Patents by Inventor Miguel Falagan

Miguel Falagan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7848727
    Abstract: A radio frequency (RF) module includes a multilayer substrate having dielectric layers and metallization layers that include one or more circuit elements. The metallization layers are located between the dielectric layers. The RF module also includes a symmetric transmission input associated with the multilayer substrate, an RF element on the multilayer substrate to provide RF functionality, and a balun integrated in the substrate behind the symmetric transmission input.
    Type: Grant
    Filed: July 6, 2005
    Date of Patent: December 7, 2010
    Assignee: Epcos AG
    Inventors: Christian Block, Miguel Falagan, Isabel Gavela, Holger Fluhr
  • Patent number: 7741913
    Abstract: An electrical component includes an amplifier that includes an output stage, and a power-supply path for powering the output stage. The power supply path includes a line that includes conductor track sections in parallel. The electrical component also includes a carrier substrate containing the amplifier and the line with the conductor tracks.
    Type: Grant
    Filed: May 10, 2006
    Date of Patent: June 22, 2010
    Assignee: EPCOS AG
    Inventors: Christian Block, Miguel Falagan, Holger Flühr
  • Publication number: 20090039965
    Abstract: An electrical component includes an amplifier that includes an output stage, and a power-supply path for powering the output stage. The power supply path includes a line that includes conductor track sections in parallel. The electrical component also includes a carrier substrate containing the amplifier and the line with the conductor tracks.
    Type: Application
    Filed: May 10, 2006
    Publication date: February 12, 2009
    Applicant: EPCOS AG
    Inventors: Christian Block, Miguel Falagan, Holger Fluhr
  • Publication number: 20060058000
    Abstract: A radio frequency (RF) module includes a multilayer substrate having dielectric layers and metallization layers that include one or more circuit elements. The metallization layers are located between the dielectric layers. The RF module also includes a symmetric transmission input associated with the multilayer substrate, an RF element on the multilayer substrate to provide RF functionality, and a balun integrated in the substrate behind the symmetric transmission input.
    Type: Application
    Filed: July 6, 2005
    Publication date: March 16, 2006
    Inventors: Christian Block, Miguel Falagan, Isabel Gavela, Holger Fluhr