Abstract: Automated interfaces with interactive keywords between employment postings and candidate profiles are disclosed. An example system includes a profile database and one or more processors. The one or more processors are configured to identify one or more posting keywords by parsing extracted text of an employment posting, retrieve one or more posting search-terms from a search-term database based on the one or more posting keywords, and generate a list of candidates based on one or more candidate profiles retrieved from the profile database. Further, the one or more processors are configured to present, to the recruiter, an interface that includes a posting section and a candidate section adjacent to the posting section. Further, the one or more processors are configured to typographically emphasize the posting keywords that are associated with the posting search-terms to indicate relationships between the employment posting and the list of candidates.

Abstract: Automated interfaces with interactive keywords between employment postings and candidate profiles are disclosed. An example system includes a profile database and one or more processors. The one or more processors are configured to identify one or more posting keywords by parsing extracted text of an employment posting, retrieve one or more posting search-terms from a search-term database based on the one or more posting keywords, and generate a list of candidates based on one or more candidate profiles retrieved from the profile database. Further, the one or more processors are configured to present, to the recruiter, an interface that includes a posting section and a candidate section adjacent to the posting section. Further, the one or more processors are configured to typographically emphasize the posting keywords that are associated with the posting search-terms to indicate relationships between the employment posting and the list of candidates.

Abstract: Automated interfaces with interactive keywords between employment postings and candidate profiles are disclosed. An example system includes a profile database and one or more processors. The one or more processors are configured to identify one or more posting keywords by parsing extracted text of an employment posting, retrieve one or more posting search-terms from a search-term database based on the one or more posting keywords, and generate a list of candidates based on one or more candidate profiles retrieved from the profile database. Further, the one or more processors are configured to present, to the recruiter, an interface that includes a posting section and a candidate section adjacent to the posting section. Further, the one or more processors are configured to typographically emphasize the posting keywords that are associated with the posting search-terms to indicate relationships between the employment posting and the list of candidates.

Abstract: A new method to form shielded vias with microstrip ground plane in the manufacture of an integrated circuit device is achieved. The method comprises, first, providing a substrate. The substrate is etched through to form holes for planned shielded vias with microstrip ground plane. A first dielectric layer is formed overlying the top side of the substrate and lining the holes. A first conductive layer is deposited overlying the first dielectric layer and lining the holes. A second dielectric layer is deposited overlying the first conductive layer and lining the holes. A second conductive layer is deposited overlying the second dielectric layer and filling the holes. The second conductive layer is planarized to confine the second conductive layer to the holes and to thereby complete the shielded vias with microstrip ground plane. Silicon carrier modules and stacked, multiple integrated circuit modules are formed using shielded vias with microstrip ground plane to improve RF performance.

Abstract: A compliant interposer sheet probe card and a method for testing a wafer or a wafer level package using the probe card are described. Test electronic circuits are connected on one side of a multi-layer substrate. A top side of a compliant interposer sheet is connected to an opposite side of the multi-layer substrate. A wafer or a wafer level package to be tested is contacted with pins on a bottom side of the compliant interposer sheet whereby the wafer or wafer level package can be tested.

Abstract: The electronic device (100) comprises a semiconductor element (1) (e.g. a transistor), an encapsulation (5) and an electrically conductive layer (3) with a first and a second contact pad (11,12), used as signal pads, and a third contact pad (13) used as ground pads. Due to the shape of the contact pads (11,12,13), the spacing (200) is continuous, with a small entrance in between of the first and second contact pads (11,12). Consequently, the parasitic inductance is reduced and the device (100) is suitable for use at frequencies below and above 30 GHz, particularly up to 40 GHz.

Abstract: A wafer level package formed on an integrated circuit chip having bondpads and a fabrication method therefor is disclosed. The wafer level package comprises at least one first, second and third separation layer having at least one first and second conductive layer formed in-between the separation layers. The at least one first conductive layer is formed on the at least one first separation layer and is coupled to the bondpads. The at least one second conductive layer is formed on the at last one second separation layer wherein the at least one second conductive layer is electrically coupled to the at least one first conductive layer. The at least one third separation layer allows solder to be attached to the at least one second conductive layer for electrically coupling the solder to the bondpads. A chip ground plane is laid in the integrated circuit chip for providing a ground to the at least one first conductive layer and the solder.

Abstract: A new method to form shielded vias with microstrip ground plane in the manufacture of an integrated circuit device is achieved. The method comprises, first, providing a substrate. The substrate is etched through to form holes for planned shielded vias with microstrip ground plane. A first dielectric layer is formed overlying the top side of the substrate and lining the holes. A first conductive layer is deposited overlying the first dielectric layer and lining the holes. A second dielectric layer is deposited overlying the first conductive layer and lining the holes. A second conductive layer is deposited overlying the second dielectric layer and filling the holes. The second conductive layer is planarized to confine the second conductive layer to the holes and to thereby complete the shielded vias with microstrip ground plane. Silicon carrier modules and stacked, multiple integrated circuit modules are formed using shielded vias with microstrip ground plane to improve RF performance.