configured to be arranged within an internal cavity of the housing. The at least structural member is aligned with a feature external to the housing. The at least one structural member is affixed to an interior surface of the internal cavity. Furthermore, the at least structural member and housing are co-machined to define a coaxial aperture for accepting the feature.

Abstract: A device configured to determine the location and magnitude of a touch on a surface of the device. The device includes a transparent touch sensor that is configured to detect a location of a touch on the transparent touch sensor. The device also includes a force-sensing structure disposed at the periphery of the transparent touch sensor. The force sensor includes an upper capacitive plate and a compressible element disposed on one side of the upper capacitive plate. The force sensor also includes a lower capacitive plate disposed on a side of the compressible element that is opposite the upper capacitive plate.

Abstract: The described embodiments relate to embedding a threaded insert into a thin-walled housing. A recess can be formed with a machining tool that forms a recess in a thickened portion of the thin-walled housing. In some embodiments, the recess can be formed along one of the walls of the thin-walled housing in a location having highly a constrained amounts of space available. Once the recess is formed a threaded insert can be pressed into the recess. An interference fit can be utilized to lodge the press-nut securely within the recess. Alternatively, a retaining member can be positioned across a front portion of the recess to trap the threaded insert between the retaining member and a rear surface of the recess.

Abstract: Switch assemblies that mitigate stack up variations and methods of making the same are provided. The stack up variations are mitigated by embodiments that use a floating switch design. The floating switch design may eliminate height variations in the stack up by directly mounting an activation assembly to a support bracket. This ensures that the stack up height of the activation assembly and support bracket remain fixed, independent of a flexible printed circuit board (PCB) that may also be secured to the activation assembly. This way, regardless of the thickness of the flexible PCB and any height variations in solder used to secure the flexible PCB to the activation assembly, the stack up height of the activation assembly and support bracket remains fixed.

Abstract: The described embodiments relate generally to improvements to injection molding equipment. More specifically, concepts for reducing sink and improving cosmetics of portions of injection molded parts in close proximity to gate areas of an injection mold are disclosed. A cold runner system is described in which molding material disposed in a mold cavity is separated from excess molding material in the runner system shortly after the mold is filled at a predetermined packing pressure.

Abstract: Switch assemblies that mitigate stack up variations and methods of making the same are provided. The stack up variations are mitigated by embodiments that use a floating switch design. The floating switch design may eliminate height variations in the stack up by directly mounting an activation assembly to a support bracket. This ensures that the stack up height of the activation assembly and support bracket remain fixed, independent of a flexible printed circuit board (PCB) that may also be secured to the activation assembly. This way, regardless of the thickness of the flexible PCB and any height variations in solder used to secure the flexible PCB to the activation assembly, the stack up height of the activation assembly and support bracket remains fixed.

Abstract: A method of using ultrasonic energy to secure a first and a second component is described, and an apparatus formed therefrom. A first layer is bonded to a second layer by converting ultrasonic energy into thermal energy. The energy conversions means is an energy director. A thermally sensitive layer receives the thermal energy and at least a portion of the thermally sensitive layer melts. The resultant melting bonds the first layer with the second layer. A different energy director may also be included and used to convert thermal energy in order to de-bond the first layer from the second layer in order to perform, for example, a rework.

Abstract: An electrostatic discharge (ESD) blocking component is set forth for a computing device. The computing device can include a housing formed of non-conducting material and an overlaying display assembly supported by the housing. The display assembly can further include a plurality of display elements such as thin film transistors (TFTs) interconnected by corresponding metallic traces. The ESD block is used to block static charges associated with an ESD event so that essentially no ESD event related static charge is accumulated on the metallic traces thereby preventing ESD related damage to the plurality of TFTs.

Abstract: An electronic device may have electrical components that generate heat. The components may be mounted on a printed circuit board having a peripheral edge with an edge surface. The edge surface may be coated with a layer of metal. Metal traces in the printed circuit board such as ground plane traces may be used to conduct heat from the electrical components to the layer of metal on the edge surface. The edge surface may be separated from an adjacent thermally conductive electronic device housing structure by an air gap. Thermally conductive elastomeric bumper structures may bridge the air gap between the edge surface of the printed circuit and the housing structure. The thermally conductive elastomeric bumper structures may conduct heat from the layer of metal on the edge surface to the housing structure and may serve as a cushioning interface between the printed circuit and the housing structure.

Abstract: A housing for a personal electronic device is described herein. The housing may include at least structural member configured to be arranged within an internal cavity of the housing. The at least structural member is aligned with a feature external to the housing. The at least one structural member is affixed to an interior surface of the internal cavity. Furthermore, the at least structural member and housing are co-machined to define a coaxial aperture for accepting the feature.

