Patents by Inventor Mika IKEMURA

Mika IKEMURA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11319462
    Abstract: The pressure sensitive adhesive sheet is a sheet shaped pressure sensitive adhesive including an acryl-based base polymer. The acryl-based base polymer contains an acryl-based segment and a urethane-based segment, and a content of the urethane-based segment is 3 to 30 parts by weight based on 100 parts by weight of the acryl-based segment. The urethane-based segment includes at least one urethane chain selected from the group consisting of a polyether urethane and a polyester urethane. The content of the urethane-based segment other than the polyether urethane-based segment is 15 parts by weight or less based on 100 parts by weight of the acryl-based segment.
    Type: Grant
    Filed: January 29, 2019
    Date of Patent: May 3, 2022
    Assignee: NITTO DENKO CORPORATION
    Inventors: Itsuhiro Hatanaka, Masahito Niwa, Taiki Shimokuri, Shou Takarada, Takahiro Nonaka, Keisuke Hirano, Fumika Kawatake, Mika Ikemura
  • Patent number: 11319470
    Abstract: A pressure sensitive adhesive includes an acryl-based base polymer. The acryl-based base polymer contains an acryl-based segment and a urethane-based segment. In the acryl-based base polymer, the content of the urethane-based segment is 3 to 20 parts by weight based on 100 parts by weight of the acryl-based segment. A pressure sensitive adhesive sheet can be obtained by applying a pressure sensitive adhesive composition on a substrate in a layer form. The pressure sensitive adhesive composition may be curable and may include a polymerization initiator. In formation of the pressure sensitive adhesive sheet, the curable pressure sensitive adhesive composition may be, as necessary.
    Type: Grant
    Filed: January 29, 2019
    Date of Patent: May 3, 2022
    Assignee: NITTO DENKO CORPORATION
    Inventors: Masahito Niwa, Itsuhiro Hatanaka, Taiki Shimokuri, Shou Takarada, Takahiro Nonaka, Keisuke Hirano, Fumika Kawatake, Mika Ikemura
  • Publication number: 20190233683
    Abstract: The pressure sensitive adhesive sheet is a sheet shaped pressure sensitive adhesive including an acryl-based base polymer. The acryl-based base polymer contains an acryl-based segment and a urethane-based segment, and a content of the urethane-based segment is 3 to 30 parts by weight based on 100 parts by weight of the acryl-based segment. The urethane-based segment includes at least one urethane chain selected from the group consisting of a polyether urethane and a polyester urethane. The content of the urethane-based segment other than the polyether urethane-based segment is 15 parts by weight or less based on 100 parts by weight of the acryl-based segment.
    Type: Application
    Filed: January 29, 2019
    Publication date: August 1, 2019
    Applicant: NITTO DENKO CORPORATION
    Inventors: Itsuhiro HATANAKA, Masahito NIWA, Taiki SHIMOKURI, Shou TAKARADA, Takahiro NONAKA, Keisuke HIRANO, Fumika KAWATAKE, Mika IKEMURA
  • Publication number: 20190233681
    Abstract: A pressure sensitive adhesive includes an acryl-based base polymer. The acryl-based base polymer contains an acryl-based segment and a urethane-based segment. In the acryl-based base polymer, the content of the urethane-based segment is 3 to 20 parts by weight based on 100 parts by weight of the acryl-based segment. A pressure sensitive adhesive sheet can be obtained by applying a pressure sensitive adhesive composition on a substrate in a layer form. The pressure sensitive adhesive composition may be curable and may include a polymerization initiator. In formation of the pressure sensitive adhesive sheet, the curable pressure sensitive adhesive composition may be, as necessary.
    Type: Application
    Filed: January 29, 2019
    Publication date: August 1, 2019
    Applicant: NITTO DENKO CORPORATION
    Inventors: Masahito NIWA, Itsuhiro HATANAKA, Taiki SHIMOKURI, Shou TAKARADA, Takahiro NONAKA, Keisuke HIRANO, Fumika KAWATAKE, Mika IKEMURA