Abstract: A housing for a personal electronic device is described herein. The housing may include at least one modular subassembly configured to be arranged within an internal cavity of the housing. The at least one modular subassembly is aligned with a feature external to the housing, is affixed to an interior surface of the internal cavity, and is configured to function both as an antenna and as an internal support member of the housing.

Abstract: The described embodiments relate generally to improvements to injection molding equipment. More specifically, concepts for reducing sink and improving cosmetics of portions of injection molded parts in close proximity to gate areas of an injection mold are disclosed. A cold runner system is described in which molding material disposed in a mold cavity is separated from excess molding material in the runner system shortly after the mold is filled at a predetermined packing pressure.

Abstract: Electromechanical slide switches are provided. The electromechanical slide switches can include conductive components that are configured to change position relative to one another in response to a mechanical input. The electromechanical slide switch can include a number of cooperating intrusion barriers that combine to prevent intrusion of external agents, such as water or dust.

Abstract: A battery may have a foil battery pack with leads that are coupled to a printed circuit board. Battery protection structures formed from an insulating material such as plastic may be used to protect the foil battery pack. The foil battery pack may have a rectangular shape with front and rear faces surrounded by a rectangular peripheral edge. The battery protection structures may have a ring shape that surrounds the peripheral edge while leaving the front and rear faces exposed to minimize the size of the battery protection structures. An elastomeric material may be used to form the battery protection structures. The elastomeric material may allow the battery protection structures to stretch when the battery pack expands during use. Two shots of plastic may be incorporated into the battery protection structures to provide both puncture resistance and the ability to stretch during use.

Abstract: Switch assemblies that mitigate stack up variations and methods of making the same are provided. The stack up variations are mitigated by embodiments that use a floating switch design. The floating switch design may eliminate height variations in the stack up by directly mounting an activation assembly to a support bracket. This ensures that the stack up height of the activation assembly and support bracket remain fixed, independent of a flexible printed circuit board (PCB) that may also be secured to the activation assembly. This way, regardless of the thickness of the flexible PCB and any height variations in solder used to secure the flexible PCB to the activation assembly, the stack up height of the activation assembly and support bracket remains fixed.

Abstract: Electronic devices are provided with ejectable component assemblies. Each ejectable component assembly may include a tray that can be loaded with one or more types of removable module, such as a mini-SIM card and a micro-SIM card, and inserted into the device. Each assembly may also include a cover coupled to a circuit board. The tray may be inserted through an opening in the electronic device and into a space between the cover and the circuit board. A portion of the space is contained within the pocket. A portion of the tray may be contained within the pocket when the tray is inserted into the device for holding the module at a functional insertion position within the device.

Abstract: Electromechanical slide switches are provided. The electromechanical slide switches can include conductive components that are configured to change position relative to one another in response to a mechanical input.

Abstract: An electronic device may have electrical components that generate heat. The components may be mounted on a printed circuit board having a peripheral edge with an edge surface. The edge surface may be coated with a layer of metal. Metal traces in the printed circuit board such as ground plane traces may be used to conduct heat from the electrical components to the layer of metal on the edge surface. The edge surface may be separated from an adjacent thermally conductive electronic device housing structure by an air gap. Thermally conductive elastomeric bumper structures may bridge the air gap between the edge surface of the printed circuit and the housing structure. The thermally conductive elastomeric bumper structures may conduct heat from the layer of metal on the edge surface to the housing structure and may serve as a cushioning interface between the printed circuit and the housing structure.

Abstract: A manufacturing method is provided. A first component with a first mating surface is provided. A second component defining a second mating surface with a profile configured to match the first mating surface may be formed from a material by contacting the material with the first mating surface of the first component. The first component and the second component may be assembled into an assembly by engaging the first mating surface of the first component with the second mating surface of the second component. Assembling the assembly may be conducted simultaneously with forming the second component, or thereafter. Further, the method may include decoupling the first mating surface of the first component from the second mating surface of the second component. Thereby, for example, the components may move relative to one another, or the components may be separated and assembled together at a later time.

Abstract: A battery may have a foil battery pack with leads that are coupled to a printed circuit board. Battery protection structures formed from an insulating material such as plastic may be used to protect the foil battery pack. The foil battery pack may have a rectangular shape with front and rear faces surrounded by a rectangular peripheral edge. The battery protection structures may have a ring shape that surrounds the peripheral edge while leaving the front and rear faces exposed to minimize the size of the battery protection structures. An elastomeric material may be used to form the battery protection structures. The elastomeric material may allow the battery protection structures to stretch when the battery pack expands during use. Two shots of plastic may be incorporated into the battery protection structures to provide both puncture resistance and the ability to stretch during use.